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| No. | Article |
|---|---|
| 1 |
Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux (TM) 81) for high density interconnect applications Dunne RC, Sitaraman SK, Luo SJ, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M Journal of Applied Polymer Science, 78(2), 430, 2000 |