| 1 |
Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process
Zhang LX, Chen P, An T, Dai YW, Qin F
Current Applied Physics, 19(5), 570, 2019 |
| 2 |
Oxygen plasma etching of fused silica substrates for high power laser optics
Abromavicius G, Juodagalvis T, Buzelis R, Juskevicius K, Drazdys R, Kicas S
Applied Surface Science, 453, 477, 2018 |
| 3 |
Evaluation of subsurface damage inherent to polished GaN substrates using depth-resolved cathodoluminescence spectroscopy
Lee J, Kim JC, Kim J, Singh RK, Arjunan AC, Lee H
Thin Solid Films, 660, 516, 2018 |
| 4 |
A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation
Dai HF, Chen GY, Zhou C, Fang QH, Fei XJ
Applied Surface Science, 393, 405, 2017 |
| 5 |
Influence of Si wafer thinning processes on (sub)surface defects
Inoue F, Jourdain A, Peng L, Phommahaxay A, De Vos J, Rebibis KJ, Miller A, Sleeckx E, Beyne E, Uedono A
Applied Surface Science, 404, 82, 2017 |
| 6 |
Picosecond laser texturization of mc-silicon for photovoltaics: A comparison between 1064 nm, 532 nm and 355 nm radiation wavelengths
Binetti S, Le Donne A, Rolfi A, Jaggi B, Neuenschwander B, Busto C, Frigeri C, Scorticati D, Longoni L, Pellegrino S
Applied Surface Science, 371, 196, 2016 |
| 7 |
Modeling study on the surface morphology evolution during removing the optics surface/subsurface damage using atmospheric pressure plasma processing
Xin Q, Su X, Wang B
Applied Surface Science, 382, 260, 2016 |
| 8 |
Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations
Li J, Fang QH, Zhang LC, Liu YW
Applied Surface Science, 324, 464, 2015 |
| 9 |
Subsurface mechanical damage during bound abrasive grinding of fused silica glass
Blaineau P, Andre D, Laheurte R, Darnis P, Darbois N, Cahuc O, Neauport J
Applied Surface Science, 353, 764, 2015 |
| 10 |
Optimum inductively coupled plasma etching of fused silica to remove subsurface damage layer
Jiang XL, Liu Y, Liu ZK, Qiu KQ, Xu XD, Hong YL, Fu SJ
Applied Surface Science, 355, 1180, 2015 |
