| 3 - 3 |
A long way to go
Sambale H |
| 22 - 22 |
Greater efficiency in offset printing
van de Weg E |
| 24 - 27 |
Plastics processing in transition
Wilden H |
| 28 - 30 |
Campus database - Chemical resistance now incorporated
Lindner A, Monsheimer S, Shastri R, Ayglon D, Heylen T, Maurer G, Laumen K, Wende A |
| 32 - 32 |
Pre-computing developments
Michaeli W, Pfannschmidt O, Franz A, Vogt N |
| 40 - 40 |
Mass production of hot-embossed MIDs
Pohlau F |
| 44 - 44 |
Injection moulding technology for fast-running machines
Kamps T, Wortberg J, Neumann M |
| 51 - 51 |
Expansion injection moulding in thin-wall technology
Pokorny P |
| 56 - 56 |
Materials with accurate characteristics profiles
Hunold D |
| 58 - 60 |
High-end extrusion control
Hammer P |
| 62 - 64 |
Welding of large semifinished products
Tuchert C, Bonten C, Gehde M |
| 74 - 76 |
Cyclic shear stress-strain loading of adhesive layers
Munch M, Schlimmer M |
| 78 - 78 |
Choice of vacuum pumps
Werthebach J |
| 80 - 83 |
Absorption of water by PMMA and PC
Lehmann J |
| 84 - 85 |
Non-contact filament testing
Griese G |
| 86 - 90 |
GRP parts - FEM computation of dynamic behaviour
Glaser S |
| 92 - 95 |
Thermoplastic sandwich structure components formed in a single step
Nowacki J, Mitschang P, Neitzel M, Lehner EA, Hoecker F |
| 96 - 99 |
PTFE polyamide compounds
Hupfer B, Reinhardt G, Geissler U, Kunze K |
| 100 - 100 |
Laser-welded air intake
Schulten S, Grosser U |
| 103 - 103 |
High-temperature IMD ink system
Kowalski P |
