검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion Lee SB, Lee HS, Son CB, Kim SH, Lee JY Macromolecular Research, 28(11), 1040, 2020 |
| 2 |
Breaking the mutual restraint between low permittivity and low thermal expansion in polyimide films via a branched crosslink structure Zhou H, Lei HY, Wang JH, Qi SL, Tian GF, Wu DZ Polymer, 162, 116, 2019 |
| 3 |
Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages Yoo T, Kim K, Han P, Jang W, Han H Macromolecular Research, 23(8), 776, 2015 |
| 4 |
Transparency and High Heat Resistance of Cardo Based Poly(arylene ether)s for Flexible Plastic Substrates Kong GP, Hong BR, Kim MK, Han YK, Chun HA Macromolecular Research, 19(6), 608, 2011 |