| 1 - 1 |
6th symposium of the Korean Society of Thermophysical Properties (KSTP Symposium 6) - 27-28 April 2006 - Convention Center, Seoul, Korea -Preface
Jeong YH, Yang HS, Lee SM |
| 2 - 6 |
Specific heat of a YCrO3 single crystal as investigated by a Si-N membrane based microcalorimeter
Kim JW, Oh YS, Suh KS, Park YD, Kim KH |
| 7 - 10 |
Effect of changing rate of residual stress on thermal expansion behavior of magnesium borate whisker-reinforced aluminum composite
Wu PL, Tian Z, Wang LD, Fei WD |
| 11 - 15 |
Measurement of thermal properties of microfluidic samples using laser point heating thermometry
Choi SR, Kim D |
| 16 - 20 |
Thermal diffusivity of samarium-gadolinium zirconate solid solutions
Pan W, Wan CL, Xu Q, Wang JD, Qu ZX |
| 21 - 25 |
Thermal analysis of LED array system with heat pipe
Kim L, Choi JH, Jang SH, Shin MW |
| 26 - 29 |
Thermal characterization of liquids and pastes using the flash technique
Blumm J, Lindemann A, Min S |
| 30 - 33 |
Improvement of specific heat measurement by the flash method
Kim SK, Kim YJ |
| 34 - 39 |
Estimations of local heat release rate in the methane-air premixed flames
Choi GM, Yang JS, Kim DJ, Tanahashi M, Miyauchi T |
| 40 - 45 |
Measuring thermophysical properties of gases with a single thermocouple: Peltier vacuum gauge
Jung DH, Moon IK, Yun YJ, Park CD, Chung SM, Jeong YH |
| 46 - 49 |
A new laser flash system for measurement of the thermophysical properties
Min S, Blumm J, Lindemann A |
| 50 - 54 |
Interfacial effect on thermal conductivity of Y2O3 thin films deposited on Al2O3
Yang HS, Kim JW, Park GH, Kim CS, Kyhm K, Kim SR, Kim KC, Hong KS |
| 55 - 59 |
Measurement of the thermal conductivity of TiO2 thin films by using the thermo-reflectance method
Mun J, Kim SW, Kato R, Hatta I, Lee SH, Kang KH |
| 60 - 65 |
The measurements of thermal diffusivity dependent on temperature for pure metals by the new photothermal displacement configuration
Lee KJ, Kang JW, Jeon PS, Kim HJ, Yoo J |
| 66 - 69 |
Study of thermal conductivity of nanofluids for the application of heat transfer fluids
Yoo DH, Hong KS, Yang HS |
| 70 - 74 |
Stability and thermal conductivity characteristics of nanofluids
Hwang Y, Lee JK, Lee CH, Jung YM, Cheong SI, Lee CG, Ku BC, Jang SP |
| 75 - 79 |
An experimental study on thermal properties of composite insulation
Choi GS, Kang JS, Jeong YS, Lee SE, Sohn JY |
| 80 - 85 |
Densification kinetics of MnO-doped UO2-10wt%Gd2O3 compact
Rhee YW, Kim KS, Song KW |
| 86 - 89 |
Effect of rapid sintering on the densification and the thermal diffusivity of Li2TiO3 pellet
Rhee YW, Yang JH, Kim KS, Kang KW, Song KW, Kim DJ |
| 90 - 94 |
A case study on how to maintain confidence of thermal properties test: Thermal conductivity of building insulation materials
Jeong YS, Choi GS, Kang JS, Lee SE, Huh JH |
| 95 - 99 |
Thermal analysis of high power GaN-based LEDs with ceramic package
Yang LQ, Jang SH, Hwang WJ, Shin MW |
| 100 - 104 |
Measurement of the thermal properties of gadolinium and dysprosium titanate
Lee BH, Kim HS, Lee SH, Sohn DS |
| 105 - 108 |
Oxidation behavior of titanium alloy under diffusion bonding
Lee HS, Yoon JH, Yi YM |
| 109 - 113 |
The compressive creep behavior of (U, Ce)O-2
Na SH, Kim KH, Kim YK, Kang KH, Ryu MJ |
| 114 - 118 |
Uncertainty assessment for the thermal expansion of simulated fuel via the Monte Carlo method
Park CJ, Kang KH, Song KC, Yang MS |
| 119 - 122 |
Effect of frit size on microwave properties of glass-ceramic in low temperature co-fired ceramics
Hwang S, Kim H |
| 123 - 128 |
Effects of solid fission products forming dissolved oxide (Nd) and metallic precipitate (Ru) on the thermal conductivity of uranium base oxide fuel
Kim DJ, Yang JH, Kim JH, Rhee YW, Kang KW, Kim KS, Song KW |
| 129 - 133 |
Oxidation behavior of the simulated fuel with dissolved fission products in air at 573-873 K
Kang KH, Na SH, Song KC, Lee SH, Kim SW |
| 134 - 137 |
The solidus and liquidus temperatures of UO2-Gd2O3 and UO2-Er2O3 fuels
Kang KW, Yang JH, Kim JH, Rhee YW, Kim DJ, Kim KS, Song KW |
| 138 - 147 |
The role of salt in nanoparticle generation by salt-assisted aerosol method: Microstructural changes
Lee SG, Choi SM, Lee D |
| 148 - 155 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
Lee WS, Han IY, Yu J, Kim SJ, Byun KY |
