483 - 489 |
Investigation of particle formation during the plasma enhanced chemical vapor deposition of amorphous silicon, oxide, and nitride films Rao NP, Wu Z, Nijhawan S, Ziemann P, Campbell S, Kittelson DB, McMurry P |
490 - 495 |
Effects of gas distribution on polysilicon etch rate uniformity for a low pressure, high density plasma Khater MH, Overzet LJ, Cherrington BE |
496 - 499 |
Oxide loss at the gate periphery during high density plasma etching Kraft R, Gupta I, Kinoshita T |
500 - 506 |
Selective SiO2/Si3N4 etching in magnetized inductively coupled C4F8 plasma Lee HJ, Kim JK, Kim JH, Whang KW, Kim JH, Joo JH |
507 - 510 |
Si3N4 on GaAs by direct electron cyclotron resonance plasma assisted nitridation of Si layer in Si/GaAs structure Diatezua DM, Wang Z, Park D, Chen Z, Rockett A, Morkoc H |
511 - 514 |
High-density inductively coupled plasma etching of GaAs/AlGaAs in BCl3/Cl-2/Ar : A study using a mixture design experiment Agarwala S, Horst SC, King O, Wilson R, Stone D, Dagenais M, Chen YJ |
515 - 518 |
Dry etching of InP using a CH3Cl/Ar/H-2 gas mixture with electron-cyclotron-resonance excitation Nozawa H, Shibata T, Tamamura T |
519 - 522 |
Visualization of plasma uniformity in dry etching using the imaging plate Arita K, Etoh M, Asano T |
523 - 531 |
Radial uniformity of an external-coil ionized physical vapor deposition source Dickson M, Zhong G, Hopwood J |
532 - 535 |
Antenna sputtering in an internal inductively coupled plasma for ionized physical vapor deposition Foster JE, Wang W, Wendt AE, Booske J |
536 - 539 |
Etching of 3C-SiC using CHF3/O-2 and CHF3/O-2/He plasmas at 1.75 Torr Fleischman AJ, Zorman CA, Mehregany M |
540 - 543 |
Maskless sub-mu m patterning of silicon carbide using a focused ion beam in combination with wet chemical etching Menzel R, Bachmann T, Wesch W, Hobert H |
544 - 552 |
Lithography with a mask of block copolymer microstructures Harrison C, Park M, Chaikin PM, Register RA, Adamson DH |
553 - 557 |
Study of the influence of gas chemistry on notching in metal etching Tabara S, Kitayama Y, Hatakeyama T, Katsuragi K, Tanabe M |
558 - 560 |
Selective etching of AlGaAs/GaAs structures using the solutions of citric acid H2O2 and de-ionized H2O buffered oxide etch Kim JH, Lim DH, Yang GM |
561 - 564 |
Bromine/methanol wet chemical etching of via holes for InP microwave devices Trassaert S, Boudart B, Piotrowicz S, Crosnier Y |
565 - 569 |
Features of InGaAlAs/InP heterostructures Ramam A, Chua SJ |
570 - 574 |
Investigation of GaAs/AlGaAs multiple quantum well waveguides involving unconfined energy states Chen YH, Chan CH, Jan GJ |
575 - 577 |
Photoluminescence study on twenty GaAs/Al0.3Ga0.7As tilted T-shaped quantum wires fabricated by glancing-angle molecular beam epitaxy Tomita N, Takekawa K, Ohta K, Shimomura S, Hiyamizu S, Fujita K, Egami N, Okamoto Y |
578 - 581 |
Temperature independent lifetime in InAlAs quantum dots Arlett J, Yang F, Hinzer K, Fafard S, Feng Y, Charbonneau S, Leon R |
582 - 588 |
Fabrication and photoluminescence investigation of silicon nanowires on silicon-on-insulator material Gotza M, Dutoit M, Ilegems M |
589 - 598 |
Electrical properties of ion beam sputtered and ion assisted SiO2, SiOxNy, and SiNx films on silicon Lambrinos MF, Valizadeh R, Colligon JS |
599 - 604 |
Epitaxy of Si/Si1-xGex heterostructures with very small roughness using a production-compatible ultrahigh vacuum chemical vapor deposition reactor Lafontaine H, Mason BF, Rolfe SJ, Perovic DD, Bahierathan B |
605 - 608 |
Fourier transform infrared spectroscopy of corona-processed silicon dioxide films Landheer D, Sayedi SM, Landsberger LM, Kahrizi M |
609 - 612 |
Optical reflectance thermometry for rapid thermal processing Guidotti D |
613 - 618 |
Comparative study of back surface field contact formation using different lamp configurations in rapid thermal processing Singh R, Vedagarbha V, Nimmagadda SV, Narayanan S |
619 - 627 |
Roughness of thermal oxide layers grown on ion implanted silicon wafers Iacona F, Raineri V, La Via F, Rimini E |
628 - 632 |
Hot-carrier effects on the scattering parameters of lightly doped drain n-type metal-oxide-semiconductor field effect transistors Kwan WS, Deen MJ |
633 - 644 |
Influence of data analysis and other factors on the short-term stability of vertical scanning-probe microscope calibration measurements Edwards H, Jorgensen JF, Dagata J, Strausser Y, Schneir J |
645 - 650 |
Scanning tunneling microscopy study of reconstruction of 0.8 monolayers Ga on an Si (001) surface Nakada Y, Okumura H |
651 - 653 |
Gated Si field emitter array prepared by using anodization Higa K, Nishii K, Asano T |
654 - 664 |
Experimental and theoretical characterization of integrated field emission nanotips Garcia N, Marques MI, Asenjo A, Correia A |
665 - 669 |
Fabrication of a silicon-vacuum field-emission microdiode with a moving anode Bruschi P, Diligenti A, Iani F, Nannini A, Piotto M |
670 - 673 |
Enhanced degradation of gate oxide in negative-gas plasma during reactive ion etching Arita K, Takihara H, Asano T |
677 - 677 |
Papers from the Tenth International Vacuum Microelectronics Conference - Preface Lee JD, Jeon DR |
678 - 680 |
Preparation of ultrasharp diamond tip emitters by ion-beam etching Stepanova AN, Givargizov EI, Bormatova LV, Zhirnov VV, Mashkova ES, Molchanov AV |
681 - 683 |
Fabrication of thin-film cold cathodes by a modified chemical vapor deposition diamond process Weiss BL, Badzian A, Pilione L, Badzian T, Drawl W |
684 - 688 |
Effect of sp(2) content and tip treatment an the field emission of micropatterned pyramidal diamond tips Kang WP, Wisitsora-at A, Davidson JL, Kerns DV, Li Q, Xu JF, Kim CK |
689 - 692 |
Field emission energy distribution analysis of wide-band-gap field emitters Schlesser R, McCarson BL, McClure MT, Sitar Z |
693 - 696 |
Modifying chemical vapor deposited diamond films for field emission displays Habermann T, Gohl A, Nau D, Wedel M, Muller G, Christ M, Schreck M, Stritzker B |
697 - 699 |
Study of field electron emission phenomenon associated with N-doped amorphous diamond thin films Chen J, Wei AX, Deng SZ, Lu Y, Zheng XG, Chen DH, Mo D, Peng SQ, Xu NS |
700 - 704 |
Fabrication and simulation of a gated thin film emitter Ko TY, Chung B, Lee JY, Jeon D |
705 - 709 |
Effect of N doping on the electron emission properties of diamondlike carbon film on a 2-in. Mo field emitter array panel Jung JH, Ju BK, Kim H, Oh MH, Chung SJ, Jang J |
710 - 711 |
Influence of silicon tip arrays on effective work function of diamond Yuan G, Jin CC, Zhang BL, Jiang H, Zhou TM, Ning YQ, Wang YZ, Wang WB, Jin YX, Ji H, Gu CZ |
712 - 715 |
Field emission properties of the polycrystalline diamond film prepared by microwave-assisted plasma chemical vapor deposition Kwon SJ, Shin YH, Aslam DM, Lee JD |
716 - 719 |
Electron energy distribution of diamond-coated field emitters Choi WB, Schlesser R, Wojak G, Cuomo JJ, Sitar Z, Hren JJ |
720 - 723 |
Electron emission characteristics of polycrystalline diamond films Sugino T, Kawasaki S, Yokota Y, Iwasaki Y, Shirafuji J |
724 - 728 |
Field emission characteristics of defective diamond films Park KH, Lee S, Song KH, Park JI, Park KJ, Han SY, Na SJ, Lee NY, Koh KH |
729 - 731 |
Field electron emission of diamondlike carbon films deposited by a laser ablation method Hong YK, Kim JJ, Park C, Kim JS, Kim JK |
732 - 735 |
Micropattern-gated diamond field emitter array Kang WP, Wisitsora-at A, Davidson JL, Howell M, Kerns DV, Li Q, Xu JF, Kim CK |
736 - 740 |
Parameters for improving reliability of full color field emission display devices Kim JM, Hong JP, Choi JH, Ryu YS, Hong SS |
741 - 744 |
Vacuum analysis inside a field emission display panel : Experimental and Monte Carlo simulation results Zoulkarneev A, Park NS, Jung JE, Kim JW, Hong JP, Kim JM |
745 - 748 |
High field breakdown characteristics of micrometric gaps in vacuum Ma XY, Sudarshan TS |
749 - 753 |
Field emitter array development for high frequency applications Jensen KL, Abrams RH, Parker RK |
754 - 757 |
Propagation characteristics of a premodulated electron beam Jin JG, Park GS |
758 - 761 |
Field emitter array development for microwave applications. II Spindt CA, Holland CE, Schwoebel PR, Brodie I |
762 - 764 |
Nanometer-scale gap control for low voltage and high current operation of field emission array Lee HI, Park SS, Park DI, Hahm SH, Lee JH, Lee JH |
765 - 769 |
Fabrication of self-aligned silicon field emission devices and effects of surface passivation on emission current Rakhshandehroo MR, Pang SW |
770 - 772 |
Self-aligned Si gate field emitter arrays using the transfer mold technique Sakai T, Ono T, Nakamoto M, Sakuma N |
773 - 776 |
Polycrystalline silicon field emitter arrays by silicidation-sharpening technique at low temperature Lee JH, Song YH, Kang SY, Cho KI, Lee SY, Yoo HJ |
777 - 779 |
Fabrication and characterization of gated porous silicon cathode field emission arrays Jessing JR, Kim HR, Parker DL, Weichold MH |
780 - 782 |
Effect of laser irradiation on electron emission from Si field emitter arrays Takai M, Suzuki N, Morimoto H, Hosono A, Kawabuchi S |
783 - 786 |
Effects of thermal annealing on emission characteristics and emitter surface properties of a Spindt-type field emission cathode Ito F, Konuma K, Okamoto A, Yano A |
787 - 789 |
Fabrication and emission characteristics of GaAs tip and wedge-shaped field emitter arrays by wet etching Ducroquet F, Kropfeld P, Yaradou O, Vanoverschelde A |
790 - 792 |
Electron emission from gated silicide field emitter arrays Takai M, Iriguchi T, Morimoto H, Hosono A, Kawabuchi S |
793 - 795 |
Efficient surface-emitting cold cathodes based on electroluminescent porous silicon diodes Sheng X, Koyama H, Koshida N |
796 - 798 |
Microfabrication and characterization of gridded polycrystalline silicon field emitter devices Huq SE, Huang M, Wilshaw PR, Prewett PD |
799 - 802 |
Effect of gas ambient on improvement in emission behavior of Si field emitter arrays Takai M, Morimoto H, Hosono A, Kawabuchi S |
803 - 806 |
Resonant Fowler-Nordheim tunneling emission from metal-oxide-semiconductor cathodes Mimura H, Abe Y, Ikeda J, Tahara K, Neo Y, Shimawaki H, Yokoo K |
807 - 810 |
Fabrication of metal field emitter arrays for low voltage and high current operation Oh CW, Lee CG, Park BG, Lee JD, Lee JH |
811 - 814 |
Fabrication and characterization of silicon field emitter arrays with focusing electrode by the chemical mechanical polishing process Lee JH, Song YH, Kang SY, Kim SG, Cho KI, Yoo HJ |
815 - 817 |
Analysis of electron emission degradation in silicon field emitter arrays Song YH, Lee JH, Kang SY, Lee YI, Cho KI, Yoo HJ |
818 - 821 |
Tunneling emission from valence band of Si-metal-oxide-semiconductor electron tunneling cathode Ikeda J, Yamada A, Okamoto K, Abe Y, Tahara K, Mimura H, Yokoo K |
822 - 825 |
GaN field emitter array diode with integrated anode Underwood RD, Keller S, Mishra UK, Kapolnek D, Keller BP, DenBaars SP |
826 - 828 |
Characterization of two by two electron-beam microcolumn array aligned with field emission array Park JY, Lera JD, Choi HJ, Buh GH, Kang CJ, Jung JH, Choi SS, Jeon D, Kuk Y |
829 - 832 |
Emission characteristics of ZrN thin film field emitter array fabricated by ion beam assisted deposition technique Nagao M, Fujimori Y, Gotoh Y, Tsuji H, Ishikawa J |
833 - 835 |
Fabrication of GaN field emitter arrays by selective area growth technique Kozawa T, Suzuki M, Taga Y, Gotoh Y, Ishikawa J |
836 - 840 |
Atomic investigation of individual apexes of diamond emitters by a scanning atom probe Nishikawa O, Sekine T, Ohtani Y, Maeda K, Numada Y, Watanabe M |
841 - 850 |
Emission observation of a microtip cathode array with an electrostatic-lens projector : Statistical approach Constancias C, Baptist R |
851 - 854 |
Metal-insulator-semiconductor emitter with an epitaxial CaF2 layer as the insulator Miyamoto Y, Yamaguchi A, Oshima K, Saitoh W, Asada M |
855 - 857 |
Investigation of Ce-doped silicates for low voltage field emission displays Lee RY, Zhang FL, Penczek J, Wagner BK, Yocom PN, Summers CJ |
858 - 861 |
Compositional dependence of luminescence of lithium zinc gallate phosphor Suh KS, Jang SJ, Cho KI, Nahm S, Byun JD |
862 - 865 |
Nanostructured integrated electron source Schoessler C, Koops HWP |
866 - 870 |
Surface application of molybdenum silicide onto gated poly-Si emitters for enhanced field emission performance Uh HS, Park BG, Lee JD |
871 - 874 |
Emission characteristics of TiN-coated silicon field emitter arrays Kang SY, Lee JH, Song YH, Kim YT, Cho KI, Yoo HJ |
875 - 879 |
Reduction of work function on a W(100) field emitter due to co-adsorption of Si and Ti Adachi H, Ashihara K, Saito Y, Nakane H |
880 - 887 |
Arcing and voltage breakdown in vacuum microelectronics microwave devices using field emitter arrays : Causes, possible solutions, and recent progress Charbonnier F |
888 - 894 |
Transient and stationary field emission currents from semiconductors computed by a simple semi-classical method Filip V, Nicolaescu D, Plavitu CN, Okuyama F |
895 - 899 |
Emission stability analysis of cone-shaped metal-insulator-semiconductor cathode by Monte Carlo simulation Ishikawa J, Gotoh Y, Sadakane S, Inoue K, Nagao M, Tsuji H |
900 - 905 |
Model calculations of internal field emission and J-V characteristics of a composite n-Si and N-diamond cold cathode source Lerner P, Miskovsky NM, Cutler PH |
906 - 909 |
Calculation of bulk states contributions to field emission from GaN Chung MS, Yoon BG, Park JM, Cutler PH, Miskovsky NM |
910 - 915 |
Deviations from the Fowler-Nordheim theory and peculiarities of field electron emission from small-scale objects Fursey GN, Glazanov DV |
916 - 919 |
Characteristics and circuit model of a field emission triode Nam JH, Uh HS, Lee JD, Ihm JD, Kim YH, Choi KM |
920 - 922 |
Effective three-dimensional simulation of field emitter array and its optimal design methodology using an evolution strategy Jung JH, Lee B, Lee JD |