233 - 233 |
Composite interfaces - Preface Nomura M |
235 - 245 |
Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications Ikegawa N, Hamada H, Yamanouchi M |
247 - 258 |
Static and dynamic properties of unidirectional CFRP laminates with flexible interphase Nishiwaki T, Tange A, Kitagawa K, Hamada H |
259 - 272 |
Adhesion between polyethylene molding and metal surface-modified with silane coupling agents by use of polyethylene gels Fujimatsu H, Iyo K, Usami H, Ogasawara S, Kajiwara K |
273 - 287 |
Mechanical properties of poly(vinyl chloride)/silane-treated glass beads composite: effects of organofunctional group and alkoxy group numbers of silane coupling agent Nagata K, Nigo H, Nakamura Y, Okumura H, Nishimura A, Tobita Y, Iida T, Yositani H, Nishino T |
289 - 308 |
Effect of matrix yield properties on fragmentation behavior of single fiber composites Zhao FM, Okabe T, Takeda N |
309 - 318 |
Temperature dependence of the stress transfer for thermal resistance polymer composites by X-ray diffraction Kotera M, Nishino T, Nakamae K |