1835 - 1839 |
Mass spectrometric studies of low pressure CH4, CH4/H-2, and H-2 plasma beams generated by an inductively coupled radio frequency discharge Okada K, Komatsu S |
1840 - 1845 |
Investigation of the hydrogenation properties of Zr films under unclean plasma conditions Shi LQ, Yan GQ, Zhou JY, Luo SZ, Peng SM, Ding W, Long XG |
1846 - 1849 |
Electron emission suppression characteristics of molybdenum grids coated with carbon film by ion beam assisted deposition Liu XG, Ren C, Jiang BY, Zhu H, Liu YY, Wu JX |
1850 - 1854 |
Investigation and simulation of XeF2 isotropic etching of silicon Bahreyni B, Shafai C |
1855 - 1859 |
Quantitative analysis of annealing-induced structure disordering in ion-implanted amorphous silicon Cheng JY, Gibson JM, Baldo PM, Kestel BJ |
1860 - 1866 |
Thermal stability of Pr2O3 films grown on Si(100) substrate Goryachko A, Liu JP, Kruger D, Osten HJ, Bugiel E, Kurps R, Melnik V |
1867 - 1876 |
Angle-resolved x-ray photoelectron spectroscopy of ultrathin Al2O3 films grown by atomic layer deposition Renault O, Gosset LG, Rouchon D, Ermolieff A |
1877 - 1885 |
Investigation of thermal flux to the substrate during sputter deposition of aluminum Ekpe SD, Dew SK |
1886 - 1890 |
Structural and luminescent properties of ZnTe film grown on silicon by metalorganic chemical vapor deposition Shan CX, Fan XW, Zhang JY, Zhang ZZ, Wang XH, Ma JG, Lu YM, Liu YC, Shen DZ, Kong XG, Zhong GZ |
1891 - 1897 |
Wet chemical etching studies of Zr and Hf-silicate gate dielectrics Quevedo-Lopez MA, El-Bouanani M, Wallace RM, Gnade BE |
1898 - 1902 |
A biaxial rotation for depositing homogeneous large-area double-sided YBa2Cu3O7-x thin films Tao BW, Li YR, Liu XZ, He SM, Geerk J |
1903 - 1910 |
Thermal reaction of nickel and Si0.75Ge0.25 alloy Pey KL, Choi WK, Chattopadhyay S, Zhao HB, Fitzgerald EA, Antoniadis DA, Lee PS |
1911 - 1915 |
Time development of microstructure and resistivity for very thin Cu films Rossnagel SM, Kuan TS |
1916 - 1920 |
Effects of plasma exposure on structural and optical properties of TiO2 films deposited by off-axis target sputtering Takahashi T, Nakabayashi H, Mizuno V |
1921 - 1926 |
Microstructure and properties of Ti-Si-N nanocomposite films Hu XP, Han ZG, Li GY, Gu MY |
1927 - 1933 |
Anomalies in modeling of anisotropic etching of silicon: Facet boundary effects Elalamy Z, Landsberger LM, Pandy A, Kahrizi M, Stateikina I, Michel S |
1934 - 1938 |
Growth of Be2C(100) films on Be(0001) substrate using C-60 as precursor Tzeng CT, Yuh JY, Lo WS, Chu RY, Tsuei KD |
1939 - 1947 |
Characterization of Pb(Zr, Ti)O-3 thin films fabricated by plasma enhanced chemical vapor deposition on Ir-based electrodes Lee HC, Lee WJ |
1948 - 1954 |
Correlation of surface chemistry of GaAs substrates with growth mode and stacking fault density in ZnSe epilayers Hong SK, Chang JH, Hanada T, Kurtz E, Oku M, Yao T |
1955 - 1963 |
Plasma polymerization and deposition of linear, cyclic and aromatic fluorocarbons on (100)-oriented single crystal silicon substrates Yang GH, Oh SW, Kang ET, Neoh KG |
1964 - 1968 |
Studies on electron behaviors at downstream region of a neutral loop discharge plasma Sakoda T, Sung YM |
1969 - 1973 |
Electron-temperature control in 915 MHz electron cyclotron resonance plasma Itagaki N, Kawai Y, Kawakami S, Ishii N |
1974 - 1982 |
Integrated AlN/diamond heat spreaders for silicon device processing Yoganand SN, Jagannadham K, Karoui A, Wang H |
1983 - 1988 |
Study on the characteristics of aluminum thin films prepared by atomic layer deposition Lee YJ, Kang SW |
1989 - 1996 |
Low-temperature Ar/N-2 remote plasma nitridation of SiO2 thin films Khandelwal A, Niimi H, Lucovsky G, Lamb HH |
1997 - 2003 |
Subsurface interstitials as promoters of three-dimensional growth of Ti on Si(111): An x-ray standing wave, x-ray photoelectron spectroscopy, and atomic force microscopy investigation Kuri G, Schmidt T, Hagen V, Materlik G, Wiesendanger R, Falta J |
2004 - 2006 |
Highly < 100 >-oriented growth of polycrystalline silicon films on glass by pulsed magnetron sputtering Reinig P, Selle B, Fenske F, Fuhs W, Alex V, Birkholz M |
2007 - 2017 |
Epitaxial growth of metastable delta-TaN layers on MgO(001) using low-energy, high-flux ion irradiation during ultrahigh vacuum reactive magnetron sputtering Shin CS, Kim YW, Hellgren N, Gall D, Petrov I, Greene JE |
2018 - 2022 |
In situ pressure measurements in small gettered volumes Nemanic V, Zumer M, Zajec B |
2023 - 2026 |
Structural, electronic and magnetic properties of chalcopyrite magnetic semiconductors: A first-principles study Picozzi S, Continenza A, Zhao YJ, Geng WT, Freeman AJ |
2027 - 2031 |
Temperature effect on growth of well-ordered thin Al2O3 film on NiAl(110) Lay TT, Yoshitake M, Mebarki B |
2032 - 2041 |
Spatial survey of a magnetron plasma sputtering system using a Langmuir probe Field DJ, Dew SK, Burrell RE |
2042 - 2048 |
Effect of carbon enrichment induced by photoresist on highly selective SiO2 etching Chu C, Chi KK, Moon JT |
2049 - 2051 |
Creation of stable, low work function surfaces on Si by implantation of 3 keV Cs+ Musket RG, Balooch M |
2052 - 2061 |
Fluorocarbon-based plasma etching of SiO2: Comparison of C4F6/Ar and C4F8/Ar discharges Li X, Hua XF, Ling L, Oehrlein GS, Barela M, Anderson HM |
2062 - 2067 |
Column angle variations in porous chevron thin films Harris KD, Vick D, Smy T, Brett MJ |
2068 - 2071 |
Observation of step-flow growth in femtosecond pulsed laser deposition of Si on Si(100)-2X1 Hegazy MS, Elsayed-Ali HE |
2072 - 2074 |
Surface morphology of ion-beam deposited carbon films under high temperature Liao MY, Chai CL, Yang SY, Liu ZK, Qin FG, Wang ZG |
2075 - 2078 |
Study on time of flight property of uniform magnetic sector field analyzers up to the third-order approximation Cheng M, Tang TT, Yao ZH, Wang ZH |
2079 - 2083 |
Multiple cavity modes in the helicon plasma generated at very high radio frequency Eom GS, Choe W |
2084 - 2095 |
Correlation between structure, stress and deposition parameters in direct current sputtered zinc oxide films Kappertz O, Drese R, Wuttig M |
2096 - 2100 |
Atomic layer deposition of zirconium silicate films using zirconium tetrachloride and tetra-n-butyl orthosilicate Kim WK, Kang SW, Rhee SW, Lee NI, Lee JH, Kang HK |
2101 - 2105 |
Photoelastic modulation-reflection absorption infrared spectroscopy of CO on Pd(111) Stacchiola D, Thompson AW, Kaltchev M, Tysoe WT |
2106 - 2114 |
Plasma-surface kinetics and simulation of feature profile evolution in Cl-2+HBr etching of polysilicon Jin WD, Vitale SA, Sawin HH |
2115 - 2118 |
Dramatic change of electrical properties in La-Ba-Mn-O thin films prepared using bias sputtering Lee JC, Ie SY, Park SI, Yi YJ, Jang GI, Song HS, You DG, Jeong K |
2119 - 2122 |
Conductance calculation of a long tube with equilateral triangle cross section Fan P, Chu JG, Shao JD |
2123 - 2130 |
Effect of surface polymerization on plasma and process stability in polycrystalline-silicon etching Xu SL, Lill T, Deshmukh S, Joubert O |
2131 - 2133 |
High-sensitivity x-ray photoelectron spectroscopy characterization of a quantum device structure Wintrebert-Fouquet M, Butcher KSA |
2134 - 2136 |
Low temperature deposition of alpha-Al2O3 thin films by sputtering using a Cr2O3 template Jin P, Xu G, Tazawa M, Yoshimura K, Music D, Alami J, Helmersson U |
2137 - 2139 |
Refractive index control of silicon nitride films prepared by radio-frequency reactive sputtering Nayar PS |