검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
The role of water in delamination in electronic packages: degradation of interfacial adhesion Leung SYY, Lam DCC, Luo SJ, Wong CP Journal of Adhesion Science and Technology, 18(10), 1103, 2004 |
| 2 |
Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials Rimdusit S, Ishida H Rheologica Acta, 41(1-2), 1, 2002 |