화학공학소재연구정보센터
검색결과 : 43건
No. Article
1 유리기판 박막화를 위한 습식공정에서 식각액 성분의 영향
신영식, 이원규
Korean Chemical Engineering Research, 58(3), 474, 2020
2 Angular dependence of SiO2 etching in plasmas containing heptafluoropropyl methyl ether
Kim JH, Park JS, Kim CK
Thin Solid Films, 669, 262, 2019
3 Angular dependences of SiO2 etch rates at different bias voltages in CF4, C2F6, and C4F8 plasmas
Kim JH, Cho SW, Park CJ, Chae H, Kim CK
Thin Solid Films, 637, 43, 2017
4 Experimental investigation of photoresist etching by kHz AC atmospheric pressure plasma jet
Wang LJ, Zheng YS, Wu C, Jia SL
Applied Surface Science, 385, 191, 2016
5 산화구리 잔유물 제거를 위한 카르복시산 함유 반수계 용액의 세정특성
고천광, 이원규
Korean Chemical Engineering Research, 54(4), 548, 2016
6 Effect of reactor surface modification on the neutral gas temperature in a transformer-coupled toroidal plasma
You D, Lee YS, Lee JB, Chang HY
Current Applied Physics, 15(3), 183, 2015
7 Study of wet etching thin films of indium tin oxide in oxalic acid by monitoring the resistance
Mammana SS, Greatti A, Luiz FH, da Costa FI, Mammana AP, Calligaris GA, Cardoso LP, Mammana CIZ, den Engelsen D
Thin Solid Films, 567, 20, 2014
8 Bosch 공정에서 Si 식각속도와 식각프로파일에 대한 Ar 첨가의 영향
지정민, 조성운, 김창구
Korean Chemical Engineering Research, 51(6), 755, 2013
9 Comparison of chlorine- and fluorine-based inductively coupled plasmas for dry etching of InGaZnO4 films
Park JC, Jeong OG, Kim JK, Yun YH, Pearton SJ, Cho H
Thin Solid Films, 546, 136, 2013
10 Real-time virtual metrology and control for plasma etch
Lynn SA, MacGearailt N, Ringwood JV
Journal of Process Control, 22(4), 666, 2012