검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Advanced underfill for high thermal reliability Bae JW, Kim W, Park SW, Ha CS, Lee JK Journal of Applied Polymer Science, 83(12), 2617, 2002 |
| 2 |
Heat resistant underfill for flip-chip packaging Kim W, Bae JW Molecular Crystals and Liquid Crystals, 374, 409, 2002 |
| 3 |
Thermal characterization of an epoxy-based underfill material for flip chip packaging He Y, Moreira BE, Overson A, Nakamura SH, Bider C, Briscoe JF Thermochimica Acta, 357-358, 1, 2000 |