| 1 |
Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns
Lee W, Kim TH, Choa YH
Korean Journal of Materials Research, 26(8), 427, 2016 |
| 2 |
Gap-Fill Characteristics and Film Properties of DMDMOS Fabricated by an F-CVD System
Lee W, Fukazawa A, Choa YH
Korean Journal of Materials Research, 26(9), 455, 2016 |
| 3 |
Gap Fill Morphology Control in Liquid-phase Crystal Growth by Use of a Magnetic Field
Kato H, Ushikubo S, Yokota M, Doki N, Ogawa K, Shimizu K
KAGAKU KOGAKU RONBUNSHU, 37(4), 356, 2011 |
| 4 |
Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization
Cheng YL, Wang YL, Liu CP, Wu YL, Lo KY, Liu CW, Lan JK, Ay C, Feng MS
Materials Chemistry and Physics, 83(1), 150, 2004 |
| 5 |
Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
Cheng YL, Wang YL, Liu CW, Wu YL, Lo KY, Liu CP, Lan JK
Thin Solid Films, 398-399, 533, 2001 |
