검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Fast scanning calorimetric measurements and microstructure observation of rapid solidified Sn3.5Ag solder droplets Zhao BG, Zhao J, Zhang WP, Yang B, Zhai QJ, Schick C, Gao YL Thermochimica Acta, 565, 194, 2013 |
| 2 |
Microstructure of solder joint interconnect in used mobile phone Shahdan SN, Jalar A, Hamid MAA Materials Science Forum, 517, 123, 2006 |