1973 - 1980 |
Particle-Emission Debris from a KrF Laser-Plasma X-Ray Source Bobkowski R, Fedosejevs R |
1981 - 1985 |
Formation of Polytetrafluoroethylene Thin-Films by Using CO2-Laser Evaporation and XeCl Laser-Ablation Inayoshi M, Hori M, Goto T, Hiramatsu M, Nawata M, Hattori S |
1986 - 1994 |
Synthesis and Deposition of Silicon-Nitride Films by Laser Reactive Ablation of Silicon in Low-Pressure Ammonia - A Parametric Study Mihailescu IN, Lita A, Teodorescu VS, Gyorgy E, Alexandrescu R, Luches A, Martino M, Barborica A |
1995 - 1998 |
YBa2Cu3O7-X, Thin-Film over 3 in - Substrate Using Off-Axis Excimer-Laser Deposition Nagaishi T, Itozaki H |
1999 - 2003 |
Behavior of Si Atoms in a Silane Electron-Cyclotron-Resonance Plasma at High Dissociations Yamamoto Y, Hori M, Goto T, Hiramatsu M |
2004 - 2010 |
Fluorocarbon Radicals and Surface-Reactions in Fluorocarbon High-Density Etching Plasma .1. O-2 Addition to Electron-Cyclotron-Resonance Plasma Employing Chf3 Takahashi K, Hori M, Goto T |
2011 - 2019 |
Fluorocarbon Radicals and Surface-Reactions in Fluorocarbon High-Density Etching Plasma .2. H-2 Addition to Electron-Cyclotron-Resonance Plasma Employing Chf3 Takahashi K, Hori M, Goto T |
2020 - 2025 |
Relating Electric-Field Distribution of an Electron-Cyclotron-Resonance Cavity to Dry-Etching Characteristics Ko KK, Pang SW, Dahimene M |
2026 - 2038 |
Ion Desorption Stability in Superconducting High-Energy Physics Proton Colliders Turner WC |
2039 - 2047 |
Diamond-Like Carbon-Film Synthesized by Ion-Beam-Assisted Deposition and Its Tribological Properties He XM, Li WZ, Li HD |
2048 - 2055 |
Radio-Frequency Matching for Helicon Plasma Sources Rayner JP, Cheetham AD, French GN |
2056 - 2061 |
Reactive Ion-Beam-Assisted Deposition of Zirconium Oxyfluoride Thin-Films Gibson UJ, Cornett KD |
2062 - 2070 |
Study of Surface-Reactions During Plasma-Enhanced Chemical-Vapor-Deposition of SiO2 from SiH4, O-2, and Ar Plasma Han SM, Aydil ES |
2071 - 2082 |
Reactor Modeling for Radio-Frequency Plasma Deposition of Sinxhy - Comparison Between 2 Reactor Designs Caquineau H, Dupont G, Despax B, Couderc JP |
2083 - 2087 |
Cfx Radical Generation by Plasma Interaction with Fluorocarbon Films on the Reactor Wall Miyata K, Hori M, Goto T |
2088 - 2093 |
Sioxny Films Deposited by Remote Plasma-Enhanced Chemical-Vapor-Deposition Using Sicl4 Sanchez O, Aguilar MA, Falcony C, Martinezduart JM, Albella JM |
2094 - 2101 |
Electron-Beam Controlled Radio-Frequency Discharges for Plasma Processing Kushner MJ, Collison WZ, Ruzic DN |
2102 - 2105 |
Vacuum-Ultraviolet Emission from Radio-Frequency Plasmas of SF6 and CF4 Li J, Mcconkey JW |
2106 - 2112 |
Probe for Measuring Ion-Beam Angular-Distribution Kahn JR, Kaufman HR, Phillips CA, Robinson RS |
2113 - 2121 |
Spatial Distributions of Electron-Density and Electron-Temperature in Direct-Current Glow-Discharge Tao WH, Prelas MA, Yasuda HK |
2122 - 2126 |
Analysis of Pulse-Time Modulated High-Density Discharges Meyyappan M |
2127 - 2137 |
Fluorocarbon High-Density Plasmas .7. Investigation of Selective SiO2-to-Si3N4 High-Density Plasma Etch Processes Zhang Y, Oehrlein GS, Bell FH |
2138 - 2150 |
Ion-Assisted Si/Xef2-Etching - Influence of Ion/Neutral Flux Ratio and Ion Energy Vugts MJ, Hermans LJ, Beijerinck HC |
2151 - 2157 |
Role of Nitrogen in the Downstream Etching of Silicon-Nitride Blain MG, Meisenheimer TL, Stevens JE |
2158 - 2162 |
Negative-Ion Density in Inductively-Coupled Chlorine Plasmas Hebner GA |
2163 - 2168 |
Characterization of Helicon Wave Plasma Designed for Direct-Current Sputtering Zhang JQ, Setsuhara Y, Ariyasu T, Miyake S |
2169 - 2174 |
Origin of Stresses in Sputtered Elemental and Alloy Thin-Films Hudson C, Somekh RE |
2175 - 2181 |
Electrostatic Scattering of Ionic Species in Low-Pressure Sputtering of Ti and Tin Backhouse CJ, Robbie K, Parks J, Broughton JN, Dew S, Este G, Brett MJ |
2182 - 2186 |
Discharge Characteristics of a Facing Target Sputtering Device Using Unbalanced Magnetrons Muralidhar GK, Musil J, Kadlec S |
2187 - 2191 |
High-Rate Magnetron Sputtering Musil J, Rajsky A, Bell AJ, Matous J, Cepera M, Zeman J |
2192 - 2201 |
Oxidation-Enhanced Roughening of Thin Co Films During Sputtering by O-2(+) Ions Mohadjeri B, Petravic M, Svensson BG |
2202 - 2206 |
Microstructure of Radio-Frequency Sputtered Ag1-Xsix Alloys Leedy KD, Rigsbee JM |
2207 - 2214 |
Reactive Sputter-Deposition and Characterization of Lead-Oxide Films Pauleau Y, Harry E |
2215 - 2219 |
Characteristics of Reactively Sputtered Pt-SnO2 Thin-Films for Co Gas Sensors Digiulio M, Micocci G, Serra A, Tepore A, Rella R, Siciliano R |
2220 - 2230 |
Postdeposition Annealing of Radio-Frequency Magnetron-Sputtered ZnO Films Puchert MK, Timbrell PY, Lamb RN |
2231 - 2234 |
Computational Modeling of Reactive Gas Modulation in Radio-Frequency Reactive Sputtering Sekiguchi H, Murakami T, Kanzawa A, Imai T, Honda T |
2235 - 2237 |
Compact-Heating Stage for Use in Sputtering in Active Oxygen Gas Environments Igarashi Y, Fujino Y, Takahashi T |
2238 - 2242 |
Low-Temperature Growth of Aluminum Nitride Thin-Films on Silicon by Reactive Radio-Frequency Magnetron Sputtering Cheng CC, Chen YC, Wang HJ, Chen WR |
2243 - 2246 |
Physical-Properties and Chemical-States of RF Sputter-Deposited Siwox Films Shibata I, Nishide T, Hasegawa T |
2247 - 2250 |
Formation of High-Temperature Phases in Sputter-Deposited Ti-Based Films Below 100-Degrees-C Musil J, Bell AJ, Vlcek J, Hurkmans T |
2251 - 2256 |
Cu(in,Ga)Se-2 Thin-Films and Solar-Cells Prepared by Selenization of Metallic Precursors Basol BM, Kapur VK, Halani A, Leidholm CR, Sharp J, Sites JR, Swartzlander A, Matson R, Ullal H |
2257 - 2262 |
Analysis of Aluminum Nitride Epitaxial-Growth by Low-Pressure Metal-Organic Chemical-Vapor-Deposition Buggeln RC, Meyyappan M, Shamroth SJ |
2263 - 2268 |
Preparation and Characterization of a Well-Ordered Surface on a Si(001) Substrate with a Buried Metal Layer for Application of Infrared Reflection Spectroscopy Kobayashi Y, Sumitomo K, Prabhakaran K, Ogino T |
2269 - 2274 |
Investigation of Deep Levels in ZnSe-Cl Films Grown by Molecular-Beam Epitaxy Hernandez L, Demelo O, Melendezlira M, Riveraalvarez Z, Hernandezcalderon I |
2275 - 2281 |
Surface-Extended X-Ray-Absorption Fine-Structure Study of Silicon Deposited Onto GaAs(110) Hasnaoui ML, Flank AM, Pompa M, Lagarde P |
2282 - 2288 |
Adsorption Controlled Si((1-X))Ge-X Growth During Chemical-Vapor-Deposition Kuhne H, Fischer A, Morgenstern T, Zaumseil P |
2289 - 2302 |
Visualization of a Buried Organic Interlace by Imaging Time-of-Flight Secondary-Ion Mass-Spectrometry and Scanning Auger Microprobe of an Ion-Beam Crater Edge Schamberger PC, Jones GL, Gardella JA, Mckeown PJ, Davis LE |
2303 - 2307 |
Cleaning Thin-Film Diamond Surfaces for Device Fabrication - An Auger-Electron Spectroscopic Study Baral B, Chan SS, Jackman RB |
2308 - 2314 |
Isothermal Hydrogen Desorption from the Diamond (100)2X1 Surface Mcgonigal M, Kempel ML, Hammond MS, Jamison KD |
2315 - 2324 |
Time-Resolved Mass-Spectrometry in Rough Vacuum Environment Laimer J, Schnabl O, Schwarzler CG, Stori H |
2325 - 2330 |
Thermal-Stability of Photochemical Native-Oxide Films on Hg1-xCdxTe Winton GH, Warrington N, Faraone L |
2331 - 2336 |
Numerical Ellipsometry - Applications of a New Algorithm for Real-Time, in-Situ Film Growth Monitoring Urban FK, Comfort JC |
2337 - 2342 |
Molecular-Beam Sampling to Analyze the Reaction-Mechanism of Chemical-Vapor-Deposition Tsutsumi Y, Ikegawa M, Usui T, Ichikawa Y, Watanabe K, Kobayashi J |
2343 - 2350 |
Infrared Diode-Laser Absorption-Spectroscopy Measurements of Cfx (X=1-3) Radical Densities in Electron-Cyclotron Employing C4F8, C2F6, CF4, and Chf3 Gases Miyata K, Hori M, Goto T |
2351 - 2355 |
Atomic-Force Microscopy of Amorphous Hydrogenated Carbon-Nitrogen Films Deposited by Radio-Frequency-Plasma Decomposition of Methane-Ammonia Gas-Mixtures Prioli R, Zanette SI, Caride AO, Franceschini DF, Freire FL |
2356 - 2360 |
In-Situ Wafer Temperature Monitoring of Silicon Etching Using Diffuse-Reflectance Spectroscopy Booth JL, Beard BT, Stevens JE, Blain MG, Meisenheimer TL |
2361 - 2365 |
Relative Sensitivity Factors of B Related to SiGe Alloy Composition on Secondary-Ion Mass-Spectrometry with an Oxygen Primary Ion-Beam Fujinaga K |
2366 - 2371 |
Surface Chemical-Reaction Between Polycarbonate and Kilo-Electron-Volt Energy Ar+ Ion in Oxygen Environment Choi WK, Koh SK, Jung HJ |
2372 - 2377 |
Interaction of Water with Clean and Gallium Precovered Fe(111) Surfaces Jiang P, Zappone MW, Bernasek SL, Robertson A |
2378 - 2391 |
Microtribological Studies of Unlubricated and Lubricated Surfaces Using Atomic-Force Friction Force Microscopy Koinkar VN, Bhushan B |
2392 - 2404 |
Comparison of Submicron Particle Analysis by Auger-Electron Spectroscopy, Time-of-Flight Secondary-Ion Mass-Spectrometry, and Secondary-Electron Microscopy with Energy-Dispersive X-Ray Spectroscopy Childs KD, Narum D, Lavanier LA, Lindley PM, Schueler BW, Mulholland G, Diebold AC |
2405 - 2413 |
Recoil Spectrometry of Thin-Film Reactions in the Pd/InP System Persson L, Elbouanani M, Hult M, Jonsson P, Whitlow HJ, Andersson M, Georgsson K, Bubb IF, Johnston PN, Walker SR, Cohen DD, Dytlewski N, Zaring C, Ostling M |
2414 - 2417 |
Focusing Glass-Capillary Array Molecular-Beam Inlet for a High-Sensitivity Mass-Spectrometer System Ma Y, Liu BY, Lee HS, Mauersberger K, Morton J |
2418 - 2426 |
Physical-Properties of Diamond-Like Carbon-Films Deposited in Mixed Atmospheres of C2H4-Ar, C2H4-H-2, and C2H4-N-2 Nakayama M, Matsuba Y, Shimamura J, Yamamoto Y, Chihara H, Kato H, Maruyama K, Kamata K |
2427 - 2432 |
Conductance and Leakage in Superconducting Tunnel-Junctions Goodchild MS, Barber ZH, Blamire MG |
2433 - 2436 |
Schottky-Barrier at the Au/Gap(110) Interface Fanfoni M, Goletti C, Chiaradia P, Ng W, Cerrina F, Hwu Y, Terrasi A, Margaritondo G |
2437 - 2442 |
Characterization of as-Grown and Annealed Thin SiO2-Films Formed in 0.1 M HCl Allegretto EM, Bardwell JA |
2443 - 2447 |
Solid-Phase Epitaxy with X-Ray-Irradiation Using a Compact Synchrotron-Radiation Source Aurora Katoh T, Yamada H, Sato F, Hirano Y, Chikawa J |
2448 - 2453 |
Electronic States of a Clean Si(110) 16X2 Surface Studied by Angle-Resolved Photoemission and Surface Differential Reflectivity Cricenti A, Nesterenko B, Perfetti P, Lelay G, Sebenne C |
2454 - 2461 |
Effect of a Surface-Layer on the Stress-Relaxation of Thin-Films Thouless MD, Rodbell KP, Cabral C |
2462 - 2469 |
Residual Macroscopic Stress in Highly Preferentially Oriented Titanium Nitride Coatings Deposited on Various Steel Types Quaeyhaegens C, Knuyt G, Stals LM |
2470 - 2474 |
Changes in Refractive-Index and in Chemical-State of Synchrotron-Radiation Irradiated Fluorinated Polyimide Films Maruo YY, Sasaki S, Haga T, Kinoshita H, Horiuchi T, Tamamura T |
2475 - 2479 |
Photoelectron-Spectroscopy During Pulsed-Laser Melting of Surfaces Gantner G, Boyen HG, Oelhafen P, Rink K |
2480 - 2482 |
Photoluminescence Measurements in the Phase-Transition Region for CdS Thin-Films Arizacalderon H, Lozadamorales R, Zelayaangel O, Mendozaalvarez JG, Banos L |
2483 - 2487 |
Measurement of the Elastic Stress of Thin-Films Deposited on Gallium-Arsenide Mihailovich RE, Koscica T, Zeto RJ |
2488 - 2492 |
Characterization of Silicon Oxynitride Thin-Films by Infrared Reflection-Absorption Spectroscopy Firon M, Bonnelle C, Mayeux A |
2493 - 2498 |
Strengthening of Al2O3-Based Ceramics by Metalorganic Chemical-Vapor-Deposition Konyashin IY |
2499 - 2504 |
Effects of Y or Gd Addition on the Structures and Resistivities of Al Thin-Films Takayama S, Tsutsui N |
2505 - 2510 |
Formation of Chromium-Oxide on 316L Austenitic Stainless-Steel Ohmi T, Nakagawa Y, Nakamura M, Ohki A, Koyama T |
2511 - 2516 |
Properties of Radio Frequency-Sputtered Alumina Films on Flat and Grooved Substrates Ross CA |
2517 - 2521 |
Characteristics of Cu Thin-Films on a Glass Substrate by Partially-Ionized Beam Deposition at Room-Temperature Yoon YS, Kim KH, Jang HG, Jung HJ, Koh SK |
2522 - 2526 |
Effect of Annealing on Ag Films on Pt(111) Tsay JS, Shern CS |
2527 - 2534 |
High-Temperature Oxidation of Thin Crn Coatings Deposited on Steel Milosev I, Abels JM, Strehblow HH, Navinsek B, Metikoshukovic M |
2535 - 2543 |
Effect of Energetic Particles on the Residual-Stresses in Nonhydrogenated Amorphous-Carbon Films Deposited on Grounded Substrates by de Magnetron Sputtering Mounier E, Pauleau Y |
2544 - 2546 |
Surface Flatness of Polished Metal Single-Crystals Tripa CE, Yates JT |
2547 - 2550 |
Growth Dynamics and Surface Fine-Structure of ZnO Ultrafine Particle Films Zhao DC, Qu ZK, Pan XR |
2551 - 2553 |
Direct Observation of Beta-Tah Phase Precipitation in Tantalum-Hydrogen Solid-Solution Chen CL, Zhou DS, Mitchell TE, Ye HQ |
2554 - 2563 |
Growth of Ultrathin Crystalline Al2O3 Films Ore Ru(0001) and Re(0001) Surfaces Wu YT, Garfunkel E, Madey TE |
2564 - 2569 |
Solid-State Reaction of Ti and Ni Thin-Films with Aluminum Nitride He XJ, Tao K, Fan YD |
2570 - 2576 |
Whiskers Grown on Aluminum Thin-Films During Heat-Treatments Hinode K, Homma Y, Sasaki Y |
2577 - 2581 |
Granular Superconductor Contacts to 2-Dimensional Electron Gases Marsh AM, Williams DA |
2582 - 2591 |
A Critical-Evaluation of Thermal Mass-Flow Meters Tison SA |
2592 - 2598 |
Measurements of the Tangential Momentum Accommodation Coefficient in the Transition-Flow Regime with a Spinning Rotor Gauge Gabis DH, Loyalka SK, Storvick TS |
2599 - 2609 |
Effects of Readsorption on Outgassing Rate Measurements Redhead PA |
2610 - 2617 |
Miniature Peristaltic Vacuum Pump for Use in Portable Instruments Piltingsrud HV |
2618 - 2623 |
Synchrotron-Radiation-Induced Gas Desorption from a Prototype Large Hadron Collider Beam Screen at Cryogenic Temperatures Calder R, Grobner O, Mathewson AG, Anashin VV, Dranichnikov A, Malyshev OB |
2624 - 2626 |
Vacuum Chamber for the Wiggler of the Taiwan Light-Source at the Synchrotron-Radiation Research-Center Wang DJ, Chen JR, Hsiung GY, Shyy JG, Huang JR, Hsu SN, Hsiao KM, Liu YC |
2627 - 2635 |
Rarefied-Gas Flow-Through a Long Tube at Any Temperature Ratio Sharipov F |
2636 - 2640 |
Outgassing Rate Characteristic of a Stainless-Steel Extreme High-Vacuum System Chun I, Cho BL, Chung SM |
2641 - 2644 |
Outgassing from Aluminum Surface-Layer Induced by Synchrotron-Radiation Ota N, Kanazawa K, Kobayashi M, Ishimaru H |
2645 - 2650 |
Secondary-Ion Mass-Spectroscopy Resolution with Ultra-Low Beam Energies Clegg JB, Smith NS, Dowsett MG, Theunissen MJ, Deboer WB |
2651 - 2654 |
Preparation of Crystalline Beta-Barium Borate (Beta-BaB2O4) Thin-Films by Opposed-Targets Magnetron Sputtering Liao HB, Xiao RF, Yu P, Wong GK, Zheng JQ |
2655 - 2658 |
Compact Electron-Cyclotron-Resonance Plasma Source for Molecular-Beam Epitaxy Applications Rossner U, Brunlecunff D, Barski A, Daudin B |
2659 - 2661 |
IBM Personal-Computer Data-Acquisition and Processing System to Upgrade an Out-of-Date Mass-Spectrometer Callejas RL, Cardenas MJ, Cruz GC, Lugo LM, Alarcon EC, Alvarado RV, Gonzalez MG, Orta AF |
2662 - 2665 |
Thermal-Stability of Rapidly Annealed CoSi2/N-GaAs and CoSi2/P-InP Schottky Contacts Eftekhari G |
2666 - 2668 |
Temperature-Dependence of A-C-H Film Deposition in a CH4 Radio-Frequency Plasma Mutsukura N, Saitoh K |
2669 - 2670 |
Minimum Profile Ultrahigh-Vacuum Gate Valve Based on Linear/Rotary Motion Feedthrough Stolow A |
2671 - 2673 |
Simple, Efficient Technique for Exposing Surfaces to Hydrogen-Atoms Bermudez VM |
2674 - 2676 |
Hollow-Cathode Assisted Sputtering Backhouse CJ, Dew SK, Brett MJ |
2677 - 2679 |
Cheap and Stable Titanium Source for Use in Oxide Molecular-Beam Epitaxy Systems Theis CD, Schlom DG |
2680 - 2680 |
Modeling the Pump-Down of a Reversibly Adsorbed Phase .1. Monolayer and Submonolayer Coverage (Vol 13, Pg 467, 1995) Redhead PA |
2680 - 2680 |
Dynamic Rate and Thickness Metrology During Poly-Si Rapid Thermal Chemical-Vapor-Deposition from SiH4 Using Real-Time in-Situ Mass-Spectrometry (Vol 14, Pg 267, 1996) Tedder LL, Rubloff GW, Conaghan BF, Parsons GN |