1 |
Fabrication of Si and Ge nanoarrays through graphoepitaxial directed hardmask block copolymer self-assembly Gangnaik AS, Ghoshal T, Georgiev YM, Morris MA, Holmes JD Journal of Colloid and Interface Science, 531, 533, 2018 |
2 |
Nanosecond laser nanostructuring of fused silica surfaces assisted by a chromium triangle template Lorenz P, Gruner C, Frost F, Ehrhardt M, Zimmer K Applied Surface Science, 418, 481, 2017 |
3 |
Non-chemically amplified resists containing polyhedral oligomeric silsesquioxane for a bilayer resist system Woo SA, Choi SY, Kim JB Polymer, 98, 336, 2016 |
4 |
Atomic layer deposition assisted pattern transfer technology for ultra-thin block copolymer films Chen WH, Luo J, Meng LK, Li JJ, Xiang JJ, Li JF, Wang WW, Chen DP, Ye TC, Zhao C Thin Solid Films, 613, 32, 2016 |
5 |
Soft Graphoepitaxy for Large Area Directed Self-Assembly of Polystyrene-block-Poly(dimethylsiloxane) Block Copolymer on Nanopatterned POSS Substrates Fabricated by Nanoimprint Lithography Borah D, Rasappa S, Salaun M, Zellsman M, Lorret O, Liontos G, Ntetsikas K, Avgeropoulos A, Morris MA Advanced Functional Materials, 25(22), 3425, 2015 |
6 |
Solvent Vapor Annealing of Block Copolymers in Confined Topographies: Commensurability Considerations for Nanolithography Cummins C, Kelly RA, Gangnaik A, Georgiev YM, Petkov N, Holmes JD, Morris MA Macromolecular Rapid Communications, 36(8), 762, 2015 |
7 |
Nickel electrodeposition using EnFACE Widayatno T, Roy S Journal of Applied Electrochemistry, 44(7), 807, 2014 |
8 |
Fabrication of an ultra-thin silicon solar cell and nano-scale honeycomb structure by thermal-stress-induced pattern transfer method Du CH, Wang TY, Chen CH, AndrewYeh J Thin Solid Films, 557, 372, 2014 |
9 |
Direct-Write Thermocapillary Dewetting of Polymer Thin Films by a Laser-Induced Thermal Gradient Singer JP, Lin PT, Kooi SE, Kimerling LC, Michel J, Thomas EL Advanced Materials, 25(42), 6100, 2013 |
10 |
High Density and Large Area Arrays of Silicon Oxide Pillars with Tunable Domain Size for Mask Etch Applications Gu XD, Dorsey P, Russell TP Advanced Materials, 24(40), 5505, 2012 |