1245 - 1250 |
Electrochemical properties of Zr-V-Ni system hydrogen storage alloys Yang XG, Zhang WK, Lei YQ, Wang QD |
1251 - 1255 |
Preparation and characterization of Ni/Al-layered double hydroxide Sugimoto A, Ishida S, Hanawa K |
1256 - 1261 |
Aromatic compounds as redox shuttle additives for 4 V class secondary lithium batteries Adachi M, Tanaka K, Sekai K |
1262 - 1269 |
Ab initio study on interaction and stability of lithium-doped amorphous carbons Ago H, Kato M, Yahara K, Yoshizawa K, Tanaka K, Yamabe T |
1270 - 1272 |
Electroless copper deposition in the photographic gelatin layer Zhang YH, Yan TT, Yu SQ, Zhuang SY |
1273 - 1278 |
Development of solid-oxide fuel cells that operate at 500 degrees C Doshi R, Richards VL, Carter JD, Wang XP, Krumpelt M |
1279 - 1289 |
Solid-state electrochemical kinetics of Li-ion intercalation into Li1-xCoO2: Simultaneous application of electroanalytical techniques SSCV, PITT, and EIS Levi MD, Salitra G, Markovsky B, Teller H, Aurbach D, Heider U, Heider L |
1290 - 1295 |
Contribution of the internal active three-phase zone of Ni-zirconia cermet anodes on the electrode performance of SOFCs Nakagawa N, Nakajima K, Sato M, Kato K |
1296 - 1304 |
Rotating disk electrode measurements on the CO tolerance of a high-surface area Pt/Vulcan carbon fuel cell catalyst Schmidt TJ, Gasteiger HA, Behm RJ |
1305 - 1309 |
Degradation of La0.6Sr0.4Fe0.8Co0.2O3-delta in carbon dioxide and water atmospheres Benson SJ, Waller D, Kilner JA |
1310 - 1317 |
Examination of the corrosion behavior of aluminum current collectors in lithium/polymer batteries Chen YF, Devine TM, Evans JW, Monteiro OR, Brown IG |
1318 - 1325 |
Electrochemical behavior of lithium in alkaline aqueous electrolytes - I. Thermodynamics Pensado-Rodriguez O, Urquidi-Macdonald M, Macdonald DD |
1326 - 1335 |
Electrochemical behavior of lithium in alkaline aqueous electrolytes - II. Point defect model Pensado-Rodriguez O, Flores JR, Urquidi-Macdonald M, Macdonald DD |
1336 - 1340 |
The development of LiFeO2-LiCoO2-NiO cathodes for molten carbonate fuel cells Bloom I, Lanagan MT, Krumpelt M, Smith JL |
1341 - 1345 |
Determination of the oxygen permeation flux through La0.75Ca0.25CrO3-delta by an electrochemical method Sakai N, Yamaji K, Horita T, Yokokawa H, Kawada T, Dokiya M, Hiwatashi K, Ueno A, Aizawa M |
1346 - 1350 |
Composites of V2O5 aerogel and nickel fiber as high rate intercalation electrodes Parent MJ, Passerini S, Owens BB, Smyrl WH |
1351 - 1354 |
Cathode of LiMgyMn2-yO4 and LiMgyMn2-yO4-delta spinel phases for lithium secondary batteries Hayashi N, Ikuta H, Wakihara M |
1355 - 1360 |
Doped vanadium oxides as host materials for lithium intercalation Coustier F, Hill J, Owens BB, Passerini S, Smyrl WH |
1361 - 1369 |
Evaluation of lead anode reactions in acid sulfate electrolytes - I. Lead alloys with cobalt additives Yu P, O'Keefe TJ |
1370 - 1374 |
Material balance modification in one-dimensional modeling of porous electrodes Jain M, Weidner JW |
1375 - 1379 |
Lithium insertion into mesoscopic and single-crystal TiO2 (rutile) electrodes Kavan L, Fattakhova D, Krtil P |
1380 - 1385 |
The behavior of copper and lead during heat-treatment and surface treatment of aluminium capacitor Ashitaka Z, Thompson GE, Skeldon P, Wood GC, Shimizu K |
1386 - 1391 |
Copper corrosion in industrial waters - A multimethod analysis Monticelli C, Fonsati M, Meszaros G, Trabanelli G |
1392 - 1396 |
Characterization of electrolytic ZrO2 coating on AISI 316L stainless steel Yen SK |
1397 - 1406 |
Passivation of stainless steels in hydrochloric acid Wegrelius L, Falkenberg F, Olefjord I |
1407 - 1411 |
Mechanism of the chemical deposition of nickel on silicon wafers in aqueous solution Takano N, Hosoda N, Yamada T, Osaka T |
1412 - 1420 |
Electroreduction of Co2+ and Ni2+ at III-V semiconductors and properties of the semiconductor/metal interfaces formed Strubbe K, Vereecken PM, Gomes WP |
1421 - 1430 |
Channel-constrained electroless metal deposition on ligating self-assembled film surfaces Chen MS, Brandow SL, Dulcey CS, Dressick WJ, Taylor GN, Bohland JF, Georger JHG, Pavelchek EK, Calvert JM |
1431 - 1435 |
Characterization of NixFe1-x(0.10 < x < 0.95) electrodeposition from a family of sulfamate-chloride electrolytes Leith SD, Ramli S, Schwartz DT |
1436 - 1441 |
Electrochemical deposition of copper on n-Si/TiN Oskam G, Vereecken PM, Searson PC |
1442 - 1447 |
Inhibition of alumina deposition during tungsten chemical mechanical planarization through the use of citric acid Zhang L, Raghavan S, Meikle S, Hudson G |
1448 - 1454 |
Photoluminescence as an in situ probe for copper electrodeposition on p-GaAs Sutter EMM, Gerard I, Etcheberry A |
1455 - 1460 |
A comparative study of film properties of chemical vapor deposited TiN films as diffusion barriers for Cu metallization Kim SH, Chung DS, Park KC, Kim KB, Min SH |
1461 - 1464 |
Effect of ethylenediamine on the electrodeposition of Ni-Fe alloys Harris TM, Wilson JLS, Bleakley M |
1465 - 1468 |
Comparison of Cl-2/He, Cl-2/Ar, and Cl-2/Xe plasma chemistries for dry etching of NiFe and NiFeCo Jung KB, Cho H, Hahn YB, Hays DC, Lambers ES, Park YD, Feng T, Childress JR, Pearton SJ |
1469 - 1471 |
Electrochemical characterization of highly boron-doped diamond microelectrodes in aqueous electrolyte Sarada BV, Rao TN, Tryk DA, Fujishima A |
1472 - 1477 |
Anodic behavior of carbon electrodes in CaO-CaCl2 melts at 1123 K Mohamedi M, Borresen B, Haarberg GM, Tunold R |
1478 - 1485 |
Electrochemical oxidation of 4-methyl-1,4-dihydropyridines in protic and aptrotic media - Spin trapping studies Nunez-Vergara LJ, Sturm JC, Alvarez-Lueje A, Olea-Azar C, Sunkel C, Squella JA |
1486 - 1491 |
Electromotive force of hydrogen isotope cell with a high temperature proton-conducting solid electrolyte CaZr0.90In0.10O3-alpha Matsumoto H, Takeuchi K, Iwahara H |
1492 - 1495 |
Cathodically promoted addition of nitroalkanes to ferrocenecarboxaldehyde Niazimbetova ZI, Evans DH, Guzei IA, Incarvito CD, Rheingold AL |
1496 - 1499 |
Study of adsorption of iodide ions on gold electrode by a laser-beam deflection method compared with a piezoelectric technique Ueno K, Seo M |
1500 - 1504 |
Heteroepitaxial growth of yttria-stabilized zirconia on silicon (100) by reactive sputtering with an electron cyclotron resonance source Lille J, Varhue WJ, Mongeon S |
1505 - 1509 |
Surface quality of tribochemically polished silicon nitride Hah SR, Burk CB, Fischer TE |
1510 - 1516 |
Optimization of multilayer thin film passivation processes for improving cache memory device performance Lin CF, Tseng WT, Feng MS |
1517 - 1522 |
Etch-induced physical damage and contamination during highly selective oxide etching using C4F8/H-2 helicon wave plasmas Kim HS, Lee WJ, Yeom GY, Kim JH, Whang KW |
1523 - 1528 |
Contact mechanics and lubrication hydrodynamics of chemical mechanical polishing Tichy J, Levert JA, Shan L, Danyluk S |
1529 - 1535 |
Bias dependent contrast mechanisms in EBIC images of MOS capacitors Kirk HR, Radzimski Z, Romanowski A, Rozgonyi GA |
1536 - 1539 |
A thermal model for the initiation of programming in metal-to-metal amorphous-silicon antifuses Vasudevan N, Massoud HZ, Fair RB |
1540 - 1545 |
Dark currents in HgCdTe photodiodes passivated with ZnS/Cds Juang FS, Su YK, Chang SJ, Chang SM, Shu FS, Chiang CD, Cherng YT, Sun TP |
1546 - 1548 |
Instability of amorphous Ru-Si-O thin films under thermal oxidation Gasser SM, Ruiz R, Kolawa E, Nicolet MA |
1549 - 1556 |
Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technology Kim YB, Baklanov MR, Conard T, de Potter M, Vanhaeleemeersch S |
1557 - 1564 |
Low thermal budget surface preparation for selective epitaxy a study on process robustness Celik SM, Ozturk MC |
1565 - 1569 |
Interfacial properties in liquid phase growth of SiC Syvajarvi M, Yakimova R, Janzen E |
1570 - 1574 |
Effect of substrate on "on-resistance" of a power metal-oxide semiconductor field-effect transistor device Chiou HD, Gaffney K, DeNicholas J, Chang G, Lu SF |
1575 - 1578 |
Thermal donor and oxygen precipitate formation in silicon during 450 degrees C treatments under atmospheric and enhanced pressure Antonova IV, Popov VP, Plotnikov AE, Misiuk A |
1579 - 1582 |
Degradation of reactively sputtered Ti-Si-N films used as a barrier layer in titanium silicide/polycrystalline Si gate electrodes Park JS, Sohn DK, Lee BH, Bae JU, Byun JS, Park JW |
1583 - 1592 |
Effective improvement on barrier capability of chemical vapor deposited WSix using N-2 plasma treatment Wang MT, Lin YC, Wang CC, Chen MC |
1593 - 1596 |
Stimulated orientation of Si films by solid-phase recrystallization on a ZnS film/glass substrate Unagami T |
1597 - 1601 |
The effect of Al0.7Ga0.3As etch stop removal on the preparation of wafer-bonded compliant substrates Zhang C, Lubyshev D, Jackson TN, Miller DL, Mayer TS |
1602 - 1607 |
Copper/benzocyclobutene interconnects for sub-100 nm integrated circuit technology: Elimination of high-resistivity metallic liners and high-dielectric constant polish stops Neirynck JM, Gutmann RJ, Murarka SP |
1608 - 1611 |
An oxygen sensor using a process of high-temperature oxidation of metal Kawamura K, Kaimai A, Nigara Y, Kawada T, Mizusaki J |
1612 - 1612 |
Proton and methanol transport in poly(perfluorosulfonate) membranes containing Cs+ and H+ cations (vol 145, pg 3798, 1998) Tricoli V |