| D39 - D45 |
Design rules for electroforming in the LIGA process
Drese KS |
| D46 - D50 |
Investigation of nanoporous thin-film alumina templates
Das B |
| K13 - K19 |
Material aspects in emerging nonvolatile memories
Pinnow CU, Mikolajick T |
| A791 - A795 |
Effects of nanosized adsorbing material on electrochemical properties of sulfur cathodes for Li/S secondary batteries
Song MS, Han SC, Kim HS, Kim JH, Kim KT, Kang YM, Ahn HJ, Dou SX, Lee JY |
| A796 - A800 |
Electrochemical properties of beta-LiVOPO4 prepared by carbothermal reduction
Barker J, Saidi MY, Swoyer JL |
| A801 - A805 |
Effect of AlPO4-nanoparticle coating concentration on high-cutoff-voltage electrochemical performances in LiCoO2
Lee JG, Kim B, Cho J, Kim YW, Park B |
| A806 - A824 |
A method for battery impedance analysis
Tenno A, Tenno R, Suntio T |
| A825 - A830 |
Corrosion model for iron in the presence of molten carbonate
Mitsushima S, Nishimura Y, Kamiya N, Ota K |
| A831 - A837 |
Single-walled carbon nanotubes as electrodes in supercapacitors
Pico F, Rojo JM, Sanjuan ML, Anson A, Benito AM, Callejas MA, Maser WK, Martinez MT |
| A838 - A842 |
In situ XRD and electrochemical study of the reaction of lithium with amorphous silicon
Hatchard TD, Dahn JR |
| A843 - A847 |
Electrochemical lithium intercalation in titanium nitride chloride
Kuhn A, Hoppe H, Strahle J, Garcia-Alvarado F |
| A848 - A856 |
The effect of dimethyl pyrocarbonate on electroanalytical behavior and cycling of graphite electrodes
Levi MD, Markevich E, Wang C, Koltypin M, Aurbach D |
| A857 - A866 |
Diagnostic analysis of electrodes from high-power lithium-ion cells cycled under different conditions
Striebel KA, Shim J, Cairns EJ, Kostecki R, Lee YJ, Reimer J, Richardson TJ, Ross PN, Song X, Zhuang GV |
| A867 - A872 |
Electrode properties and lithiation/delithiation reactions of Ag-Sb-Sn nanocomposite anodes in Li-ion batteries
Yin JT, Wada M, Tanase S, Sakai T |
| A873 - A879 |
Lithium metal batteries operating at room temperature based on different PEO-PVdF separator configurations
Sannier L, Bouchet R, Santinacci L, Grugeon S, Tarascon JM |
| A880 - A886 |
The effect of interfacial deformation on electrodeposition kinetics
Monroe C, Newman J |
| A887 - A890 |
Li-ion conductivity of aluminate and borate complex polymers containing fluoroalkane dicarboxylate
Aoki T, Konno A, Fujinami T |
| A891 - A897 |
Hexagonal to cubic spinel transformation in lithiated cobalt oxide -TEM investigation
Gabrisch H, Yazami R, Fultz B |
| A898 - A904 |
Influences of the degree of cross-linking on electrochemical and thermal properties in polyether-based electrolytes doped with LiN-(SO2CF3)(2)
Bando T, Aihara Y, Hayamizu K, Akiba E |
| A905 - A913 |
Analytical solution for the impedance of a porous electrode
Devan S, Subramanian VR, White RE |
| A914 - A921 |
Electrochemical characterization of positive electrode material LiNi1/3Co1/3Mn1/3O2 and compatibility with electrolyte for lithium-ion batteries
Wang ZX, Sun YC, Chen LQ, Huang XJ |
| A922 - A929 |
Improvement of the thermal stability of LiNi0.8Co0.2O2 cathode by a SiOx protective coating
Omanda H, Brousse T, Marhic C, Schleich DM |
| A930 - A932 |
An intermediate-temperature ammonia fuel cell using Gd-doped barium cerate electrolyte
McFarlan A, Pelletier L, Maffei N |
| A933 - A937 |
Reaction mechanism of tin phosphide anode by mechanochemical method for lithium secondary batteries
Kim YU, Lee CK, Sohn HJ, Kang T |
| B291 - B298 |
New interpretation of the effect of hydrogen on the ion distributions and structure of passive films on microalloyed steel
Zeng YM, Luo JL, Norton PR |
| B299 - B303 |
Activity of SiC particles in Al-based metal matrix composites revealed by SECM
Diaz-Ballote L, Veleva L, Pech-Canul MA, Pech-Canul MI, Wipf DO |
| B304 - B308 |
Pitting inhibition by surfactants - Effect of the charge of headgroups
Wei ZQ, Somasundaran P, Duby P |
| B309 - B318 |
Growth kinetics of MoSi2 coating formed by a pack siliconizing process
Yoon JK, Lee KH, Kim GH, Lee JK, Doh JM, Hong KT |
| B319 - B324 |
Study of initial stage corrosion of hot-dip-coated zinc surface using in situ AFM
Kim YH, Rae CY, Kim KH, Chung WS |
| B325 - B330 |
Conducting polymers and corrosion PPy - PPy-PDAN composite films -Electrosynthesis and characterization
Nguyen TD, Pham MC, Piro B, Aubard J, Takenouti H, Keddam M |
| B331 - B339 |
Electrochemical behavior of ZrB2 in aqueous solutions
Monticelli C, Bellosi A, Dal Colle M |
| B340 - B346 |
Interfacial void model for corrosion pit initiation on aluminum
Muthukrishnan K, Hebert KR, Makino T |
| B347 - B353 |
Packed powder electrodes for characterizing the reactivity of granular iron in borate solutions
Nurmi JT, Bandstra JZ, Tratnyek PG |
| B354 - B358 |
Relationship between induction time for pitting and pitting potential for high-purity aluminum
Wall FD, Martinez MA, Vandenavyle JJ |
| B359 - B369 |
Chromate conversion coating on aluminum alloys - II: Effect of the microstructure
Campestrini P, Terryn H, Vereecken J, de Wit JHW |
| B370 - B377 |
Chromate conversion coating on aluminum alloys - III. Corrosion protection
Campestrini P, Terryn H, Vereecken J, de Wit JHW |
| C359 - C364 |
Deposition of silver oxysalts and their antimicrobial properties
Djokic SS |
| C365 - C368 |
Formation of shallow junctions by HCl-based Si etch followed by selective epitaxy of B-doped Si1-xGex in RPCVD
Isheden C, Radamson HH, Suvar E, Hellstrom PE, Ostling M |
| C369 - C374 |
Influence of oxide thickness on nucleation and growth of copper on tantalum
Radisic A, Oskam G, Searson PC |
| C375 - C378 |
Mechanistic studies of Cu electropolishing in phosphoric acid electrolytes
Du B, Suni II |
| C379 - C384 |
Electrodeposition of Al-Mo alloys from the Lewis acidic aluminum chloride-1-ethyl-3-methylimidazolium chloride molten salt
Tsuda T, Hussey CL, Stafford GR |
| C385 - C391 |
Comparison of the structure and chemical composition of crystalline and amorphous electroless Ni-W-P coatings
Valova E, Armyanov S, Franquet A, Petrov K, Kovacheva D, Dille J, Delplancke JL, Hubin A, Steenhaut O, Vereecken J |
| C392 - C398 |
Electrochemical codeposition and spectroscopic characterization of Cu-Tl oxide films prepared in aqueous basic solutions
Casella IG, Cataldi TRI, Laurita A |
| C399 - C404 |
Reaction of Si with HCl to form chlorosilanes - Time dependent nature and reaction model
Noda S, Tanabe K, Yahiro T, Osawa T, Komiyama H |
| C405 - C411 |
Complexation chemistry in copper plating from citrate baths
Rode S, Henninot C, Vallieres CC, Matlosz M |
| C412 - C417 |
Electrodeposition of Lu-Co-Bi thin films in an organic bath
Li GR, Tong YX, Liu GK |
| C418 - C430 |
Chip-scale modeling of electroplated copper surface profiles
Park T, Tugbawa T, Boning D, Chidambaram C, Borst C, Shin G |
| C431 - C435 |
EC-STM studies of Te and CdTe atomic layer formation from a basic Te solution
Lay MD, Stickney JL |
| C436 - C438 |
Classification of palladium nucleation processes based on nucleus size distribution
Lau PP, Wong CC, Chan L, See A, Law SB |
| C439 - C445 |
In situ measurement of the diameter of nanopores in silicon during anodization in hydrofluoric acid solution
Tanaka H, Shimada A, Kinoshita A |
| E199 - E205 |
PVDC-based carbon material by chemical activation and its application to nonaqueous EDLC
Kim YJ, Masutzawa Y, Ozaki S, Endo M, Dresselhaus MS |
| E206 - E212 |
Thickness measurement of Sn-Ag hot dip coatings on large hadron collider superconducting strands by coulometry
Scheuerlein C, Izquierdo GA, Charras N, Oberli LR, Taborelli M |
| E213 - E218 |
Fabrication of Au(111)-like polycrystalline gold electrodes and their applications to oxygen reduction
El-Deab MS, Arihara K, Ohsaka T |
| F133 - F134 |
Interaction of hydrogen plasma with extreme low-k SiCOH dielectrics
Grill A, Patel V |
| F135 - F140 |
Interlayer growth and electrical behavior of Ta2O5/SiOxNy/Si gate stacks
Lai YS, Chen JS, Wang JL |
| F141 - F145 |
Methanol oxidation on Ru-modified preferentially oriented Pt electrodes in acidic medium
El-Shafei AA, Hoyer R, Kibler LA, Kolb DM |
| F146 - F152 |
Curing process window and thermal stability of porous MSQ-based low-dielectric-constant materials
Chang SY, Chou TJ, Lu YC, Jang SM, Lin SJ, Liang MS |
| F153 - F156 |
Thermal stability and electrical characterization of HfO2 films on thermally nitrided Si
Bastos KP, Morais J, Miotti L, Soares GV, Pezzi RP, da Silva RCG, Boudinov H, Baumvol IJR, Hegde RI, Tseng HH, Tobinc PJ |
| G377 - G379 |
Device level characterization for energy bandgap of strain-relaxed SiGe and oxide/SiGe barrier height
Huang CH, Yu DS, Chin A, Chen WJ, McAlister SP |
| G380 - G386 |
Post plasma etch residue removal using CO2-TMAHCO(3) mixtures: Comparison of single-phase and two-phase mixtures
Levitin G, Myneni S, Hess DW |
| G387 - G390 |
Direct wafer bonded abrupt junction tunnel diodes
Esser RH, Hobart KD, Kub FJ |
| G391 - G395 |
Avoiding cu hillocks during the plasma process
Kang TK, Chou WY |
| G396 - G401 |
Compact modeling of weak inversion generation transients in SOI MOSFETs
Ionescu AM, Munteanu D, Hefyene N, Anghel C |
| G402 - G407 |
Mean residence time and removal rate studies in ILD CMP
Philipossian A |
| G408 - G427 |
Alkaline etching for reflectance reduction in multicrystalline silicon solar cells
Hylton JD, Burgers AR, Sinke WC |
| G428 - G435 |
CVD of nanosized ZnS and CdS thin films from single-source precursors
Barreca D, Gasparotto A, Maragno C, Tondello E |
| G436 - G439 |
Effect of slurry flow rate on pad life during interlayer dielectric CMP
Philipossian A, Olsen S |
| G440 - G442 |
Detecting defects in Cu metallization structures by electron-beam wafer inspection
Matsui M, Zhaohui C, Nozoe M, Torii K |
| H141 - H144 |
Microstructural evolution of polycrystalline Si films during Ni-silicide-mediated lateral crystallization
Ahn JH, Eom JH, Ahn BT |
| H145 - H152 |
Electrochemically inactive nickel oxide as electrochromic material
Bouessay I, Rougier A, Tarascon JM |
| H153 - H157 |
Electrochromism in diffractive conducting polymer gratings
Admassie S, Inganas O |
