D9 - D11 |
Electrochemical behavior of fluorinated boron-doped diamond Sine G, Ouattara L, Panizza M, Comninellis C |
A171 - A173 |
Advanced fuel cell catalysts - Sulfonation of carbon-supported catalysts using 2-aminoethanesulfonic acid Xu ZQ, Qi ZG, Kaufman A |
A174 - A177 |
High performance electrode for medium-temperature solid oxide fuel cells - Mixed conducting ceria-based anode with highly dispersed Ni electrocatalysts Uchida H, Suzuki S, Watanabe M |
A178 - A179 |
Metal-supported solid oxide fuel cells Villarreal I, Jacobson C, Leming A, Matus Y, Visco S, De Jonghe L |
A180 - A182 |
Comparison of the thermal stability of lithiated graphite in LiBOB EC/DEC and in LiPF6 EC/DEC Jiang J, Dahn JR |
A183 - A186 |
Electrochemical and ex situ X-ray study of Li-(Li0.2Ni0.2Mn0.6)O-2 cathode material for Li secondary batteries Kang SH, Sun YK, Amine K |
A187 - A189 |
All solid-state photoelectrochemical cell with RbAg4I5 as the electrolyte Ohta N, Takada K, Sasaki T, Watanabe M |
A190 - A193 |
Nanocrystalline ferric oxide cathode for rechargeable lithium batteries Xu JJ, Jain G |
A194 - A197 |
Highly reversible lithium storage in nanostructured silicon Graetz J, Ahn CC, Yazami R, Fultz B |
A198 - A201 |
High capacity, reversible silicon thin-film anodes for lithium-ion batteries Maranchi JP, Hepp AF, Kumta PN |
A202 - A206 |
Surface chemistry of carbon-treated LiFePO4 particles for Li-ion battery cathodes studied by PES Herstedt M, Stjerndahl M, Nyten A, Gustafsson T, Rensmo H, Siegbahn H, Ravet N, Armand M, Thomas JO, Edstrom K |
C117 - C119 |
Ruthenium film with high nuclear density deposited by MOCVD using a novel liquid precursor Shibutami T, Kawano K, Oshima N, Yokoyama S, Funakubo H |
C120 - C122 |
Effect of oxygen flow rate on microstructural and ferromagnetic properties of Ti1-xCoxO2 thin films grown by liquid-delivery MOCVD Seong NJ, Yoon SG |
C123 - C125 |
Characteristics of DC reactively sputtered (Ti,Zr)N thin films as diffusion barriers for Cu metallization Kuo YL, Lee C, Lin JC, Peng CH, Chen LC, Hsieh CH, Shue SL, Liang MS, Daniels BJ, Huang CL, Lai CH |
C126 - C129 |
Effects of CH2F2 addition on a high aspect ratio contact hole etching in a C4F6 /O-2/Ar plasma Ryu HK, Lee BS, Park SK, Kim IW, Kim CK |
C130 - C133 |
Reaction mechanism studies on atomic layer deposition of ruthenium and platinum Aaltonen T, Rahtu A, Ritala M, Leskela M |
C134 - C136 |
Interactions between brightener and chloride ions on copper electroplating for laser-drilled via-hole filling Dow WP, Huang HS, Lin Z |
C137 - C140 |
Electrodeposition of sulfur from sulfide contaminated brines Ateya BG, AlKharafi FM, Al-Azab AS |
G113 - G116 |
Influence of N,N'-dimethylpropyleneurea content in polyaniline on electrical characteristics and device performance Ramamurthy PC, Harrell WR, Gregory RV |