검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
A multi-scale method to investigate delamination in electronic packages Fan HB, Wong CKY, Yuen MMF Journal of Adhesion Science and Technology, 20(10), 1061, 2006 |
| No. | Article |
|---|---|
| 1 |
A multi-scale method to investigate delamination in electronic packages Fan HB, Wong CKY, Yuen MMF Journal of Adhesion Science and Technology, 20(10), 1061, 2006 |