| 1967 - 1971 |
Untitled
Hojilla-Evangelista MP |
| 1972 - 1997 |
Biobased adhesives, gums, emulsions, and binders: current trends and future prospects
Imam SH, Bilbao-Sainz C, Chiou BS, Glenn GM, Orts WJ |
| 1998 - 2013 |
Prospective materials for biodegradable and/or biobased pressure-sensitive adhesives: a review
Cohen E, Binshtok O, Dotan A, Dodiuk H |
| 2014 - 2026 |
Soy proteins as plywood adhesives: formulation and characterization
Mo XQ, Sun XS |
| 2027 - 2042 |
High temperature performance of soy-based adhesives
O'Dell JL, Hunt CG, Frihart CR |
| 2043 - 2052 |
Soy flour dispersibility and performance as wood adhesive
Frihart CR, Satori H |
| 2053 - 2064 |
Preparation and evaluation of particleboard bonded with a soy flour-based adhesive with a new curing agent
Gu K, Huang J, Li KC |
| 2065 - 2074 |
Production and characterization of high strength, thin-layered, pulp fiberboard using soy protein adhesives
Li X, Wang DH, Ratto JA, Sun XS |
| 2075 - 2082 |
Evaluation of corn germ protein as an extender in plywood adhesive
Hojilla-Evangelista MP |
| 2083 - 2093 |
Performance of protein-based wood bioadhesives and development of small-scale test method for characterizing properties of adhesive-bonded wood specimens
Kim JT, Netravali AN |
| 2094 - 2102 |
Oligomers distribution at the gel point of tannin-formaldehyde thermosetting adhesives for wood panels
Pizzi A, Pasch H, Celzard A, Szczurek A |
| 2103 - 2111 |
Phenolic resin adhesives based on chestnut (Castanea sativa) hydrolysable tannins
Spina S, Zhou X, Segovia C, Pizzi A, Romagnoli M, Giovando S, Pasch H, Rode K, Delmotte L |
| 2112 - 2126 |
Bark extractives-based phenol-formaldehyde resins from beetle-infested lodgepole pine
Zhao Y, Yan N, Feng MW |
| 2127 - 2138 |
Synthesis of carbohydrate biomass-based furanic compounds bearing epoxide end group(s) and evaluation of their feasibility as adhesives
Cho JK, Lee JS, Jeong J, Kim B, Kim B, Kim S, Shin S, Kim HJ, Lee SH |
| 2139 - 2162 |
Marine mussel adhesion: biochemistry, mechanisms, and biomimetics
Bandara N, Zeng HB, Wu JP |
