| J7 - J14 |
Structural Stability and oxygen permeation properties of Sr3-xLaxFe2-yCoyO7-delta (0 <= x <= 0.3 and 0 <= y <= 1.0)
Prado F, Armstrong T, Caneiro A, Manthiram A |
| L3 - L3 |
Evaluation of oxygen parameters in H2SO4-CH3OH mixtures using electrochemical methods (vol 148, pg2449, 2001)
Itoe RN, Wesson GD, Kalu EE |
| L4 - L4 |
The structure and electrochemical behavior of nitrogen-containing nanocrystalline diamond films deposited from CH4/N-2/Ar mixtures (vol 148, pg E44, 2001)
Chen Q, Gruen DM, Krauss AR, Corrigan TD, Witek M, Swain GM |
| D29 - D36 |
The leaching and electrochemistry of gold in high purity cyanide solutions
Jeffrey MI, Ritchie IM |
| D37 - D42 |
The synthesis of diaryliodonium salts by the anodic oxidation of aryl iodide/arene mixtures
Peacock MJ, Pletcher D |
| D43 - D48 |
Polypyrrole/polymer electrolyte composites prepared by in situ electropolymerization of pyrrole as cathode/electrolyte material for facile electron transfer at the solid interface
Amanokura J, Suzuki Y, Imabayashi S, Watanabe M |
| F47 - F50 |
Infrared spectroscopy study of the thermal stability of fluorinated SiO2 thin films
Iacona F, Ceriola G, Spoto G |
| F51 - F55 |
A method of making oxynitrides by interface nitridation through silicon
Suizu Y, Fukumoto M, Ozawa Y |
| F56 - F62 |
Thermodynamic stability of RuO2 bottom electrodes and their effect on the Ba-Sr-Ti oxide film quality
Oh YJ, Moon SH, Chung CH |
| F63 - F66 |
Atomic layer deposition of high dielectric constant nanolaminates
Zhang H, Solanki R |
| F67 - F72 |
Thermal stability of fluorinated amorphous carbon thin films with low dielectric constant
Han SS, Bae BS |
| F73 - F76 |
The strong degradation of 30 angstrom gate oxide integrity contaminated by copper
Lin YH, Chen YC, Chan KT, Pan FM, Hsieh IJ, Chin A |
| F77 - F81 |
Theoretical analysis on spin coating of polyimide precursor solutions
Chang Y, Wu WC, Chen WC |
| H29 - H36 |
A pH electrode based on melt-oxidized iridium oxide
Yao S, Wang M, Madou M |
| H37 - H44 |
Characteristics and mechanisms in ion-conducting polymer films as chemical sensors
Hughes RC, Yelton WG, Pfeifer KB, Patel SV |
| H45 - H48 |
Effect of laser irradiation on electrophoretically coated phosphors for field emission displays
Hong JP, Seo DS, Kim CO, Song BK, Char SN, Lee NS, Kim JM, Chee JK |
| J15 - J24 |
Weak interaction of oxygen with some refractory carbides
Gozzi D, Cascino G, Loreti S, Minarini C, Shimada S |
| A285 - A292 |
Particle size effects on the electrochemical performance of copper oxides toward lithium
Grugeon S, Laruelle S, Herrera-Urbina R, Dupont L, Poizot P, Tarascon JM |
| A293 - A298 |
The influence of H2O2 on the adsorption and oxidation of CO on Pt electrodes in sulfuric acid solution
Schmidt VM, Rodriguez JL, Pastor E |
| A299 - A304 |
Liquid/solid phase diagrams of binary carbonates for lithium batteries part II
Ding MS, Xu K, Zhang SS, Jow TR |
| A305 - A310 |
Octacyanophthalocyaninatoiron polymer as cathode material for a secondary lithium battery
Asai Y, Onishi K, Miyata S, Kim SJ, Matsumoto M, Shigehara K |
| A311 - A317 |
Structural analysis of submicrometer LiCoO2 films
Bouwman PJ, Boukamp BA, Bouwmeester HJM, Wondergem HJ, Notten PHL |
| A318 - A322 |
Characterization of all-solid-state thin-film batteries with V2O5 thin-film cathodes using ex situ and in situ processes
Jeon EJ, Shin YW, Nam SC, Cho WI, Yoon YS |
| A323 - A329 |
Oxygen reduction on supported platinum/polythiophene electrocatalysts
Giacomini MT, Ticianelli EA, McBreen J, Salasubramanian M |
| A330 - A338 |
Oxidation kinetics of some nickel-based superalloy foils in humidified hydrogen and electronic resistance of the oxide scale formed part II
England DM, Virkar AV |
| A339 - A345 |
The effect of carbon starting material on carbon fluoride synthesized at room temperature - Characterization and electrochemistry
Root MJ, Dumas R, Yazami R, Hamwi A |
| A346 - A350 |
Stability of sodium couple in organic and inorganic molten salt electrolytes investigated with electrochemical quartz crystal microbalance
Park SH, Winnick J, Kohl PA |
| A351 - A360 |
Sintering and properties of mixed lanthanide chromites
Simner SP, Hardy JS, Stevenson JW |
| A361 - A367 |
Electrochemical quartz crystal microbalance gravimetric and viscoelastic studies of nickel hydroxide battery electrodes
Etchenique R, Calvo EJ |
| A368 - A373 |
Characterization of high porosity carbon electrodes derived from mesophase pitch for electric double-layer capacitors
Weng TC, Teng HS |
| A374 - A380 |
Synthesis and characterization of hydrous ruthenium oxide-carbon supercapacitors
Rarnani M, Haran BS, White RE, Popov BN |
| A381 - A387 |
Electrohydrodynamic impedance in the presence of nonuniform transport properties
Barton SC, West AC |
| A388 - A394 |
Anode micro model of solid oxide fuel cell
Chan SH, Xia ZT |
| B121 - B126 |
Electroactive poly(aromatic amine) films for iron protection in sulfate medium
Meneguzzi A, Pham MC, Lacroix JC, Piro B, Adenier A, Ferreira CA, Lacaze PC |
| B127 - B131 |
The effect of CO2 on the NaCl-induced atmospheric corrosion of aluminum
Blucher DB, Lindstrom R, Svensson JE, Johansson LG |
| B132 - B137 |
An alternative explanation for the apparent passivation of molybdenum in 1 mol/L hydrochloric acid
Falkenberg F, Raja VS, Ahlberg E |
| B138 - B145 |
Investigations of the mechanism of corrosion inhibition by polyaniline - Polyaniline-coated stainless steel in sulfuric acid solution
Gasparac R, Martin CR |
| B146 - B151 |
A study of copper passivity by electrochemical impedance spectroscopy
Babic R, Metikos-Hukovic M, Jukic A |
| B152 - B156 |
Conditions for fabrication of ideally ordered anodic porous alumina using pretextured Al
Asoh H, Nishio K, Nakao M, Tamamura T, Masuda H |
| B157 - B162 |
Cathodic protection for disks of various diameters
Li SXZ, Newman J |
| C253 - C256 |
Epitaxial electrodeposition of orthorhombic alpha-PbO2 on (100)-oriented single crystal Au
Vertegel AA, Bohannan EW, Shumsky MG, Switzer JA |
| C257 - C265 |
Probing the mechanism of electroless gold plating using an electrochemical quartz crystal microbalance I. Elucidating the nature of reactive intermediates in dimethylamine borane
Sargent A, Sadik OA, Matienzo LJ |
| C266 - C273 |
Incorporation of zinc in electroless deposited nickel-phosphorus alloys I. A comparative study of Ni-P and Mi-Zn-P coatings deposition, structure, and composition
Valova E, Georgiev I, Armyanov S, Delplancke JL, Tachev D, Tsacheva T, Dille J |
| C274 - C279 |
Incorporation of zinc in electroless deposited niclel-phosphorus alloys II. Compositional variations through alloy coating thickness
Valova E, Armyanov S, Franquet A, Steenhaut O, Hubin A, Vereecken J, Delplancke JL |
| C280 - C283 |
Electrolytic codeposition of silica particles with aluminum from AlCl3-dimethylsulfone electrolytes
Hirato T, Fransaer J, Celis JP |
| C284 - C288 |
Effect of centrifugal force on electrodeposition of Hg2+ and Pb2+ at a spinning graphite cathode
Lin SW, Navarro RMF |
| C289 - C296 |
Mass transfer models for the electrodeposition of copper with a buffering agent
Gill WN, Duquette DJ, Varadarajan D |
| C297 - C300 |
Electrochemical deposition of poly(o-phenylenediamine) films on type 304 stainless steel
D'Elia LF, Ortiz RL, Marquez OP, Marquez J, Martinez Y |
| C301 - C309 |
Mixed polypyrrole surfactant films obtained by electrophoretic engulfing of multilamellar vesicles
Belamie E, Argoul F, Faure C |
| C310 - C314 |
Hydrogen peroxide oxygen precursor for zinc oxide electrodeposition I. Deposition in perchlorate medium
Pauporte T, Lincot D |
| C315 - C321 |
Influence of chloride and nitrate anions on copper electrodeposition in ammonia media
Ramos A, Miranda-Hernandez M, Gonzalez I |
| C322 - C326 |
Effect of etch mask and etching solution on InP micromachining to form V-grooves
Kuna K, Vangala NK, DasGupta A, DasGupta N |
| E133 - E138 |
Spectroelectrochemistry for electroreduction of p-benzoquinone in unbuffered aqueous solution
Tang YH, Wu YR, Wang ZH |
| E139 - E147 |
Impedance study of TI+ reduction at gramicidin-modified dioleoylphosphatidylcholine-coated mercury electrodes -Influence of gramicidin concentration and the nature of the supporting electrolyte
Rueda M, Navarro I, Prado C, Silva C |
| E148 - E154 |
Electrode behavior of hydrogen reduction in LiCl-KCl melt II. AC impedance analysis
Ito H, Hasegava Y, Ito Y |
| E155 - E167 |
Investigation of the electrochemical windows of aprotic alkali metal (Li,Na,K) salt solutions
Moshkovich M, Gofer Y, Aurbach D |
| E168 - E170 |
Ion conductive characteristics of DNA film containing ionic liquids
Ohno H, Nishimura N |
| E171 - E175 |
Aryl sulfones with strongly electron-withdrawing substituents -Do their electrogenerated radical anions always undergo a single cleavage reaction?
Pilard JF, Fourets O, Simonet J, Klein LJ, Peters DG |
| G185 - G189 |
Effect of oxygen on thermocapillary convection in a molten silicon column under microgravity
Azami T, Nakamura S, Hibiya T |
| G190 - G194 |
Direct resist removal process from copper-exposed vias for low-parasitic-capacitance interconnects
Furusawa T, Sakuma N, Ryuzaki D, Kondo S, Takeda K, Machida S, Yoneyama R, Hinode K |
| G195 - G199 |
Cross-contamination during ferroelectric nonvolatile memory fabrication
Gilbert SR, Ritchey D, Tavassoli M, Amano J, Colombo L, Summerfelt SR |
| G200 - G206 |
Lifetime measurements by photoconductance techniques in wafers immersed in a passivating liquid
Lago-Aurrekoetxea R, Tobias I, del Canizo C, Luque A |
| G207 - G214 |
Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory
Thakurta DG, Borst CL, Schwendeman DW, Gutmann RJ, Gill WN |
| G215 - G217 |
Investigation of trimethylphosphine as a source for P-+(31) implantation using a cold-cathode implantation system for silicon device fabrication
Oleszek GM |
| G218 - G224 |
Characterization of silicon-on-sapphire material and devices for radio frequency applications
Munteanu D, Cristoloveanu S, Rozeau O, Jomaah J, Boussey J, Wetzel M, de la Houssaye P, Lagnado I |
| G225 - G228 |
Selective wafer bonding by surface roughness control
Gui C, Oosterbroek RE, Berenschot JW, Schlautmann S, Lammerink TSJ, van den Berg A, Elwenspoek MC |
| G229 - G231 |
Si consumption in selective chemical vapor deposition of tungsten using SiH4 reduction of WF6
Takahashi M, Takayama K |
| G232 - G236 |
Characterization of the thermal reactions for Cu/thermal SiO2 and Cu/hydrogen silsesquioxane on silicon
Jeng JS, Chen JS |
