화학공학소재연구정보센터
검색결과 : 3건
No. Article
1 Electrodeposition of copper into trenches from a citrate plating bath
Lizama-Tzec FI, Canche-Canul L, Oskam G
Electrochimica Acta, 56(25), 9391, 2011
2 Growth kinetics of copper chemical vapor deposition and trench filling without a seed layer
Tze JJ, Tsai DS
Journal of the Chinese Institute of Chemical Engineers, 37(2), 177, 2006
3 A new process to improve the performance of 850 nm wavelength GaAsVCSELs
Jiang WJ, Chen LC, Wu MC, Yu HC, Yang HP, Sung CP, Chi JY, Huang CY, Wu YT
Solid-State Electronics, 46(12), 2287, 2002