| 835 - 842 |
Measurement of solder joint strength in freestanding chip-scale packages using a quantitative laser spallation technique
Tian J, Kim HI, Gupta V |
| 843 - 854 |
Effect of dowels and adhesive types on withdrawal strength in particleboard and MDF
Ozcan C, Uysal B, Kurt S, Esen R |
| 855 - 878 |
Modeling the constant amplitude fatigue behavior of adhesively bonded pultruded GFRP joints
Sarfaraz R, Vassilopoulos AP, Keller T |
| 879 - 895 |
Optimization of smart adhesively bonded single-strap composite joint
Cheng JQ, Pang SS, Li GQ, Zhou ZG |
| 896 - 904 |
The effect of steam treatment on bonding strength of impregnated wood materials
Uysal B, Yorur H |
| 905 - 911 |
Properties of UV-curable solvent-free pressure sensitive adhesive
Jamaluddin J, Lee MC |
| 912 - 923 |
Influence of high loaded wood flour and coupling agent (m-TMI-g-PP) content on properties of wood flour/polypropylene
Guo CG, Ma LC, Sun CY, Li LP |
| 924 - 938 |
Atmospheric plasma application to improve adhesion of electrospun nanofibers onto protective fabric
Vitchuli N, Shi Q, Nowak J, Nawalakhe R, Sieber M, Bourham M, Zhang XW, McCord M |
| 939 - 950 |
Degradation of metal-polymer composite submitted to uniaxial deformations in 3.5% NaCl solution
Zumelzu E, Asomavich I, Cabezas C, Aguilar C, Rull F |
