검색결과 : 48건
| No. | Article |
|---|---|
| 1 |
Design of ITO/SiO2/TiO2 distributed Bragg reflectors as a p-type electrode in GaN-based flip-chip light emitting diodes Lee GJ, Hong IY, Kim TK, Park HJ, Oh SK, Cha YJ, Park MJ, Choi KJ, Kwak JS Applied Surface Science, 477, 220, 2019 |
| 2 |
300 nm Diameter Cylinder-Shape 나노패턴 기판을 이용한 LEDs의 광학적 특성 김상묵, 김윤석 Korean Journal of Materials Research, 29(1), 59, 2019 |
| 3 |
Effects of pre-annealed ITO film on the electrical characteristics of high-reflectance Ni/Ag/Ni/Au contacts to p-type GaN Hu XL, Liu L, Wang H, Zhang XC Applied Surface Science, 357, 1703, 2015 |
| 4 |
Vacuum-based picking-up of thin chip from adhesive tape Xu ZL, Liu ZX, Huang YA, Chen JK, Liu HM, Yin ZP Journal of Adhesion Science and Technology, 29(13), 1315, 2015 |
| 5 |
Optical, spectral, and thermal characteristics of InGaN/GaN green flip-chip light-emitting diodes Lee SH, Kim DC, Kim J, Jeon SK, Yu JS Solid-State Electronics, 104, 20, 2015 |
| 6 |
Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects Sinha K, Farley D, Kahnert T, Solares SD, Dasgupta A, Caers JFJ, Zhao XJ Journal of Adhesion Science and Technology, 28(12), 1167, 2014 |
| 7 |
플립칩용 에폭시 접착제의 저온 속경화 거동에 미치는 경화제의 영향 최원정, 유세훈, 이효수, 김목순, 김준기 Korean Journal of Materials Research, 22(9), 454, 2012 |
| 8 |
Effect of Pt and Ti on Ni/Ag/(Pt or Ti)/Au p-ohmic contacts of GaN based flip-chip LEDs Song HJ, Roh CH, Choi HG, Ha MW, Hahn CK, Park JH, Lee JH Applied Surface Science, 257(18), 8102, 2011 |
| 9 |
Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection Qin Y, Wilcox GD, Liu CQ Electrochimica Acta, 56(1), 183, 2010 |
| 10 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |