| 1 |
A molecular dynamics study on thermal and rheological properties of BNNS-epoxy nanocomposites
Liu Z, Li JH, Zhou C, Zhu WH
International Journal of Heat and Mass Transfer, 126, 353, 2018 |
| 2 |
Moisture absorption and hygroscopic swelling behavior of an underfill material
He Y
Thermochimica Acta, 546, 143, 2012 |
| 3 |
Ball Grid Array 보드 어셈블리의 동적굽힘 신뢰성에 미치는 언더필의 영향
장재원, 방정환, 유세훈, 김목순, 김준기
Korean Journal of Materials Research, 21(12), 650, 2011 |
| 4 |
Thermally Degradable Maleimides for Reworkable Adhesives
Zhang XN, Chen GC, Collins A, Jacobson S, Morganelli P, Dar YL, Musa OM
Journal of Polymer Science Part A: Polymer Chemistry, 47(4), 1073, 2009 |
| 5 |
Effect of structural changes of silica filler on the coefficient of thermal expansion (CTE) of underfill encapsulant
Palaniandy S, Azizli KAM, Jaafar M, Ahmad FN, Hussin H, Hashim SFS
Powder Technology, 185(1), 54, 2008 |
| 6 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
Lee WS, Han IY, Yu J, Kim SJ, Byun KY
Thermochimica Acta, 455(1-2), 148, 2007 |
| 7 |
Reliability of Sn-Ag-Cu flip chip package with underfill under thermal shock
Noh BI, Jung SB
Materials Science Forum, 510-511, 558, 2006 |
| 8 |
Study on mono-dispersed nano-size silica by surface modification for underfill applications
Sun YY, Zhang ZQ, Wong CP
Journal of Colloid and Interface Science, 292(2), 436, 2005 |
| 9 |
Thermal characterization of overmolded underfill materials for stacked chip scale packages
He Y
Thermochimica Acta, 433(1-2), 98, 2005 |
| 10 |
Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications
He Y
Thermochimica Acta, 439(1-2), 127, 2005 |
