D89 - D91 |
Selective enhancement of SiO2 etch rate by ar-ion implantation for improved etch depth control Sun X, Lu Q, Takeuchi H, Balasubramanian S, Liu TJK |
D92 - D94 |
Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film Yokoshima T, Yamaji Y, Oosato H, Tamura Y, Kikuchi K, Nakagawa H, Aoyagi M |
G63 - G67 |
Electrochemical impedance spectroscopy of dense silica and porous silicon oxycarbide Cherif KSA, Kordic S, Farkas J, Szunerits S |
K39 - K41 |
High-efficiency blue organic light-emitting diodes using C-60 as a surface modifier on indium tin oxide Kim SH, Jang J, Yoon JH, Lee JY |
P23 - P25 |
Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride-based thermoelements and copper Liao CN, Lee CH, Chen WJ |
A199 - A203 |
Stabilizing cyclability of an aqueous lithium-ion battery LiNi1/3Co1/3O2/LixV2O5 by polyaniline coating on the anode Wang HB, Huang KL, Zeng YQ, Zhao FG, Chen LQ |
A204 - A207 |
Characterization of nanosize molybdenum trisulfide for lithium batteries and MoS3 structure confirmation via electrochemistry Wang J, Ng SH, Chew SY, Wexler D, Wang GX, Liu HK |
A208 - A211 |
A nonflammable lithium polymer battery with high performance for elevated temperature applications Bakenov Z, Nakayama M, Wakihara M |
A212 - A215 |
Opening mechanism of closed graphitized tips via low-temperature surface fluorination Groult H, Nakajima T, Tressaud A, Shibata S, Durand E, Perrigaud L, Warmont F |
A216 - A219 |
Effects of triacetoxyvinylsilane as SEI layer additive on electrochemical performance of lithium metal secondary battery Lee YM, Seo JE, Lee YG, Lee SH, Cho KY, Park JK |
A220 - A224 |
Substituted MxCu6-xSn5 compounds (M = Fe, Co, Ni, Zn) designing multicomponent intermetallic electrodes for lithium batteries Vaughey JT, Owejan J, Thackeray MM |
A225 - A227 |
Implication of liquid-phase deposited amorphous RuO2 electrode for electrochemical supercapacitor Lee W, Mane RS, Todkar VV, Lee S, Egorova O, Chae WS, Han SH |
A228 - A231 |
Suppression of Mn dissolution in spinel cathodes by trapping the protons within layered oxide cathodes Manthiram A, Choi W |
B135 - B138 |
Ceria nanocoating for sulfur tolerant Ni-based anodes of solid oxide fuel cells Kurokawa H, Sholklapper TZ, Jacobson CP, De Jonghe LC, Visco SJ |
B139 - B141 |
Nanoporous Ni-Fe bimetallic plates for nonfragile, reliable SOFCs Yan JW, Enoki M, Matsumoto H, Ishihara T |
B142 - B146 |
Single PEMFC design and validation for high-temperature MEA testing and diagnosis up to 300 degrees C Tang YH, Zhang JL, Song CJ, Zhang JJ |
B147 - B149 |
Carbon nanotube-supported platinum electrode for ORR in phosphoric acid solution - Effect of PTFE content and annealing temperature Paschos O, Knupp SL, Choi P, Snyder J, Buelte SJ, Merchant N, Qi ZG, Haldar P |
B150 - B154 |
The impact of Ru contamination of a Pt/C electrocatalyst on its oxygen-reducing activity Gancs L, Hult BN, Hakim N, Mukerjee S |
B155 - B160 |
Dynamic flow field for fuel cells Wilkinson DP, Blanco M, Zhao H, Wu J, Wang H |
H243 - H247 |
Composite polymer core-silica shell abrasives effect of polishing time and slurry solid content on oxide CMP Armini S, Whelan CM, Moinpour M, Maex K |
H248 - H250 |
Fabrication and characterization of p-n homojunctions in cuprous oxide by electrochemical deposition Wang LC, Tao M |
H251 - H253 |
Multiple self-aligned iron nanowires by a dual selective chemical vapor deposition process Bien DCS, Bain MF, Low YH, Mitchell NSJ, Armstrong MB, Gamble HS |
H254 - H256 |
Formation of Sb-doped SnO2 p-type ohmic contact for near-UV GaN-based LEDs by a CIO interlayer Hong HG, Song JO, Na H, Kim H, Kim KK, Seong TY |
H257 - H259 |
ALD refill of nanometer-scale gaps with high-kappa dielectric for advanced CMOS technologies Lee D, Seidel T, Dalton J, Liu TJK |
H260 - H263 |
Catalytic effect of Pt on Ni(Pt)-Si-O solid-state reaction Wei R, Dongzhi C |
H264 - H266 |
Influence of F+ co-implants on EOR defect formation in B+-implanted, ultrashallow junctions Boninelli S, Cristiano F, Lerch W, Paul S, Cowern NEB |
H267 - H269 |
Room-temperature-deposited indium-zinc oxide thin films with controlled conductivity Lim W, Wang YL, Ren F, Norton DP, Kravchenko II, Zavada JM, Pearton SJ |
H270 - H272 |
In/ITO p-type electrode for high-brightness GaN-based light emitting diodes Song JO, Kim KK, Kim H, Hong HG, Na H, Seong TY |
H273 - H277 |
A simple method for measurement of photoacid generator photoreaction kinetics in formulated, chemically amplified photoresist films Lee CT, Yueh W, Roberts J, Henderson CL |
H278 - H280 |
Improvement in positive-bias-temperature-instabilities reliability and device performance of TaSiN/ HfSiON gate stacks with high temperature post-nitridation annealing Kamiyama S, Miura T, Nara Y |
H281 - H283 |
Dynamic threshold switching behavior of Ge2Sb2Te5 and sb-doped Ge2Sb2Te5 thin films using scanning electrical nanoprobe Zhou P, Shin YC, Choi BJ, Choi S, Hwang CS, Lin YY, Lv HB, Yan XJ, Tang TA, Chen LY, Chen BM |
H284 - H286 |
Characterization of photoconductive amorphous Si : H films for photoconducting sensor applications Phuong NM, Seong NJ, Ahn JK, Kim ET, Lee JH, Kim GH, Yoon SG |
J101 - J104 |
A method to fabricate field emitters using electroless codeposited composite of MWNTs and nickel Liu YM, Sung Y, Chen YC, Lin CT, Chou YH, Ger MD |
J105 - J107 |
A comparative study of SiCN/si and SiCN/SiCN junctions for high-temperature ultraviolet detecting applications Chou TH, Fang YK, Yang CY, Chiang YT, Shie JS, Chien CC |
J108 - J112 |
Fabrication and characterization of a microsensor for detecting simultaneously both earth's magnetic field and acceleration Cho JM, Kim KS, An S, Lee SY, Kim SW |