검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Multiplexing frequency mode study of packaging epoxy molding compounds using dynamic mechanical analysis Tsang CF, Hui HK Thermochimica Acta, 367-368, 93, 2001 |
| No. | Article |
|---|---|
| 1 |
Multiplexing frequency mode study of packaging epoxy molding compounds using dynamic mechanical analysis Tsang CF, Hui HK Thermochimica Acta, 367-368, 93, 2001 |