검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material Shin JS, Moon HK, Kim BH, Kim KH, Lee HS, Jung SB, Kwon HC Current Applied Physics, 11(1), S283, 2011 |
| 2 |
Influence of surface morphology on the adhesion strength of epoxy-aluminum interfaces Zhang S, Panat R, Hsia KJ Journal of Adhesion Science and Technology, 17(12), 1685, 2003 |