A1 - A4 |
A sodium-ion cell based on the fluorophosphate compound NaVPO4F Barker J, Saidi MY, Swoyer JL |
A5 - A8 |
Online monitoring of anode outlet CO concentration in PEM fuel cells Zhang JX, Datta R |
A9 - A12 |
Phase relationships and structural and chemical stabilities of charged Li1-xCoO2-delta and Li1-xNi0.85Co0.15O2-delta cathodes Venkatraman S, Shin Y, Manthiram A |
C1 - C3 |
Electron beam induced writing of corrosion protection Sieber I, Hildebrand H, Djenizian T, Schmuki P |
C4 - C7 |
Electrochemical etching of individual multiwall carbon nanotubes Ito T, Sun L, Crooks RM |
C8 - C11 |
Electroplating of copper conductive layer on the electroless-plating copper seed layer Hara T, Kamijima S, Shimura Y |
F1 - F3 |
Reduction of oxygen plasma damage by postdeposition helium plasma treatment for carbon-doped silicon oxide low dielectric constant films Wang YH, Gui D, Kumar R, Foo PD |
F4 - F7 |
The synergistic effect of N-2/H-2 gases in the plasma passivation of siloxane-based low-k polymer films Chen ST, Chen GS, Yang TJ, Chang TC, Yang WH |
G1 - G3 |
Effect of gate electrode structure on gate oxide integrity Ryu HH, Cha HS, Lee JG |
G4 - G6 |
Influence of PECVD of SiO2 passivation layers on 4H-SiC Schottky rectifiers Nigam S, Kim J, Ren F, Chung G, MacMillan MF, Pearton SJ |
G7 - G11 |
R and C impedance components equivalent to the charge distribution within Si-substrate depletion layer Chemla M, Bertagna V, Erre R, Rouelle F, Petitdidier S, Levy D |
H1 - H3 |
Fabrication process and characterization of a novel structural isomer sensor - Molecularly imprinted overoxidized polypyrrole film Shiigi H, Okamura K, Kijima D, Hironaka A, Deore B, Sree U, Nagaoka T |
A13 - A15 |
Electrochemical intercalation of lithium ion within graphite from propylene carbonate solutions Jeong SK, Inaba M, Iriyama Y, Abe T, Ogumi Z |
A16 - A18 |
High capacity surface-modified LiCoO2 cathodes for lithium-ion batteries Kannan AM, Rabenberg L, Manthiram A |
A19 - A22 |
Microemulsion synthesis of tin oxide-graphite nanocomposites as negative electrode materials for lithium-ion batteries Wang Y, Lee JY, Chen BH |
C12 - C15 |
The effect of NH3 plasma treatment on the electroless copper deposition on TaNx (x=0=1) diffusion barriers Hong SW, Lee YS, Park JW |
G12 - G15 |
Angular dependence of etch rate of a silsesquioxane-based low dielectric constant material in fluorocarbon plasmas Hwang SW, Lee GR, Min JH, Moon SH |
G16 - G18 |
Metal induced lateral crystallization of amorphous silicon through a silicon nitride cap layer Choi JH, Kim DY, Choo BK, Sohn WS, Jang J |