검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Interfacial microstructure and joint strength of Sn-Ag and Sn-Ag-Cu lead free solders reflowed on Cu/Ni-P/Au metallization Hirose A, Hiramori T, Ito M, Tanii Y, Kobayashi KF Materials Science Forum, 512, 355, 2006 |
| No. | Article |
|---|---|
| 1 |
Interfacial microstructure and joint strength of Sn-Ag and Sn-Ag-Cu lead free solders reflowed on Cu/Ni-P/Au metallization Hirose A, Hiramori T, Ito M, Tanii Y, Kobayashi KF Materials Science Forum, 512, 355, 2006 |