| 1 |
Interfacial micromechanics of carbon fiber-reinforced polyphenylene sulfide composites
Liu BY, Wang XJ, Long SR, Yang J
Composite Interfaces, 21(4), 359, 2014 |
| 2 |
Interfacial Adhesion of Polyamide 66 Fibres to an Aqueous Polyurethane-Acrylic Hybrid Polymer Adhesive
Liu Z, Jones FR, Zhai Z, Feng LJ
Journal of Adhesion, 90(4), 310, 2014 |
| 3 |
Improving the adhesion between a aqueous PU and a polyamide fibre with silane
Liu Z, Jones FR, Liu S, Feng LJ
Composite Interfaces, 20(8), 529, 2013 |
| 4 |
A Fluoropolymer Coating on Carbon Fibers Improves Their Adhesive Interaction with PTFE Matrix
Shelestova VA, Grakovich PN, Zhandarov SF
Composite Interfaces, 18(5), 419, 2011 |
| 5 |
Increase in the molecular component of the adhesive pressure in polymer composites induced by electric charge
Zhandarov S, Mader E
Composite Interfaces, 13(8-9), 865, 2006 |
| 6 |
Weibull analysis of microbond shear strength at sisal fibre-polyester resin interfaces
Towo AN, Ansell MP, Pastor ML, Packham DE
Composite Interfaces, 12(1-2), 77, 2005 |
| 7 |
Is there any contradiction between the stress and energy failure criteria in micromechanical tests? - Part III. Experimental observation of crack propagation in the microbond test
Zhandarov S, Pisanova E, Mader E
Journal of Adhesion Science and Technology, 19(8), 679, 2005 |
| 8 |
Peak force as function of the embedded length in pull-out and microbond tests: effect of specimen geometry
Zhandarov S, Mader E
Journal of Adhesion Science and Technology, 19(10), 817, 2005 |
| 9 |
Indirect estimation of fiber/polymer bond strength and interfacial friction from maximum load values recorded in the microbond and pull-out tests. Part II: Critical energy release rate
Zhandarov S, Mader E
Journal of Adhesion Science and Technology, 17(7), 967, 2003 |
| 10 |
Indirect estimation of fiber/polymer bond strength and interfacial friction from maximum load values recorded in the microbond and pull-out tests. Part 1: local bond strength
Zhandarov SF, Mader E, Yurkevich OR
Journal of Adhesion Science and Technology, 16(9), 1171, 2002 |
