화학공학소재연구정보센터

Electrochemical and Solid State Letters

Electrochemical and Solid State Letters, Vol.6, No.9 Entire volume, number list
ISSN: 1099-0062 (Print) 

In this Issue (19 articles)

D9 - D11 Electrochemical behavior of fluorinated boron-doped diamond
Sine G, Ouattara L, Panizza M, Comninellis C
A171 - A173 Advanced fuel cell catalysts - Sulfonation of carbon-supported catalysts using 2-aminoethanesulfonic acid
Xu ZQ, Qi ZG, Kaufman A
A174 - A177 High performance electrode for medium-temperature solid oxide fuel cells - Mixed conducting ceria-based anode with highly dispersed Ni electrocatalysts
Uchida H, Suzuki S, Watanabe M
A178 - A179 Metal-supported solid oxide fuel cells
Villarreal I, Jacobson C, Leming A, Matus Y, Visco S, De Jonghe L
A180 - A182 Comparison of the thermal stability of lithiated graphite in LiBOB EC/DEC and in LiPF6 EC/DEC
Jiang J, Dahn JR
A183 - A186 Electrochemical and ex situ X-ray study of Li-(Li0.2Ni0.2Mn0.6)O-2 cathode material for Li secondary batteries
Kang SH, Sun YK, Amine K
A187 - A189 All solid-state photoelectrochemical cell with RbAg4I5 as the electrolyte
Ohta N, Takada K, Sasaki T, Watanabe M
A190 - A193 Nanocrystalline ferric oxide cathode for rechargeable lithium batteries
Xu JJ, Jain G
A194 - A197 Highly reversible lithium storage in nanostructured silicon
Graetz J, Ahn CC, Yazami R, Fultz B
A198 - A201 High capacity, reversible silicon thin-film anodes for lithium-ion batteries
Maranchi JP, Hepp AF, Kumta PN
A202 - A206 Surface chemistry of carbon-treated LiFePO4 particles for Li-ion battery cathodes studied by PES
Herstedt M, Stjerndahl M, Nyten A, Gustafsson T, Rensmo H, Siegbahn H, Ravet N, Armand M, Thomas JO, Edstrom K
C117 - C119 Ruthenium film with high nuclear density deposited by MOCVD using a novel liquid precursor
Shibutami T, Kawano K, Oshima N, Yokoyama S, Funakubo H
C120 - C122 Effect of oxygen flow rate on microstructural and ferromagnetic properties of Ti1-xCoxO2 thin films grown by liquid-delivery MOCVD
Seong NJ, Yoon SG
C123 - C125 Characteristics of DC reactively sputtered (Ti,Zr)N thin films as diffusion barriers for Cu metallization
Kuo YL, Lee C, Lin JC, Peng CH, Chen LC, Hsieh CH, Shue SL, Liang MS, Daniels BJ, Huang CL, Lai CH
C126 - C129 Effects of CH2F2 addition on a high aspect ratio contact hole etching in a C4F6 /O-2/Ar plasma
Ryu HK, Lee BS, Park SK, Kim IW, Kim CK
C130 - C133 Reaction mechanism studies on atomic layer deposition of ruthenium and platinum
Aaltonen T, Rahtu A, Ritala M, Leskela M
C134 - C136 Interactions between brightener and chloride ions on copper electroplating for laser-drilled via-hole filling
Dow WP, Huang HS, Lin Z
C137 - C140 Electrodeposition of sulfur from sulfide contaminated brines
Ateya BG, AlKharafi FM, Al-Azab AS
G113 - G116 Influence of N,N'-dimethylpropyleneurea content in polyaniline on electrical characteristics and device performance
Ramamurthy PC, Harrell WR, Gregory RV