검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization Wu J, Wafula F, Branagan S, Suzuki H, van Eisden J Journal of the Electrochemical Society, 166(1), D3136, 2018 |
| 2 |
Properties of PEG, PPG and Their Copolymers: Influence on Copper Filling of Damascene Interconnects Ryan K, Dunn K, van Eisden J, Adolf J Journal of the Electrochemical Society, 160(12), D3186, 2013 |
| 3 |
In situ monitoring of formation of InAs quantum dots and overgrowth by GaAs or AlAs Yakimov M, Tokranov V, Agnello G, van Eisden J, Oktyabrsky S Journal of Vacuum Science & Technology B, 23(3), 1221, 2005 |