화학공학소재연구정보센터
검색결과 : 13건
No. Article
1 Generation mechanism of gloss defect for high-glossy injection-molded surface
Gim JS, Rhee BG
Korea-Australia Rheology Journal, 32(3), 183, 2020
2 Preparation and properties of polyisobutene/organic montmorillonite hot melt pressure-sensitive adhesive (HMPSA)
Peng X, Wang Y, Chen H, Ying J, Wang JK
Journal of Adhesion, 95(13-14), 1134, 2019
3 Viscoelastic and adhesive properties of polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene and polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate-based HMPSA
Guo PS, Danish M, Du PG, Kong ZX, Guan R
Journal of Adhesion Science and Technology, 28(5), 417, 2014
4 Viscoelastic and adhesive properties of polystyrene-hydrogenated (3,4-polyisoprene and 1,4-polyisoprene)-polystyrene and polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate-based HMPSA
Guo PS, Danish M, Du PG, Kong ZX, Guan R
Journal of Adhesion Science and Technology, 28(5), 417, 2014
5 Preparation and characterization of polarity-modulated SIS-based hot-melt pressure-sensitive adhesives
Zhao ZF, Wang ZY, Zhang CQ
Journal of Adhesion Science and Technology, 28(11), 1090, 2014
6 Fabrication of Amphiphilic Hot-Melt Pressure Sensitive Adhesives for Transdermal Drug Delivery
Hua LL, Li Y, Wang Q, Hu YN, Zhao ZF
Journal of Adhesion Science and Technology, 26(8-9), 1109, 2012
7 Multivariable Fuzzy Decoupling Control of the Polymer Electromagnetism Dynamic Extrusion Process
Wen SP, Jiang J, Qu JP, Jin G
Journal of Applied Polymer Science, 116(1), 568, 2010
8 Cross-linking of hot-melt-processible acrylic pressure-sensitive adhesives using acid/base interaction
Everaerts A, Zieminski K, Nguyen L, Malmer J
Journal of Adhesion, 82(4), 375, 2006
9 Rheology and adherence of pressure-sensitive adhesives
Marin G, Derail C
Journal of Adhesion, 82(5), 469, 2006
10 Tack and fracture energy of tackified SIS (styrene-isoprene-styrene)-based hot-melt pressure sensitive adhesives (HMPSAs)
Kim DJ, Kim HJ, Yoon GH
Journal of Adhesion Science and Technology, 20(12), 1367, 2006