| 1 |
The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive joints
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 20(1), 53, 2006 |
| 2 |
A. novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 20(1), 69, 2006 |
| 3 |
A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loading
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 20(1), 87, 2006 |
| 4 |
Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 19(8), 659, 2005 |
| 5 |
Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(7), 731, 2004 |
| 6 |
Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(8), 849, 2004 |
| 7 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(11), 1225, 2004 |
| 8 |
The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(11), 1245, 2004 |
| 9 |
Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(15-16), 1833, 2004 |
