1 |
Generation mechanism of gloss defect for high-glossy injection-molded surface Gim JS, Rhee BG Korea-Australia Rheology Journal, 32(3), 183, 2020 |
2 |
Preparation and properties of polyisobutene/organic montmorillonite hot melt pressure-sensitive adhesive (HMPSA) Peng X, Wang Y, Chen H, Ying J, Wang JK Journal of Adhesion, 95(13-14), 1134, 2019 |
3 |
Viscoelastic and adhesive properties of polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene and polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate-based HMPSA Guo PS, Danish M, Du PG, Kong ZX, Guan R Journal of Adhesion Science and Technology, 28(5), 417, 2014 |
4 |
Viscoelastic and adhesive properties of polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene and polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate-based HMPSA Guo PS, Danish M, Du PG, Kong ZX, Guan R Journal of Adhesion Science and Technology, 28(5), 417, 2014 |
5 |
Preparation and characterization of polarity-modulated SIS-based hot-melt pressure-sensitive adhesives Zhao ZF, Wang ZY, Zhang CQ Journal of Adhesion Science and Technology, 28(11), 1090, 2014 |
6 |
Fabrication of Amphiphilic Hot-Melt Pressure Sensitive Adhesives for Transdermal Drug Delivery Hua LL, Li Y, Wang Q, Hu YN, Zhao ZF Journal of Adhesion Science and Technology, 26(8-9), 1109, 2012 |
7 |
Multivariable Fuzzy Decoupling Control of the Polymer Electromagnetism Dynamic Extrusion Process Wen SP, Jiang J, Qu JP, Jin G Journal of Applied Polymer Science, 116(1), 568, 2010 |
8 |
Cross-linking of hot-melt-processible acrylic pressure-sensitive adhesives using acid/base interaction Everaerts A, Zieminski K, Nguyen L, Malmer J Journal of Adhesion, 82(4), 375, 2006 |
9 |
Rheology and adherence of pressure-sensitive adhesives Marin G, Derail C Journal of Adhesion, 82(5), 469, 2006 |
10 |
Tack and fracture energy of tackified SIS (styrene-isoprene-styrene)-based hot-melt pressure sensitive adhesives (HMPSAs) Kim DJ, Kim HJ, Yoon GH Journal of Adhesion Science and Technology, 20(12), 1367, 2006 |