163 - 168 |
Thermal and Electron-Stimulated Chemistry of Fomblin-Zdol Lubricant on a Magnetic Disk Lin JL, Bhatia CS, Yates JT |
169 - 177 |
Field Desorption of Lithium-Fluoride Stintz A, Panitz JA |
178 - 182 |
Thermal-Reactions of Fluorocarbon and Hydrofluorocarbon Species on Si(100)-(2X1)-CF3I, Cf3Ch2I, and C2F4 Lin JL, Yates JT |
183 - 187 |
Surface Free-Energies for Diamond Growth from Hydrogen-Hydrocarbon Mixtures Zhang YF, Chen GH |
188 - 194 |
A Sensitive Method for Measuring Adsorbed Carbon on Palladium Surfaces - Titration by No Ramsier RD, Lee KW, Yates JT |
195 - 199 |
Positive and Negative Direct-Current Bias Effects on the Microstructures and Physical-Properties of Hydrogenated Amorphous-Carbon Films Prepared by Radio-Frequency Plasma Chemical-Vapor-Deposition Nakayama M, Tsuyoshi A, Shibahara M, Maruyama K, Kamata K |
200 - 206 |
Photoemission Spectroscopy Study of Thin Cr Overlayers on NH3/GaAs(100) Park KT, Cao JM, Gao Y, Ruckman MW |
207 - 215 |
Structure and Morphology of Microprotrusions Grown on Ar+-Sputtered InP Kato J, Nozu M, Fujimoto Y, Tanemura M, Okuyama F |
216 - 220 |
Local Order Measurement in Snge Alloys and Monolayer Sn Films on Si with Reflection Electron-Energy-Loss Spectrometry Wong SS, He G, Nikzad S, Ahn CC, Atwater HA |
221 - 229 |
Adsorption of TiCl4 on TiSi2 - Application to Silicide Chemical-Vapor-Deposition Southwell RP, Seebauer EG |
230 - 236 |
Low-Pressure Chemical-Vapor-Deposition of InSb Using Neopentylstibine and Trimethylindium Bu Y, Lin MC, Berry AD, Hendershot DG |
237 - 243 |
Compositional and Electrical-Properties of Si Metal-Oxide-Semiconductor Structure Prepared by Direct Photoenhanced Chemical-Vapor-Deposition Using a Deuterium Lamp Shei SC, Su YK, Hwang CJ, Yokoyama M, Pan FM |
244 - 247 |
Effect of the Predecomposition of Sif4 on the Properties of Silicon Dioxide Deposited at Low-Temperatures Using Sif4/SiH4/N2O in a Double-Plasma Process Alonso JC, Ortiz A, Falcony C, Garcia M |
248 - 254 |
Beam and Decomposition Properties of Copper-Containing Metalorganic Precursors and Their Use for CuO Thin-Film Preparation in Chemical Beam Epitaxy Willmott PR, Felder P, Lingenauer M, Huber JR, Fritsch E, Bidell W, Berke H, Machler E, Williams EJ, Locquet JP, Bednorz JG |
255 - 259 |
Crystal Orientation Control of YBa2Cu3Oy Thin-Films on MgO Prepared by Excimer-Laser Ablation with CO2-Laser Irradiation Inayoshi M, Hiramatsu M, Sugiura Y, Kawamura H, Nawata M |
260 - 267 |
Deposition of Silicon-Oxide Onto Polyethylene and Polyethyleneterephthalate - An X-Ray Photoelectron-Spectroscopy Interfacial Study Rotger JC, Pireaux JJ, Caudano R, Thorne NA, Dunlop HM, Benmalek M |
268 - 275 |
Effects of Water Partial-Pressure on the Activated Electron-Beam Evaporation Process to Deposit Tin-Doped Indium-Oxide Films Shigesato Y, Yasui I, Hayashi Y, Takaki S, Oyama T, Kamei M |
276 - 281 |
Epitaxial-Growth of Body-Centered-Cubic Transition-Metal Films and Superlattices Onto MgO (111), (011), and (001) Substrates Mattson JE, Fullerton EE, Sowers CH, Bader SD |
282 - 288 |
Influence of a Heteroepitaxial Interface with Large Lattice Mismatch on the Low-Temperature Growth of a Film Zeng H, Vidali G |
289 - 294 |
Interface Structure of Ge/Si(111) During Solid-Phase Epitaxy Studied by Medium-Energy Ion-Scattering Sumitomo K, Nishioka T, Shimizu N, Shinoda Y, Ogino T |
295 - 300 |
Growth, Structural Characterization, and Stability of Thin Cr/Delta-Mn(001) Superlattices Pohl J, Malang EU, Kohler J, Bucher E |
301 - 304 |
Epitaxial-Growth of Ultrathin MgO Films on Fe(001) Seed Layers Park Y, Fullerton EE, Bader SD |
305 - 313 |
Ion-Beam Epitaxy of Silicon Films in an Ultrahigh-Vacuum Using a Sputtering-Type Metal-Ion Source Matsuoka M, Tohno S |
314 - 326 |
Thermal Relaxation Kinetics of Strained Si/Si1-xGex Heterostructures Determined by Direct Measurement of Mosaicity and Lattice-Parameter Variations Sardela MR, Hansson GV |
327 - 331 |
Charge Separation in an Electron-Cyclotron-Resonance Plasma Inoue M, Nakamura S |
332 - 334 |
Dose-Time Relation in BF3 Plasma Immersion Ion-Implantation Shao JQ, Round M, Qin S, Chan C |
335 - 342 |
Dry-Etching of Titanium Nitride Thin-Films in CF4-O-2 Plasmas Fracassi F, Dagostino R, Lamendola R, Mangieri I |
343 - 348 |
Permanent-Magnet Electron-Cyclotron-Resonance Plasma Source with Remote Window Berry LA, Gorbatkin SM |
349 - 358 |
Study of the Phosphine Plasma Decomposition and Its Formation by Ablation of Red Phosphorus in Hydrogen Plasma Bruno G, Losurdo M, Capezzuto P |
359 - 367 |
Plasma Diagnostics of a Direct-Current Arcjet Diamond Reactor .2. Optical-Emission Spectroscopy Reeve SW, Weimer WA |
368 - 380 |
Global-Model of Ar, O-2, Cl-2, and Ar/O-2 High-Density Plasma Discharges Lee C, Lieberman MA |
381 - 384 |
High-Quality ZnO Thin-Films on InP Substrates Prepared by Radio-Frequency Magnetron Sputtering .1. Material Study Chang SJ, Su YK, Shei YP |
385 - 388 |
High-Quality ZnO Thin-Films on InP Substrates Prepared by Radio-Frequency Magnetron Sputtering .2. Surface-Acoustic-Wave Device Fabrication Chang SJ, Su YK, Shei YP |
389 - 393 |
Optimized Magnetic-Field Shape for Low-Pressure Magnetron Sputtering Kadlec S, Musil J |
394 - 399 |
Substrate Amorphization Induced by the Sputter-Deposition Process - Geometrical Aspects Valeri S, Altieri S, Didomenico T, Verucchi R |
400 - 405 |
Determination of the Ion Velocity in a Radio-Frequency Ion-Beam by Laser-Induced Fluorescence Brockhaus A, Yuan Y, Engemann J |
406 - 411 |
Adherent Carbon-Film Deposition by Cathodic Arc with Implantation Gerstner EG, Mckenzie DR, Puchert MK, Timbrell PY, Zou J |
412 - 420 |
Mechanism of Surface Charging During CO2 Jet Spray Cleaning Hills MM |
421 - 427 |
Enhancement of Thickness Uniformity of Thin-Films Grown by Pulsed-Laser Deposition Fernandez FE |
428 - 435 |
Relative Importance of Bombardment Energy and Intensity in Ion Plating Fancey KS, Porter CA, Matthews A |
436 - 441 |
Role of Residual Casting Solvent in Determining the Lithographic and Dissolution Behavior of Poly(Methylmethacrylate) Criss R, Cunningham AJ |
442 - 447 |
Gas-Distribution Through Injection Manifolds in Vacuum-Systems Theil JA |
448 - 450 |
Performance of an Ionization Gauge with a Large-Angle Ion Deflector .2. Mass Analysis of Residual-Gas and Electron-Stimulated Desorption Ions Satou T, Oshima C |
451 - 461 |
Outgassing Rate of Preconditioned Vacuum-Systems After Short Exposure to the Atmosphere - Outgassing Rate Measurements on Viton-A and Copper Dayton BB |
462 - 466 |
Flux Dependence of in-Situ Electron-Transport in Ag/Si(111) Kimberlin KR, Tringides MC |
467 - 475 |
Modeling the Pump-Down of a Reversibly Adsorbed Phase .1. Monolayer and Submonolayer Initial Coverage Redhead PA |
476 - 480 |
Plasma-Enhanced Chemical-Vapor-Deposition of SiO2 Using Novel Alkoxysilane Precursors Bogart KH, Dalleska NF, Bogart GR, Fisher ER |
481 - 484 |
A New Method to Obtain Cu Films with Lower Resistivity and Higher Interface Adhesion on Different Substrates Yang J, Wang C, Tao K, Fan YD |
485 - 487 |
Comments on the Stability of Bayard-Alpert Ionization Gauges Tilford CR, Filippelli AR, Abbott PJ |
488 - 492 |
Auger-Electron Spectroscopy Characterization of Aluminum-Alloy Exposed to Synchrotron-Radiation Momose T, Asano K, Ohta N, Kanda Y, Ishimaru H |
493 - 496 |
Sample Manipulator Employing a Gas-Thermal Switch Designed for High-Pressure Experiments in an Ultrahigh-Vacuum Apparatus Sneh O, George SM |
497 - 500 |
Low Outgassing Residual-Gas Analyzer with a Beryllium-Copper-Alloy-Flanged Ion-Source Watanabe F, Kasai A |