| IV - VI |
50 years of science, technology, and the AVS (1953-2003) an introduction
Dylla F, Redhead P |
| S1 - S6 |
Measurement of vacuum; 1950-2003
Redhead PA |
| S7 - S11 |
Fifty years of vacuum science
Hobson JP |
| S12 - S14 |
Vacuum science and technology: 1950-2003
Redhead PA |
| S15 - S18 |
Major advances in transfer pumps: 1953-2003
Hablanian MH |
| S19 - S24 |
Major advances in capture pumps in the last 50 years
Welch KM |
| S25 - S33 |
Development of ultrahigh and extreme high vacuum technology for physics research
Dylla HF |
| S34 - S35 |
Surface science 1964-2003
Duke CB |
| S36 - S41 |
Inelastic collisions of electrons and positrons in solids and the dawn of surface science
Duke CB |
| S42 - S53 |
Growth and trends in Auger-electron spectroscopy and x-ray photoelectron spectroscopy for surface analysis
Powell CJ |
| S54 - S63 |
Transition from reciprocal-space to real-space surface science-advent of the scanning tunneling microscope
Lagally MG |
| S64 - S70 |
Surface theory moves into the real world
Feibelman PJ |
| S71 - S73 |
Transitioning from the art to the science of thin films: 1964 to 2003
Greene JE |
| S74 - S87 |
Thin film deposition with physical vapor deposition and related technologies
Rossnagel SM |
| S88 - S95 |
Chemical methods of thin film deposition: Chemical vapor deposition, atomic layer deposition, and related technologies
Crowell JE |
| S96 - S109 |
Nucleation theory and the early stages of thin film growth
Ratsch C, Venables JA |
| S110 - S116 |
Morphological instabilities in thin-film growth and etching
Cahill DG |
| S117 - S128 |
Microstructural evolution during film growth
Petrov I, Barna PB, Hultman L, Greene JE |
| S129 - S130 |
Plasma science and technology: 50 years of progress
Cecchi JL, Cecchi LM |
| S131 - S138 |
Impact of plasma processing on integrated circuit technology migration: From 1 mu m to 100 nm and beyond
Tachi S |
| S139 - S144 |
Application-driven development of plasma source technology
Hopwood J, Mantei TD |
| S145 - S151 |
Plasma-surface interactions
Chang JP, Coburn JW |
| S152 - S156 |
Influence of modeling and simulation on the maturation of plasma technology: Feature evolution and reactor design
Graves DB, Kushner MJ |
| S157 - S159 |
Electronic materials and processing: 1979-2003
Brillson LJ |
| S160 - S166 |
Electronic materials growth: A retrospective and look forward
Tu CW |
| S167 - S174 |
Progress in electronic materials characterization
Holloway PH |
| S175 - S181 |
American Vacuum Society leadership in electronic materials processing: Past, present, and future
Lucovsky G, Rubloff G |
| S182 - S190 |
Electronic materials theory: Interfaces and defects
Van de Walle CG |
| S191 - S193 |
Nanoscience and its relationship to the AVS
Murday JS |
| S194 - S206 |
Materials in nanotechnology: New structures, new properties, new complexity
Bonnell DA |
| S207 - S215 |
Nanofabrication
Marrian CRK, Tennant DM |
| S216 - S221 |
Nanostructure science and technology: Impact and prospects for biology
Craighead HG |
| S222 - S223 |
From metallurgical coatings to surface engineering
Sproul WD |
| S224 - S231 |
Plasma-based physical vapor deposition surface engineering processes
Matthews A |
| S232 - S240 |
Role of third bodies in friction and wear of protective coatings
Singer IL, Dvorak SD, Wahl KJ, Scharf TW |
