검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages Gui DY, Ernst LJ, Jansen KMB, Yang DG, Goumans L, Bressers HJL, Janssen JHJ Journal of Applied Polymer Science, 109(3), 2016, 2008 |
| 2 |
Chemical reaction in solder joints of microelectronic packages Ho CE, Lin YL, Tsai JY, Kao CR Journal of the Chinese Institute of Chemical Engineers, 34(4), 387, 2003 |