1 |
Hysteresis loops of fiber-reinforced ceramic-matrix composites under in-phase/out-of-phase thermomechanical and isothermal cyclic loading Li LB Composite Interfaces, 25(10), 855, 2018 |
2 |
Experimental study of the stacking sequence effect on polymer/composite multi-layers submitted to thermomechanical cyclic loadings Bertin M, Touchard F, Lafarie-Frenot MC International Journal of Hydrogen Energy, 35(20), 11397, 2010 |
3 |
The role of special boundaries during solidification and microstructure evolution in lead free solder joints Telang AU, Bieler TR Materials Science Forum, 495-497, 1419, 2005 |
4 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints Wu PL, Huang MK, Lee C, Tzan SR Journal of the Chinese Institute of Chemical Engineers, 35(5), 571, 2004 |
5 |
Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn-Pb interfaces Huang MK, Wu PL, Lee C Materials Chemistry and Physics, 85(1), 63, 2004 |
6 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test Wu PL, Huang MK, Lee C, Tzan SR Materials Chemistry and Physics, 87(2-3), 285, 2004 |