| 1 |
Experimental and mathematical analysis of electroformed rotating cone electrode
Heydari H, Ahmadipouya S, Maddah AS, Rokhforouz MR
Korean Journal of Chemical Engineering, 37(4), 724, 2020 |
| 2 |
Quantitative study of mass transfer in megasonic micro electroforming based on mass transfer coefficient: Simulation and experimental validation
Zhao M, Du LQ, Du CQ, Wei ZZ, Ji XC, Bai ZP, Liu XQ
Electrochimica Acta, 297, 328, 2019 |
| 3 |
Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate
Zhao Z, Zhu PC, Yang LC, Geng YX
Journal of Adhesion Science and Technology, 33(3), 301, 2019 |
| 4 |
Control of the adhesion strength between nickel replica and copper mold by electrochemical nucleation of lead
Yang G, Li Y, Pi J, Zhu QQ, Cai JW, Huang ZJ
Journal of Applied Electrochemistry, 49(10), 1003, 2019 |
| 5 |
Electroforming-less and multi-level resistive switching characteristics in tungsten oxide thin film
Lee S, Yun KH, Kim D
Thin Solid Films, 674, 91, 2019 |
| 6 |
A comparative study on 2-Aminoethanethiol and L-Cysteine as new additives for electroforming nickel mesh
Wang SY, Xu ZG, Wang WC, Mitsuzaki N, Chen ZD
Electrochimica Acta, 282, 728, 2018 |
| 7 |
The shape evolution and application studies of electrodeposited bumps in electroforming
Gu HY, Sun H, Xiong Y, Liu G, Wang X
Journal of Applied Electrochemistry, 48(7), 819, 2018 |
| 8 |
Pt/Ta2O5/HfO2-x/Ti Resistive Switching Memory Competing with Multilevel NAND Flash
Yoon JH, Kim KM, Song SJ, Seok JY, Yoon KJ, Kwon DE, Park TH, Kwon YJ, Shao X, Hwang CS
Advanced Materials, 27(25), 3811, 2015 |
| 9 |
On the direction of the conductive filament growth in valence change memory devices during electroforming
Kalaev D, Yalon E, Riess I
Solid State Ionics, 276, 9, 2015 |
| 10 |
Replication of rose petal surfaces using a nickel electroforming process and UV nanoimprint lithography
Ryu SW, Choo S, Choi HJ, Kim CH, Lee H
Applied Surface Science, 322, 57, 2014 |
