화학공학소재연구정보센터
검색결과 : 21건
No. Article
1 An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization
Sampurno Y, Rice A, Zhuang Y, Philipossian A
Electrochemical and Solid State Letters, 14(8), H318, 2011
2 Measurement of Microscale Shear Forces during Chemical Mechanical Planarization
White RD, Mueller AJ, Shin M, Gauthier D, Manno VP, Rogers CB
Journal of the Electrochemical Society, 158(10), H1041, 2011
3 Slurry-Induced Pad Wear Rate in Chemical Mechanical Planarization
Meled A, Sampurno Y, Zhuang Y, Philipossiana A
Electrochemical and Solid State Letters, 13(3), H52, 2010
4 Ceria CMP Slurry for the Construction of Floating Gates in MLC NAND Flash Memory below 51 nm
Kim YH, Kim JW, Kim SK, Paik U
Electrochemical and Solid State Letters, 13(10), H339, 2010
5 Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization
Choi JG, Prasad YN, Kim IK, Kim IG, Kim WJ, Busnaina AA, Park JG
Journal of the Electrochemical Society, 157(2), H186, 2010
6 Study of Polishing Characteristics of Monodisperse Ceria Abrasive in Chemical Mechanical Planarization
Yang JC, Kim HJ, Kim T
Journal of the Electrochemical Society, 157(3), H235, 2010
7 Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process
Meled A, Zhuang Y, Wei X, Cheng J, Sampurno YA, Borucki L, Moinpour M, Hooper D, Philipossian A
Journal of the Electrochemical Society, 157(3), H250, 2010
8 Effects of Surface Forces on Material Removal Rate in Chemical Mechanical Planarization
Bozkaya D, Muftu S
Journal of the Electrochemical Society, 157(3), H287, 2010
9 1H-Benzotriazole Incorporated Pad for Chemical Mechanical Planarization of Copper
Yu JF, Jia DM, Venkataraman SS, Li YZ
Journal of the Electrochemical Society, 157(3), H312, 2010
10 Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization
Matsui Y, Eda H, Seta S, Ono T, Tateyama Y, Nishioka T, Yano H, Masuko M
Journal of the Electrochemical Society, 157(5), H510, 2010