검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Balancing of plating solution in CuCN electroplating process Hong IK, Park JW, Lee SB Journal of Industrial and Engineering Chemistry, 20(5), 3068, 2014 |
| 2 |
Patterned copper plating layer thickness made uniform by placement of auxiliary grid electrode about ball grid arrays Okubo T, Kodera T, Kondo K Chemical Engineering Communications, 193(12), 1503, 2006 |