검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Structure-dependent behavior of stress-induced voiding in Cu interconnects Wu ZY, Yang YT, Chai CC, Li YJ, Wang JY, Li B, Liu J Thin Solid Films, 518(14), 3778, 2010 |
| 2 |
The influence of temperature and dielectric materials on stress induced voiding in Cu dual damascene interconnects Gan ZG, Shao W, Mhaisalkar SG, Chen Z, Li HY Thin Solid Films, 504(1-2), 161, 2006 |
| 3 |
The effect of line width on stress-induced voiding in Cu dual damascene interconnects Shao W, Gan ZH, Mhaisalkar SG, Chen Z, Li HY Thin Solid Films, 504(1-2), 298, 2006 |