Journal of Vacuum Science & Technology B

Journal of Vacuum Science & Technology B, Vol.19, No.6 Entire volume, number list

ISSN: 1071-1023 (Print)

In this Issue (172 articles)

2007 - 2012	Investigation of molecular beam epitaxial NdF3/Si(111) heterostructures by atomic force microscopy and x-ray diffractometry Ko JM, Durbin SD, Fukuda T, Inaba K
2013 - 2019	Polymer pattern formation on SiO2 surfaces using surface monolayer initiated polymerization Chen XH, Tolbert LM, Henderson CL, Hess DW, Ruhe J
2020 - 2025	Deep plasma etching of piezoelectric PZT with SF6 Bale M, Palmer RE
2026 - 2037	Materials aspects, electrical performance, and scalability of Ni silicide towards sub-0.13 mu m technologies Lauwers A, Steegen A, de Potter M, Lindsay R, Satta A, Bender H, Maex K
2038 - 2044	Reduced brightness of the ZrO/W Schottky electron emitter van Veen AHV, Hagen CW, Barth JE, Kruit P
2045 - 2049	Experimental conditions for a highly ordered monolayer of gold nanoparticles fabricated by the Langmuir-Blodgett method Huang SJ, Tsutsui G, Sakaue H, Shingubara S, Takahagi T
2050 - 2056	Modification of polycarbonate and polypropylene surfaces by argon ion cluster beams Biederman H, Slavinska D, Boldyreva H, Lehmberg H, Takaoka G, Matsuo J, Kinpara H, Zemek J
2057 - 2062	Valence band alignment and work function of heteroepitaxial nanocrystals on GaAs(001) Heun S, Watanabe Y, Ressel B, Schmidt T, Prince KC
2063 - 2066	Chemical composition, morphology, and deep level electronic states of GaN (0001) (1X1) surfaces prepared by indium decapping Young AP, Brillson LJ, Naoi Y, Tu CW
2067 - 2072	Improvement of the SiO2/Si interface characteristics by two-step deposition with intermediate plasma treatment using O-2/He gas Yi C, Kim HU, Rhee SW, Oh SH, Park CG
2073 - 2076	In situ submicron patterning with silicon nitride evaporation masks Purbach U, de Lozanne A
2077 - 2081	Parameter extraction for 193 nm chemically amplified resist from refractive index change Sohn YS, Oh HK, An I
2082 - 2088	Characterization of reactive ion etch lag scaling Keil D, Anderson E
2089 - 2094	Initial surface reactions between Cl-2 molecules and the GaAs (001) 2X4 surface Tanaka Y, Ozeki M
2095 - 2103	Study of the surface reactivity of optical fibers under aging conditions by flexural resonance Mertens J, Finot E, Bourillot E, Fabre A, Goudonnet JP
2104 - 2107	Global pattern density effects on aluminum alloy etching for sub-0.25 mu m technology logic devices Baek KH, Kim KH, Hwang CH, Lee DH
2108 - 2113	Investigation of fluorine in dry ultrathin silicon oxides Vereecke G, Rohr E, Carter RJ, Conard T, De Witte H, Heyns MM
2114 - 2118	Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature Howlader MMR, Watanabe T, Suga T
2119 - 2122	Metamorphic In0.52Al0.48As/In0.53Ga0.47As high electron mobility transistors on GaAs with InxGa1-xP graded buffer Yuan K, Radhakrishnan K, Zheng HQ, Ng GI
2123 - 2128	In situ measurement of aspect ratio dependent etch rates of polysilicon in an inductively coupled fluorine plasma Lill T, Grimbergen M, Mui D
2129 - 2132	Ion-assisted etching of W film by an Ar+ beam in XeF2 with the addition of H-2, N-2, or O-2 Ichinose H
2133 - 2136	Etching technique for ruthenium with a high etch rate and high selectivity using ozone gas Nakahara M, Tsunekawa S, Watanabe K, Arai T, Yunogami T, Kuroki K
2137 - 2143	Ultrathin zirconium oxide films as alternative gate dielectrics Chang JP, Lin YS, Berger S, Kepten A, Bloom R, Levy S
2144 - 2148	Ion-implanted photoresist removal using water/carbon dioxide mixtures at elevated temperature and pressure Chavez KL, Bakker GL, Hess DW
2149 - 2154	Interplay of current crowding and current self-quenching effects in planar cold cathodes Modukuru Y, Cahay M
2155 - 2161	Processing and characterization of ultralow-dielectric constant organosilicate Yang S, Pai JCH, Pai CS, Dabbagh G, Nalamasu O, Reichmanis E, Seputro J, Obeng YS
2162 - 2172	Patterning nonflat substrates with a low pressure, room temperature, imprint lithography process Colburn M, Grot A, Choi BJ, Amistoso M, Bailey T, Sreenivasan SV, Ekerdt JG, Willson CG
2173 - 2176	Deep reactive ion etching of silicon carbide Tanaka S, Rajanna K, Abe T, Esashi M
2177 - 2183	Optical and structural studies in InGaN quantum well structure laser diodes Chichibu SF, Azuhata T, Sugiyama M, Kitamura T, Ishida Y, Okumura H, Nakanishi H, Sota T, Mukai T
2184 - 2189	Organic polymeric coatings deposited by plasma enhanced chemical vapor deposition Sabnis RW, Cazeca M, DiMenna WL, Spencer MJ, Guerrero DJ, Sheu MS
2190 - 2194	Electromigration performance of AlCu/Ti and AlCu/Ti/TiN/Ti metallization Kamoshida K
2195 - 2205	Focus latitude enhancement of symmetrical phase mask design for deep submicron contact hole patterning Chou SY, Lou JC, Chen LJ, Shiu LH, Liu RG, Wang CM, Gau TS
2206 - 2211	Optical, electrical, and structural characteristics of yttrium oxide films deposited on plasma etched silicon substrates Araiza JJ, Aguilar-Frutis MA, Falcony C
2212 - 2216	Photoemission study of energy-band alignments and gap-state density distributions for high-k dielectrics Miyazaki S, Miyazaki S
2217 - 2222	Photoluminescence characterization of Si-based nanostructured films produced by pulsed laser ablation Kabashin AV, Meunier M, Leonelli R
2223 - 2230	Etch mechanisms of low dielectric constant polymers in high density plasmas: Impact of charging effects on profile distortion during the etching process Fuard D, Joubert O, Vallier L, Assous M, Berruyer P, Blanc R
2231 - 2236	Etching characteristics and plasma-induced damage of high-k Ba0.5Sr0.5TiO3 thin-film capacitors Wuu DS, Lin CC, Horng RH, Liao FC, Liu YH
2237 - 2239	Structural and optical properties of ternary Cs-Pb-Cl nanoaggregates in thin films Somma F, Aloe P, Lo Mastro S, Santucci S, Giampaolo C, Nikl M, Nitsch K, Fabeni P, Pazzi GP
2240 - 2246	Scaling considerations for high performance 25 nm metal-oxide-semiconductor field effect transistors Saha S
2247 - 2251	Characteristic features of new electron-multiplying channels in a field emission display Yi W, Jeong T, Jin S, Yu SG, Lee J, Heo J, Yoo JB, Kim JM
2252 - 2257	X-ray photoemission spectroscopy study of silicidation of Ti on BF2+-implanted polysilicon Chua HN, Pey KL, Lai WH, Chai JW, Pan JS, Chua DHC, Siah SY
2258 - 2261	Scanning probe microscopy of domains and domain walls in sol-gel PbTiO3 thin films Chen XF, Zhu WG, Liu WG, Wang ZH
2262 - 2267	Automated Xe adsorption technique to measure small Brunauer-Emmett-Teller surface area of several square centimeters Yanazawa H, Furukawa R, Yamamoto S, Suzuki I, Miura K
2268 - 2279	Carrier mobilities and process stability of strained Si n- and p-MOSFETs on SiGe virtual substrates Currie MT, Leitz CW, Langdo TA, Taraschi G, Fitzgerald EA, Antoniadis DA
2280 - 2283	Growth and characterization of Fe(100)/InAs(100) hybrid structures Ohno H, Yoh K, Doi T, Subagyo A, Sueoka K, Mukasa K
2284 - 2288	Structure analysis of Ba2In2O5 and related compounds by electron microscopy Mitome M, Okamoto M, Bando Y, Yamamura H
2289 - 2294	Characteristics of sputtered Ti1-xAlxN films for storage node electrode barriers Park DG, Cha TH, Lee SH, Yeo IS, Park JW, Kim SD
2295 - 2298	Three-dimensional carrier concentration profiles and ionization energy plots for low-temperature GaAs Halder NC, Krishnan V, Baker B
2299 - 2300	Nanostructure patterns written in polycarbonate by a bent optical fiber probe Chen SH, Chen YF
2301 - 2303	Electron-beam CARL resist development for 70 nm direct write Kirch O, Elian K, Falk G
2304 - 2306	Reduction in surface roughness during secondary ion mass spectrometry depth profiling with an ion-milling method Jiang ZX, Backer S, Chen S, Lerma J, Guenther T, Lee JJ, Sieloff D
2319 - 2328	From nanometers to gigaparsecs: The role of nanostructures in unraveling the mysteries of the cosmos Schattenburg ML
2329 - 2334	Low-k(1) optical lithography for 100 nm logic technology and beyond Yen A, Yu SS, Chen JH, Chen CK, Gau TS, Lin BJ
2335 - 2341	Image metrology and system controls for scanning beam interference lithography Chen CG, Konkola PT, Heilmann RK, Pati GS, Schattenburg ML
2342 - 2346	Digital heterodyne interference fringe control system Heilmann RK, Konkola PT, Chen CG, Pati GS, Schattenburg ML
2347 - 2352	Method for reducing hyperbolic phase in interference lithography Walsh ME, Smith HI
2353 - 2356	Immersion lithography at 157 nm Switkes M, Rothschild M
2357 - 2361	Feasibility of utilizing hexamethyidisiloxane film as a bottom antireflective coating for 157 nm lithography Lin CH, Wang LA
2362 - 2365	Demonstration of two-photon lithography Schwarz CJ, Nampoothiri AVV, Jasapara JC, Rudolph W, Brueck SRJ
2366 - 2370	Gratings of regular arrays and trim exposures for ultralarge scale integrated circuit phase-shift lithography Fritze M, Tyrrell B, Astolfi D, Yost D, Davis P, Wheeler B, Mallen R, Jarmolowicz J, Cann S, Chan D, Rhyins P, Carney C, Ferri J, Blachowicz BA
2371 - 2380	Optimization method of the double exposure technique with alt-PSMs for below a 0.13 mu m node Kikuchi K, Ohnuma H, Kawahira H
2381 - 2384	Low-dielectric constant bisbenzo(cyclobutene) and fluorinated poly(arylene)ether films as bottom anti-reflective coating layers for ArF lithography Chen HL, Chu TC, Li MY, Ko FH, Cheng HC, Huang TY
2385 - 2388	Spun-on carbon antireflective layer with etch resistance for deep and vacuum ultraviolet lithography processes Sato Y, Onishi Y, Nakano Y, Hayase S
2389 - 2395	First lithographic results from the extreme ultraviolet Engineering Test Stand Chapman HN, Ray-Chaudhuri AK, Tichenor DA, Replogle WC, Stulen RH, Kubiak GD, Rockett PD, Klebanoff LE, O'Connell D, Leung AH, Jefferson KL, Wronosky JB, Taylor JS, Hale LC, Blaedel K, Spiller EA, Sommargren GE, Folta JA, Sweeney DW, Gullikson EM, Naulleau P, Goldberg KA, Bokor J, Attwood DT, Mickan U, Hanzen R, Panning E, Yan PY, Gwyn CW, Lee SH
2396 - 2400	At-wavelength characterization of the extreme ultraviolet Engineering Test Stand Set-2 optic Naulleau P, Goldberg KA, Anderson EH, Batson P, Denham PE, Jackson KH, Gullikson EM, Rekawa S, Bokor J
2401 - 2405	High sensitivity actinic detection of native defects on extreme ultraviolet lithography mask blanks Yi MS, Haga T, Walton C, Bokor J
2406 - 2411	Observation of speckle patterns in extreme ultraviolet imaging Solak HH, Yang Y, Cerrina F
2412 - 2415	Fabrication of parallel-plate nanomirror arrays for extreme ultraviolet maskless lithography Shroff Y, Chen YJ, Oldham W
2416 - 2422	Recent progress in 1X x-ray mask technology: Feasibility study using ASET-NIST format TaXN x-ray masks with 100 nm rule 4 Gbit dynamic random access memory test patterns Tsuboi S, Tanaka Y, Iwamoto T, Sumitani H, Nakayama Y
2423 - 2427	Can proximity x-ray lithography print 35 nm features? Yes Khan M, Han G, Tsvid G, Kitayama T, Maldonado J, Cerrina F
2428 - 2433	Technique for 25 nm x-ray nanolithography Toyota E, Hori T, Khan M, Cerrina F
2434 - 2438	Focusing x-ray masks for printing very narrow features Feldman M, Khan M, Cerrina F
2439 - 2443	Effect of secondary electron from the substrate in x-ray lithography using harder radiation spectra Itoga K, Marumoto K, Kitayama T, Sumitani H, Amemiya M, Watanabe Y
2444 - 2447	Compact synchrotron radiation lithography system for 70 nm device manufacturing Miyatake T, Li X, Hirose S, Monzen T, Fujii K, Suzuki K
2448 - 2454	Evaluation of new x-ray stepper, the XRA Sumitani H, Suita M, Mitsui S, Aoyama H, Fujii K, Watanabe H, Taguchi T, Matsui Y
2455 - 2458	High-throughput electron-beam lithography with a raster-scanned, variably shaped beam Veneklasen LH, Kao HM, Rishton SA, Winter S, Boegli V, Newman T, Bertuccelli G, Howard G, Le P, Tan Z, Lozes R
2459 - 2467	PREVAIL-EPL alpha tool: Early results Golladay SD, Pfeiffer HC, Bohnenkamp CA, Dhaliwal RS, Enichen WA, Gordon MS, Kendall RA, Lieberman JE, Stickel W, Rockrohr JD, Tressler EV, Tanimoto A, Yamaguchi T, Okamoto K, Suzuki K, Miura T, Okino T, Kawata S, Morita K, Suzuki SC, Shimizu H, Kojima S, Varnell G, Novak WT, Sogard M
2468 - 2473	Direct measurement of Coulomb effects in electron beam projection lithography Yahiro T, Suzuki S, Irita T, Hirayanagi N, Shimizu H, Kojima S, Morita K, Kawata S, Okino T, Suzuki K
2474 - 2477	Experimental study of electron beam projection lithography mask defect printability Kojima Y, Katakura N, Tomo Y, Takenaka H, Yoshida A, Shimizu I, Yamabe M
2478 - 2482	Mask split algorithm for stencil mask in electron projection lithography Yamashita H, Takeuchi K, Masaoka H
2483 - 2487	Proximity effect correction using pattern shape modification and area density map for electron-beam projection lithography Osawa M, Takahashi K, Sato M, Arimoto H, Ogino K, Hoshino H, Machida Y
2488 - 2493	Comparative study of resolution limiting factors in electron beam lithography using the edge roughness evaluation method Yoshizawa M, Moriya S
2494 - 2498	Effect of resist sensitivity ratio on T-gate fabrication Chen Y, Macintyre DS, Thoms S
2499 - 2503	Performance of the Raith 150 electron-beam lithography system Goodberlet JG, Hastings JT, Smith HI
2504 - 2507	Influence of sub-100 nm scattering on high-energy electron beam lithography Anderson EH, Olynick DL, Chao WL, Harteneck B, Veklerov E
2508 - 2511	Energy deposition and transfer in electron-beam lithography Wu B, Neureuther AR
2512 - 2515	Mark detection in low-energy electron-beam lithography Fritz GS, Kern DP
2516 - 2519	Simulation of time-dependent charging of resist on Si under electron-beam irradiation Kotera M
2520 - 2524	Characterization of a process development tool for ion projection lithography Loeschner H, Stengl G, Kaesmaier R, Wolter A
2525 - 2528	Direct patterning of nanometer-scale silicide structures by focused ion-beam implantation through a thin barrier layer Mitan MM, Pivin DP, Alford TL, Mayer JW
2529 - 2532	Ion beam aperture-array lithography Ruchhoeft P, Wolfe JC
2533 - 2538	Limitations of focused ion beam nanomachining Lehrer C, Frey L, Petersen S, Ryssel H
2539 - 2542	Chemically enhanced focused ion beam micromachining of copper Gonzalez JC, Griffis DP, Miau TT, Russell PE
2543 - 2546	Contact resistance of focused ion beam deposited platinum and tungsten films to silicon DeMarco AJ, Melngailis J
2547 - 2550	GaN focused ion beam micromachining with gas-assisted etching Chyr I, Steckl AJ
2551 - 2554	Mg-Ga liquid metal ion source for implantation doping of GaN Cheng J, Steckl AJ
2555 - 2565	Outline of a variable-axis lens with arbitrary shift of the axis in one direction Schmid P, Rose H
2566 - 2571	Electron-electron interactions in multibeam lithography columns Mankos M, Sagle A, Coyle ST, Fernandez A
2572 - 2580	Stochastic Coulomb interaction effect in ion-neutralized electron-beam projection optics Takahashi K, Han LQ, Pease RF, Meisburger WD
2581 - 2584	Progress toward a high-brightness photoemission source for multiple-electron beam lithography Coyle ST, Fernandez A, Janaway G, Sagle A, Mankos M
2585 - 2590	Recent tests of negative electron affinity photocathodes as source for electron lithography and microscopy Arcuni P, Presley S, Aebi V, Spicer WE
2591 - 2597	Stability improvement at high emission densities for gold thin film photocathodes used in advanced electron beam lithography Gosavi S, McCarthy JM, House JL, van Mast BGS, Janaway G, Berglund CN
2598 - 2601	Microfabricated field emission devices using carbon nanofibers as cathode elements Guillorn MA, Melechko AV, Merkulov VI, Ellis ED, Simpson ML, Baylor LR, Bordonaro GJ
2602 - 2606	Characterization of multicusp-plasma ion source brightness using micron-scale apertures Scott KL, King TJ, Leung KN, Pease RF
2607 - 2611	Wave optical calculations of electron probes Rafferty B, Groves TR
2612 - 2616	Review of progress in extreme ultraviolet lithography masks Hector S, Mangat P
2617 - 2620	Optical-constant tunable (ZrO2)(x)/(Cr2O3)(y)/(Al2O3)(1-x-y) optical superlattices for attenuated phase shift mask in ArF lithography Lai FD, Wang LA
2621 - 2625	Prediction of placement error of extreme ultraviolet lithography mask by simulation model with equivalent layout pattern Chiba A, Hoshino B, Takahashi M, Yamanashi H, Hoko H, Lee BT, Yoneda T, Ito M, Ogawa T, Okazaki S
2626 - 2630	Predicting pattern-specific distortions induced during optical mask patterning Sohn J, Engelstad RL, Lovell EG
2631 - 2634	Distortion correction in adaptive membrane masks Zhuang X, Feldman M
2635 - 2640	Writing, repairing, and inspecting of extreme ultraviolet lithography reticles considering the impact of the materials Wasson JR, Lu B, Mangat PJS, Nordquist K, Resnick DJ
2641 - 2645	Thermomechanical distortions of the PREVAIL mask system during exposure Lee PT, Martin C, Engelstad R, Lovell EG, Robinson C, Flamholz A
2646 - 2651	Simulating the response of electron-beam projection lithography masks under standardized mounting techniques Chen CF, Engelstad RL, Lovell EG, Novembre AE
2652 - 2658	Simulating the effects of pattern density gradients on electron-beam projection lithography pattern transfer distortions Reu PL, Engelstad RL, Lovell EG, Magg CK, Lercel MJ, Mackay RS
2659 - 2664	Pattern placement correction methodology for 200 mm SCALPEL masks Ocola LE, Farrow RC, Kasica RJ, Caminos CG, Rutberg L, Fullowan RF, Teffeau K, Blakey MI, Peabody ML, Knurek CS, Bogart GR, Novembre AE, Liddle JA, Lercel M, Magg C, Collins K, Trybendis M, Cadwell N, Jeffer R, Dauksher WJ, Resnick DJ, Mancini D, Han SI, Masnyj Z, Smith K, Mangat PJS
2665 - 2670	Mechanical, geometrical, and electrical characterization of silicon membranes for open stencil masks Sossna E, Degen A, Rangelow IW, Drzik M, Hudek P, Tiwald TE, Woollam JA
2671 - 2677	Patterning-induced image placement distortions on electron beam projection lithography membrane masks Lercel M, Magg C, Lawliss M, Williams C, Caldwell N, Ackel R, Kindt L, Racette K, Reu P, Engelstad R, Mackay S
2678 - 2684	Development of 157 nm positive resists Ito H, Wallraff GM, Fender N, Brock PJ, Hinsberg WD, Mahorowala A, Larson CE, Truong HD, Breyta G, Allen RD
2685 - 2689	Characterization and modeling of volumetric and mechanical properties for step and flash imprint lithography photopolymers Colburn M, Suez I, Choi BJ, Meissl M, Bailey T, Sreenivasan SV, Ekerdt JG, Willson CG
2690 - 2693	Thin film confinement effects on the thermal properties of model photoresist polymers Soles CL, Lin EK, Lenhart JL, Jones RL, Wu WL, Goldfarb DL, Angelopoulos M
2694 - 2698	Characterization and simulation of surface and line-edge roughness in photoresists Constandoudis V, Gogolides E, Patsis GP, Tserepi A, Valamontes ES
2699 - 2704	Confinement effects on the spatial extent of the reaction front in ultrathin chemically amplified photoresists Goldfarb DL, Angelopoulos M, Lin EK, Jones RL, Soles CL, Lenhart JL, Wu WL
2705 - 2708	Characterization of fluoropolymers for 157 nm chemically amplified resist Itani T, Toriumi M, Naito T, Ishikawa S, Miyoshi S, Yamazaki T, Watanabe M
2709 - 2712	Supercritical resist drying for isolated nanoline formation Namatsu H
2713 - 2716	Linewidth reduction using liquid ashing for sub-100 nm critical dimensions with 248 nm lithography Timko AG, Frackoviak J, Hopkins LC, Klemens FP, Trimble LE, Nalamasu O, Watson GP, Mansfield WM, Barr D, Li J
2717 - 2722	Hands-on tools for nanotechnology Seeger A, Paulson S, Falvo M, Helser A, Taylor RM, Superfine R, Washburn S
2723 - 2726	"NANOJET": Tool for the nanofabrication Rangelow IW, Voigt J, Edinger K
2727 - 2731	Investigation of radical-surface reactions Voigt J, Rangelow IW
2732 - 2735	Electron induced chemical nanolithography with self-assembled monolayers Geyer W, Stadler V, Eck W, Golzhauser A, Grunze M, Sauer M, Weimann T, Hinze P
2736 - 2740	Electrostatic self assembly of nanocomposite polymers in grating structures Cheng X, Guo LJ
2741 - 2744	Lithographically induced self-assembly of microstructures with a liquid-filled gap between the mask and polymer surface Deshpande P, Chou SY
2745 - 2748	Nanoscale modification of electronic states of graphite by highly charged Ar-ion irradiation Meguro T, Hida A, Suzuki M, Koguchi Y, Takai H, Yamamoto Y, Maeda K, Aoyagi Y
2749 - 2752	High-Q photonic crystal microcavities fabricated in a thin GaAs membrane Reese C, Gayral B, Gerardot BD, Imamoglu A, Petroff PM, Hu E
2753 - 2756	Patterning processes for fabricating sub-100 nm pseudo-spin valve structures Vogeli B, Smith HI, Castano FJ, Haratani S, Hao YW, Ross CA
2757 - 2760	Infrared frequency selective surfaces fabricated using optical lithography and phase-shift masks Spector SJ, Astolfi DK, Doran SP, Lyszczarz TM, Raynolds JE
2761 - 2765	Focused ion beam patterned Hall bars and Ohmic columns embedded in molecular-beam-epitaxial-grown GaAs/AlGaAs Vijendran S, See P, Ahmed A, Beere HE, Jones GAC, Norman CE
2766 - 2769	New photon detector for device analysis: Superconducting single-photon detector based on a hot electron effect Somani S, Kasapi S, Wilsher K, Lo W, Sobolewski R, Gol'tsman G
2770 - 2774	Fabrication of single and coupled quantum dots in single-wall carbon nanotubes Suzuki M, Ishibashi K, Ida T, Tsuya D, Toratani K, Aoyagi Y
2775 - 2778	Nanofabrication of two-dimensional photonic crystal mirrors for 1.5 mu m short cavity lasers Happ TD, Markard A, Kamp M, Forchel A, Anand S, Gentner JL, Bouadma N
2779 - 2783	Nanoimprint lithography of high-density cobalt dot patterns for fine tuning of dipole interactions Natali M, Lebib A, Cambril E, Chen Y, Prejbeanu IL, Ounadjela K
2784 - 2788	Nanoscale patterning using self-assembled polymers for semiconductor applications Guarini KW, Black CT, Milkove KR, Sandstrom RL
2789 - 2792	Field emission emitter array with a self-aligned volcano-type gate: Fabrication and characterization Ivanov T, Rangelow IW, Biehl S, Chakarov IR
2793 - 2796	Induced crystallization as a nonlithographic pattern transfer technique for nanofabrication Cabral MJ, Lye WK, Bean JC, Reed ML, Chraska T, Mesarovic SD, Hull R, Phillips AB
2797 - 2800	Fabrication of T gate structures by nanoimprint lithography Macintyre DS, Chen Y, Lim D, Thoms S
2801 - 2805	Room temperature replication in spin on glass by nanoimprint technology Matsui S, Igaku Y, Ishigaki H, Fujita J, Ishida M, Ochiai Y, Komuro M, Hiroshima H
2806 - 2810	Step and flash imprint lithography: Defect analysis Bailey T, Smith B, Choi BJ, Colburn M, Meissl M, Sreenivasan SV, Ekerdt JG, Willson CG
2811 - 2815	Study of the resist deformation in nanoimprint lithography Hirai Y, Fujiwara M, Okuno T, Tanaka Y, Endo M, Irie S, Nakagawa K, Sasago M
2816 - 2819	Fabrication of large area 100 nm pitch grating by spatial frequency doubling and nanoimprint lithography for subwavelength optical applications Yu ZN, Wu W, Chen L, Chou SY
2820 - 2824	Photolithographic patterning of proteins with photoresists processable under biocompatible conditions Douvas A, Argitis P, Diakoumakos CD, Misiakos K, Dimotikali D, Kakabakos SE
2825 - 2828	Single cell detection with micromechanical oscillators Ilic B, Czaplewski D, Zalalutdinov M, Craighead HG, Neuzil P, Campagnolo C, Batt C
2829 - 2833	Dual exposure glass layer suspended structures: A simplified fabrication process for suspended nanostructures on planar substrates Tanenbaum DM, Olkhovets A, Sekaric L
2834 - 2837	Observation and characteristics of mechanical vibration in three-dimensional nanostructures and pillars grown by focused ion beam chemical vapor deposition Fujita J, Ishida M, Sakamoto T, Ochiai Y, Kaito T, Matsui S
2838 - 2841	Photoelectrochemical undercut etching for fabrication of GaN microelectromechanical systems Stonas AR, MacDonald NC, Turner KL, DenBaars SP, Hu EL
2842 - 2845	Heat-depolymerizable polycarbonates as electron beam patternable sacrificial layers for nanofluidics Harnett CK, Coates GW, Craighead HG
2846 - 2851	Fabrication of microfluidic devices in silicon and plastic using plasma etching Weston DF, Smekal T, Rhine DB, Blackwell J
2852 - 2855	Electron beam inspection system based on the projection imaging electron microscope Miyoshi M, Yamazaki Y, Nagahama I, Onishi A, Okumura K
2856 - 2860	Novel high resolution scanning thermal probe Edinger K, Gotszalk T, Rangelow IW
2861 - 2863	Optical mask metrology for next generation lithography Vollrath W, Schluter G, Scheuring G
2864 - 2868	Contactless testing of wiring networks by an electron beam system utilizing induced current detection Golladay SD
2869 - 2873	Alignment system using voltage contrast images for low-energy electron-beam lithography Nakasugi T, Ando A, Sugihara K, Yamazaki Y, Miyoshi M, Okumura K
2874 - 2877	Thermal conductivity measurements of thin-film resist Chu DC, Touzelbaev M, Goodson KE, Babin S, Pease RF
2878 - 2883	Subresolution placement using infrared image alignment to the computer-aided design database for backside probing and editing Sengupta M, Sinha M, Dajee G, Tsao CC
2884 - 2889	Critical dimension error analysis for 0.13 mu m photolithography and beyond Gau TS, Yen A, Chen JH, Yu SS, Chen CK, Ke CM, Lin BJ, Wang PTC
2890 - 2895	Resist line edge roughness and aerial image contrast Shin J, Han G, Ma Y, Moloni K, Cerrina F
2896 - 2900	Substrate cooling efficiency during cryogenic inductively coupled plasma polymer etching for diffractive optics on membranes Olynick DL, Anderson EH, Harteneck B, Veklerov E
2901 - 2905	High speed, dry etching of Fe for integration of magnetic devices in microelectronics Andriesse MSP, van der Drift E, Sloof WG
2906 - 2910	Cr absorber etch process for extreme ultraviolet lithography mask fabrication Smith KH, Wasson JR, Mangat PJS, Dauksher WJ, Resnick DJ
2911 - 2916	High-resolution nitride etching using hydrogen implantation effect Ezaki M, Kato Y, Tojo T
2917 - 2920	Inductively coupled plasma etching of GaN and its effect on electrical characteristics Rong B, van der Drift E, Reeves RJ, Sloof WG, Cheung R
2921 - 2925	Modeling and development of a deep silicon etch process for 200 mm election projection lithography mask fabrication Dauksher WJ, Clemens SB, Resnick DJ, Smith KH, Mangat PJS, Rauf S, Ventzek PLG, Ashraf H, Lea L, Hall S, Johnston IR, Hopkins J, Chambers A, Bhardwaj JK
2926 - 2929	Plasma-induced damage study for n-GaN using inductively coupled plasma reactive ion etching Khan FA, Zhou L, Kumar V, Adesida I
2930 - 2934	Balancing the etching and passivation in time-multiplexed deep dry etching of silicon Blaw MA, Zijlstra T, van der Drift E