검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Cure properties of alkoxysilylated epoxy resin systems with hardeners for semiconductor packaging materials Kim WG, Chun H Molecular Crystals and Liquid Crystals, 636(1), 107, 2016 |
| 2 |
Features of new laser micro-via organic substrate for semiconductor package Tsukada Y, Yamanaka K, Kodama Y, Kobayashi K Electrochimica Acta, 48(20-22), 2997, 2003 |