검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee WS, Han IY, Yu J, Kim SJ, Byun KY Thermochimica Acta, 455(1-2), 148, 2007 |
| 2 |
Reliability of Sn-Ag-Cu flip chip package with underfill under thermal shock Noh BI, Jung SB Materials Science Forum, 510-511, 558, 2006 |
| 3 |
Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages Sham ML, Kim JK Journal of Applied Polymer Science, 96(1), 175, 2005 |