검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning Kim NH, Ko PJ, Choi GW, Seo YJ, Lee WS Thin Solid Films, 504(1-2), 166, 2006 |
| No. | Article |
|---|---|
| 1 |
Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning Kim NH, Ko PJ, Choi GW, Seo YJ, Lee WS Thin Solid Films, 504(1-2), 166, 2006 |