| 1 |
The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent
Lee CC, Huang PC
Applied Surface Science, 440, 202, 2018 |
| 2 |
Microstructural Behavior and Failure Mechanisms of Organic Semicrystalline Thin Film Blends
Zhao BX, Awartani O, O'Connor B, Zikry MA
Journal of Polymer Science Part B: Polymer Physics, 54(9), 896, 2016 |
| 3 |
Numerical study on interaction of surface cracking and interfacial delamination in thermal barrier coatings under tension
Zhu W, Yang L, Guo JW, Zhou YC, Lu C
Applied Surface Science, 315, 292, 2014 |
| 4 |
Modeling the delamination of amorphous-silicon thin film anode for lithium-ion battery
Pal S, Damle SS, Patel SH, Datta MK, Kumta PN, Maiti S
Journal of Power Sources, 246, 149, 2014 |
| 5 |
New cross-linked interfacial layer on hydrocarbon membrane to improve long-term stability of polymer electrolyte fuel cells
Choo MJ, Oh KH, Park H, Park JK
Electrochimica Acta, 92, 285, 2013 |
| 6 |
The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, De Wolf I
Thin Solid Films, 519(7), 2225, 2011 |
| 7 |
Investigation of moisture diffusion in electronic packages by molecular dynamics simulation
Fan HB, Chan EKL, Wong CKY, Yuen MMF
Journal of Adhesion Science and Technology, 20(16), 1937, 2006 |
| 8 |
Assessment on anisotropic properties of particle-dispersed composites with debonded interface
Chang HJ, Nakagaki M
Materials Science Forum, 423-4, 737, 2003 |
| 9 |
Flexural reinforcement of concrete floor slabs by carbon fiber textiles
Kikukawa K, Mutoh K, Ohya H, Ohyama Y, Tanaka H, Watanabe K
Composite Interfaces, 5(5), 469, 1998 |
