1 - 5 |
Highly Transparent and Conductive ZrO-In2O3 Thin-Films Prepared by DC Magnetron Sputtering Minami T, Kakumu T, Takeda Y, Takata S |
6 - 9 |
Transparent-Conductive Indium Tin Oxide-Films Fabricated by Atmospheric RF Plasma Deposition Technique Lee DH, Moss RW, Vuong KD, Dietrich M, Condrate RA, Wang XW |
10 - 12 |
Influence of a Parallel Electric-Field on the Conductivity of a Growing Indium Oxide Film Alterkop B, Parkansky N, Boxman RL, Goldsmith S |
13 - 17 |
CdS Thin-Film Deposition by CW Nd-YAG Laser Trujillo O, Moss R, Vuong KD, Lee DH, Noble R, Finnigan D, Orloff S, Tenpas E, Park C, Fagan J, Wang XW |
18 - 22 |
A Study on the Double Insulating Layer for HgCdTe MIS Structure Jung JW, Lee HC, Wang JS |
23 - 29 |
Optical Reflectance Reduction of Textured Silicon Surfaces Coated with an Antireflective Thin-Film Kolesar ES, Bright VM, Sowders DM |
30 - 33 |
Thermochromism of Rapid Thermal Annealed VO2 and Sn-Doped VO2 Thin-Films Lee MH, Kim MG, Song HK |
34 - 39 |
Residual-Stress in Silicon Dioxide Thin-Films Produced by Ion-Assisted Deposition Robic JY, Leplan H, Pauleau Y, Rafin B |
40 - 45 |
The Calculation of Thin-Film Parameters from Spectroscopic Ellipsometry Data Jellison GE |
46 - 50 |
Real-Time Control of the Growth of Silicon Alloy Multilayers by Multiwavelength Ellipsometry Kildemo M, Deniau S, Bulkin P, Drevillon B |
51 - 56 |
An Algorithm for Analyzing Ellipsometric Data Taken with Multiple Angles of Incidence Comfort JC, Urban FK, Barton D |
57 - 62 |
Multilayer Reference Coatings for Depth Profile Standards Beck U, Reiners G, Wirth T, Hoffmann V, Prassler F |
63 - 67 |
A New Method for Fabricating Transparent Barrier Layers Affinito JD, Gross ME, Coronado CA, Graff GL, Greenwell EN, Martin PM |
68 - 73 |
Improvement of the Adhesion of Silica Layers to Polypropylene Induced by Nitrogen Plasma Treatment Vallon S, Hofrichter A, Drevillon B, Klembergsapieha JE, Martinu L, Poncinepaillard F |
74 - 79 |
Relaxation of Mechanical-Stress in Polyimide Films by Softbaking Bhattacharya PK, Bhosale KS |
80 - 83 |
Electron-Beam Deposition of ZrO2-ZnO Films Qadri SB, Skelton EF, Lubitz P, Nguyen NV, Khan HR |
84 - 87 |
Transparent ZnO-Al Films Prepared by Cosputtering of ZnO-Al with Either a Zn or an Al Target Tominaga K, Kataoka M, Manabe H, Ueda T, Mori I |
88 - 93 |
Influence of Oxygen on Some Oxide-Films Prepared by Ion-Beam Sputter-Deposition Lee CC, Wei DT, Hsu JC, Shen CH |
94 - 98 |
Synthesis and Characterization of Amorphous-Carbon Nitride Films Holloway BC, Shuh DK, Kelly MA, Tong W, Carlisle JA, Jimenez I, Sutherland DG, Terminello LJ, Pianetta P, Hagstrom S |
99 - 102 |
The Effect of Annealing on the Structure of Cathodic Are Deposited Amorphous-Carbon Nitride Films Mcculloch DG, Merchant AR |
XI - XI |
Papers Presented at the 23rd International-Conference on Metallurgical Coatings and Thin-Films, San-Diego, Ca, USA, April 22-26, 1996 - Preface Sartwell BD, Mcguire GE, Jehn HA, Petrov I |
103 - 106 |
Investigation of Carbon Nitride Films by Cathodic Arc Evaporation Chhowalla M, Alexandrou I, Kiely C, Amaratunga GA, Aharonov R, Fontana RF |
107 - 111 |
Ion-Beam Deposited Carbon Nitride Films - Characterization and Identification of Chemical Sputtering Hammer P, Baker MA, Lenardi C, Gissler W |
112 - 119 |
Plasma Diagnostic Studies to the Carbon Nitride Film Deposition by Reactive RF Magnetron Sputtering Kaltofen R, Sebald T, Weise G |
120 - 125 |
Synthesis of Cubic Boron-Nitride Films Using a Helicon Wave Plasma and Reduction of Compressive Stress Kim IH, Kim KS, Kim SH, Lee SR |
126 - 130 |
Transformation of Sp(3) to Sp(2) Sites of Diamond-Like Carbon Coatings During Friction in Vacuum and Under Water-Vapor Environment Lehuu T, Zaidi H, Paulmier D, Voumard P |
131 - 135 |
Heteroepitaxial Nucleation of Diamond by Bias Pretreatment in an Electron-Cyclotron-Resonance Microwave Chemical-Vapor-Deposition System Marechal N, Yamashita S |
136 - 142 |
Lattice Disorder and Texture in Diamond Coatings Deposited by Hfcvd on Co-Cemented Tungsten Carbide Scardi P, Veneri S, Leoni M, Polini R, Traversa E |
143 - 147 |
Optical-Emission Spectroscopy of the Plasma During CVD Diamond Growth with Nitrogen Addition Vandevelde T, Nesladek M, Quaeyhaegens C, Stals L |
148 - 152 |
Structural Phase-Transitions of Carbon Observed with Photoelectron-Spectroscopy Reinke P, Francz G, Oelhafen P |
153 - 156 |
Investigation of the Field-Emission Current from Polycrystalline Diamond Films Glesener JW, Morrish AA |
157 - 160 |
Fabrication of Freestanding Diamond Membranes Salvadori MC, Cattani M, Mammana V, Monteiro OR, Ager JW, Brown IG |
161 - 164 |
Effect of the Cyclic Growth/Etching Time Ratio on the (100)-Oriented Texture Growth of a Diamond Film Kim SH, Park YS, Han IT, Yun WS, Lee JW |
165 - 170 |
High-Sensitivity Thermal Sensors on Insulating Diamond Denisenko AV, Zaitsev AM, Melnikov AA, Werner M, Fahrner WR |
171 - 175 |
Field-Emission Behavior of (Nitrogen Incorporated) Diamond-Like Carbon-Films Lee KR, Eun KY, Lee S, Jeon DR |
176 - 180 |
Enhanced Electron-Emission from Phosphorus-Doped and Boron-Doped Diamond-Clad Si Field Emitter Arrays Ku TK, Chen SH, Yang CD, She NJ, Tarntair FG, Wang CC, Chen CF, Hsieh IJ, Cheng HC |
181 - 185 |
Epitaxial-Growth of Beta-SiC Thin-Films Using bis-Trimethylsilylmethane on Si(100) with a Polycrystalline Buffer Layer Bahng W, Kim HJ |
186 - 189 |
Enhanced Diffusion of C in Fe Under CVD Diamond Deposition Conditions Weiser PS, Prawer S, Jamieson DN, Manory RR |
190 - 195 |
Field-Emission Observations from CVD Diamond-Coated Silicon Emitters Raiko V, Spitzl R, Aschermann B, Theirich D, Engemann J, Pupeter N, Habermann T, Muller G |
196 - 199 |
Chemical-Vapor-Deposition of Diamond at Low Substrate Temperatures Using Fluorinated Precursors Hentschel F, Schmidt I, Benndorf C |
200 - 205 |
Fe-C-H-Film Growth by Plasma-Assisted CVD from Organometallic Precursors Luithardt W, Benndorf C |
206 - 210 |
Nanoscale Mechanical Property Measurements Using Modified Atomic Forte Microscopy Kulkarni AV, Bhushan B |
211 - 215 |
Molecular-Dynamics Investigations of the Effects of Debris Molecules on the Friction and Wear of Diamond Perry MD, Harrison JA |
216 - 220 |
Measurement of the Hardness of Hard Coatings Using a Force Indentation Function Friedrich C, Berg G, Broszeit E, Berger C |
221 - 225 |
Local Yield Map of Hard Coating with an Interlayer Under Sliding Contact Diao DF |
226 - 231 |
Characterization of Tin Films Deposited Onto Stainless-Steel Strips by Continuous Dry-Coating Process Arezzo F, Gimondo P, Hashimoto M, Ono N, Takahashi T |
232 - 237 |
Mechanical-Properties of Hard W-C Physically Vapor-Deposited Coatings in Monolayer and Multilayer Configuration Juliet P, Rouzaud A, Aabadi K, Mongecadet P, Pauleau Y |
238 - 242 |
The Ultimate Vacuum Pressure and the Characteristics of Sputtered Coatings Cavaleiro A, Vieira MT, Ramos F, Dias JP |
243 - 247 |
Effects of Deflection on Bulge Test Measurements of Enhanced Modulus in Multilayered Films Jankowski AF, Tsakalakos T |
248 - 253 |
Residual-Stress and in-Situ Thermal-Stress Measurement of Aluminum Film Deposited on Silicon-Wafer Kusaka K, Hanabusa T, Nishida M, Inoko F |
254 - 259 |
Origins of the Residual-Stress in CVD Diamond Films Kuo CT, Lin CR, Lien HM |
260 - 263 |
Effect of a Plasma Protection Net on Residual-Stress in AlN Films Deposited by a Magnetron Sputtering System Kusaka K, Hanabusa T, Tominaga K |
264 - 270 |
In-Situ Ir Ellipsometry Study of the Adhesion and Growth of Plasma-Deposited Silica Thin-Films on Stainless-Steel Substrates Bertrand N, Drevillon B, Klembergsapieha JE, Martinu L |
271 - 277 |
Nondestructive Evaluation of Thin-Film Coatings Using a Laser-Induced Surface Thermal Lensing Effect Wu ZL, Kuo PK, Lu YS, Gu ST, Krupka R |
278 - 282 |
Optical and Calorimetric Evaluation of Z-93-P and Other Thermal Control Coatings Jaworske DA |
283 - 288 |
The in-Situ Characterization of Metal-Film Resistance During Deposition Rycroft IM, Evans BL |
289 - 293 |
Spectrophotometric Study of Oxide-Growth on Are Evaporated Tin and Zrn Coatings During Hot Air Oxidation Tests Luridiana S, Miotello A |
294 - 298 |
Impulsive Stimulated Thermal Scattering for Sub-Micron-Thickness Film Characterization Maznev AA, Nelson KA, Yagi T |
299 - 304 |
Filtered Cathodic Vacuum-Arc (Fcva) Deposition of Thin-Film Silicon Bilek MM, Milne WI |
305 - 311 |
Nondestructive Characterization and Evaluation of Thin-Films by Laser-Induced Ultrasonic Surface-Waves Schneider D, Tucker MD |
312 - 316 |
Comparison of Atomic-Force Microscope and Rutherford Backscattering Spectrometry Data of Nanometer-Size Zinc Islands Tabet MF, Urban FK |
317 - 322 |
The Structure of Tetrahedral Amorphous-Carbon Thin-Films Silva SR, Xu S, Tay BK, Tan HS, Scheibe HJ, Chhowalla M, Milne WI |
323 - 327 |
XPS Investigation of Ti-O Containing Diamond-Like Carbon-Films Muller U, Hauert R |
328 - 333 |
Pretreatment of GaAs(001) for Sulfur Passivation with (NH4)(2)S-X Kang MG, Park HH, Suh KS, Lee JL |
334 - 338 |
Valence-Band Photoemission-Study of the Ti-Mo-N System Sanjines R, Wiemer C, Almeida J, Levy F |
339 - 342 |
Study on DC Magnetron Sputter-Deposition of Titanium Aluminum Nitride Thin-Films - Effect of Aluminum Content on Coating Wuhrer R, Yeung WY, Phillips MR, Mccredie G |
343 - 347 |
Corrosion Behavior of Hybrid Coatings Brandl W, Gendig C |
348 - 354 |
Localized Micro-Hardness Measurements with a Combined Scanning Force Microscope/Nanoindentation System Randall NX, Christoph R, Droz S, Juliaschmutz C |
355 - 361 |
STM and XPS Study of Filtered Vacuum-Arc Deposited Sn-O Films Kaplan L, Rusman I, Boxman RL, Goldsmith S, Nathan M, Benjacob E |
362 - 366 |
Modeling and Finite-Element Analysis of Ultra-Microhardness Indentation of Thin-Films Gan L, Bennissan B, Bendavid A |
367 - 369 |
Effect of Oxygen Plasma-Etching on Adhesion Between Polyimide Films and Metal Nakamura Y, Suzuki Y, Watanabe Y |
370 - 375 |
Influence of Ni-P Electroless Coating on the Fatigue Behavior of Plain Carbon-Steels Puchi ES, Staia MH, Hintermann H, Pertuz A, Chitty J |
376 - 380 |
Study by X-Ray Photoelectron-Spectroscopy and X-Ray-Diffraction of the Growth of Tin Thin-Films Obtained by Nitridation of Ti Layers Santucci S, Lozzi L, Passacantando M, Picozzi P, Alfonsetti R, Diamanti R, Moccia G |
381 - 385 |
Plasma Wall Interaction for TiNx Film Deposition in a Hollow-Cathode Arc-Discharge Eggs C, Kersten H, Wagner HE, Wulff H |
386 - 389 |
Deposition of Titanium in a Hollow-Cathode Arc-Discharge - Correlation Between Deposition Conditions and Film Properties Steffen H, Eggs C, Kersten H |
390 - 394 |
Studies of Phase-Transformations in Some Metal Phthalocyanine Thin-Films Using Measurements of Current as a Function of Temperature Shihub SI, Gould RD |
395 - 400 |
Physical-Properties of CdTe-Sb Thin-Films Picosvega A, Ramirezbon R, Espinozabeltran FJ, Zelayaangel O, Alvarezfregoso O, Mendozaalvarez JG |
401 - 405 |
Aging Effects of Thin-Films Prepared by Ion-Beam-Assisted Deposition - A Multitechnique Characterization Beghi MG, Bottani CE, Calliari L, Bonelli M, Miotello A, Ossi PM, Kovac J, Scarel G, Sancrotti M |
406 - 410 |
Modeling of Selective Tungsten Low-Pressure Chemical-Vapor-Deposition Kuijlaars KJ, Kleijn CR, Vandenakker HE |
411 - 416 |
Encapsulation of Silver by Nitridation of Ag-Ti Alloy Bilayer Structures Laursen T, Adams D, Alford TL, Tu KN, Deng F, Morton R, Lau SS |
417 - 421 |
Effects of Au Overlayers on the Electrical and Morphological-Characteristics of Pd/Sn Ohmic Contacts to N-GaAs Islam MS, Mcnally PJ, Cameron DC, Herbert PA |
422 - 426 |
Optimization of SiO2 Film Conformality in Teos/O-3 APCVD Yuan Z, Mokhtari S, Ferdinand A, Eakin J, Bartholomew L |
427 - 434 |
Plasma and Surface Diagnostics During Plasma-Enhanced Chemical-Vapor-Deposition of SiO2 from SiH4/O-2/Ar Discharges Han SM, Aydil ES |
435 - 439 |
Multilevel Interconnects for Heterojunction Bipolar-Transistor Integrated-Circuit Technologies Patrizi GA, Lovejoy ML, Enquist PM, Schneider RP, Hou HQ |
440 - 446 |
Tantalum Pentoxide for Advanced DRAM Applications Mckinley KA, Sandler NP |
447 - 452 |
The Addition of Surfactant to Slurry for Polymer CMP - Effects on Polymer Surface, Removal Rate and Underlying Cu Neirynck JM, Yang GR, Murarka SP, Gutmann RJ |
453 - 457 |
Chemical-Mechanical Polishing of PECVD Silicon-Nitride Hu YZ, Yang GR, Chow TP, Gutmann RJ |
458 - 463 |
Effects of Mechanical Characteristics on the Chemical-Mechanical Polishing of Dielectric Thin-Films Tseng WT, Liu CW, Dai BT, Yeh CF |
464 - 468 |
Crystallization of Amorphous SiGe Thin-Films Tong HY, King TJ, Shi FG |
469 - 472 |
TiSi2 Phase-Transformation Characteristics on Narrow Devices Miles GL, Mann RW, Bertsch JE |
473 - 476 |
Materials Aspects of Ti and Co Silicidation of Narrow Polysilicon Lines Kittl JA, Hong QZ |
477 - 484 |
Prediction of Silicide Formation and Stability Using Heats of Formation Pretorius R |
485 - 492 |
Evaluation of Barriers for B-Diffusion and P-Diffusion into as-Doped Polysilicon Naeem MD, Parks C, Wangemann K, Glawischnig H |
493 - 496 |
Nigew Ohmic Contacts on GaAs Heterostructure Epitaxial Layers Huang JH, Tehrani S, Durlam M, Martinez MJ, Schirmann E, Cody N |
497 - 502 |
A Low-Resistance Pd/Ge/Ti/Au Ohmic Contact to a High-Low Doped GaAs Field-Effect Transistor Kwak JS, Baik HK, Lee JL, Park CG, Kim H, Suh KS |
503 - 507 |
Adhesion Studies of GaAs-Based Ohmic Contact and Bond Pad Metallization Seigal PK, Briggs RD, Rieger DJ, Baca AG, Howard AJ |
508 - 512 |
A Study of P-Type Ohmic Contacts to InAlAs/InGaAs Heterostructures Briggs RD, Howard AJ, Baca AG, Hafich MJ, Vawter GA |
513 - 517 |
Thin-Film Tantalum Nitride Resistor Technology for Phosphide-Based Optoelectronics Lovejoy ML, Patrizi GA, Rieger DJ, Barbour JC |
518 - 524 |
Quantitative Investigation of Copper/Indium Multilayer Thin-Film Reactions Lindahl KA, Moore JJ, Olson DL, Noufi R, Lanning B |
525 - 530 |
Formation of Iron Silicides on Si(110) by Reactive Deposition Epitaxy Wu J, Shimizu S |