검색결과 : 1건
No. | Article |
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1 |
Effects of oxidizing agent and hydrodynamic condition on copper dissolution in chemical mechanical polishing electrolytes Chen JC, Lin SR, Tsai WT Applied Surface Science, 233(1-4), 80, 2004 |
No. | Article |
---|---|
1 |
Effects of oxidizing agent and hydrodynamic condition on copper dissolution in chemical mechanical polishing electrolytes Chen JC, Lin SR, Tsai WT Applied Surface Science, 233(1-4), 80, 2004 |