| 1 |
Lignin containing cellulose nanofibril application in pMDI wood adhesives for drastically improved gap-filling properties with robust bondline interfaces
Chen HY, Nair SS, Chauhan P, Yan N
Chemical Engineering Journal, 360, 393, 2019 |
| 2 |
Evaluation of adhesion properties of blends of cottonseed protein and anionic water-soluble polymers
Cheng HN, Wyckoff W, Dowd MK, He ZQ
Journal of Adhesion Science and Technology, 33(1), 66, 2019 |
| 3 |
Wood adhesive properties of cottonseed protein with denaturant additives
Cheng HN, Ford C, Dowd MK, He ZQ
Journal of Adhesion Science and Technology, 31(24), 2657, 2017 |
| 4 |
Evaluation of wood bonding performance of water-washed cottonseed meal-based adhesives with high solid contents and low press temperatures
He ZQ, Cheng HN
Journal of Adhesion Science and Technology, 31(23), 2620, 2017 |
| 5 |
Optimization of preparation conditions for melamine urea formaldehyde based adhesive for plywood application using response surface methodology
Ong HR, Prasad DMR, Khan MMR
Indian Journal of Chemical Technology, 23(1), 39, 2016 |
| 6 |
Cold weather installation of wood flooring by adhesive bonding and its impact on indoor air quality
Choi DH, Kang DH, Yeo MS, Kim KW
Journal of Adhesion Science and Technology, 27(5-6), 632, 2013 |
| 7 |
Preparation and evaluation of particleboard bonded with a soy flour-based adhesive with a new curing agent
Gu K, Huang J, Li KC
Journal of Adhesion Science and Technology, 27(18-19), 2053, 2013 |
| 8 |
A Soy Flour-Based Adhesive Reinforced by Low Addition of MUF Resin
Fan DB, Qin TF, Chu FX
Journal of Adhesion Science and Technology, 25(1-3), 323, 2011 |
| 9 |
A Formaldehyde-Free Soy-Based Adhesive for Making Oriented Strandboard
Schwarzkopf M, Huang J, Li KC
Journal of Adhesion, 86(3), 352, 2010 |
| 10 |
Enhancing the Properties of Urea Formaldehyde Wood Adhesive System Using Different Generations of Core-Shell Modifiers Based on Hydroxyl-Terminated Dendritic Poly(amidoamine)s
Essawy HA, Moustafa AAB, Elsayed NH
Journal of Applied Polymer Science, 115(1), 370, 2010 |
